Optoelectronic Semiconductor Component
    12.
    发明申请
    Optoelectronic Semiconductor Component 有权
    光电半导体元件

    公开(公告)号:US20150319814A1

    公开(公告)日:2015-11-05

    申请号:US14443989

    申请日:2013-11-21

    CPC classification number: H01L27/15 H05B33/0803 H05B33/0815 H05B33/083

    Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

    Abstract translation: 光电子半导体部件包括具有用于产生辐射或用于接收辐射的活动区域的第一功能区域和适于有助于驱动第一功能区域的第二功能区域。 第一功能区域和第二功能区域集成在相同的载体基板上。

    Radiation emitting device
    13.
    发明授权

    公开(公告)号:US10582585B2

    公开(公告)日:2020-03-03

    申请号:US16256879

    申请日:2019-01-24

    Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.

    Radiation Emitting Device
    14.
    发明申请

    公开(公告)号:US20190230763A1

    公开(公告)日:2019-07-25

    申请号:US16256879

    申请日:2019-01-24

    Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.

    RADIATION-EMITTING SEMICONDUCTOR DEVICE
    17.
    发明申请
    RADIATION-EMITTING SEMICONDUCTOR DEVICE 审中-公开
    辐射发射半导体器件

    公开(公告)号:US20160218253A1

    公开(公告)日:2016-07-28

    申请号:US15090028

    申请日:2016-04-04

    Inventor: Michael Wittmann

    Abstract: A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.

    Abstract translation: 辐射发射半导体器件包括具有芯片安装区域的壳体主体,芯片连接区域,辐射发射半导体芯片和光吸收材料,其中发射半导体芯片固定到芯片连接区域, 芯片连接区域在芯片连接区域未被辐射发射半导体芯片覆盖的选定位置处被光吸收材料覆盖,发光半导体芯片在选定位置没有光吸收材料, 壳体具有其中布置有至少一个辐射发射半导体芯片的空腔,芯片安装区域是与壳体接合的表面,并且芯片安装区域没有光吸收材料 所选位置远离芯片连接区域。

Patent Agency Ranking