公开(公告)号：US10276762B2

公开(公告)日：2019-04-30

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/56

CPC classification number: H01L33/58 ,  E05F15/40 ,  E05F15/73 ,  E05F2015/765 ,  E05Y2400/54 ,  E05Y2800/352 ,  E05Y2900/10 ,  E06B9/11 ,  E06B9/171 ,  E06B2009/6836 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/44 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

公开(公告)号：US09991428B2

公开(公告)日：2018-06-05

申请号：US14889653

申请日：2013-05-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Juergen Holz ,  Michael Zitzlsperger

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0091

Abstract: An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.

公开(公告)号：US09882097B2

公开(公告)日：2018-01-30

申请号：US15227287

申请日：2016-08-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Eisert ,  Torsten Baade ,  Michael Zitzlsperger

IPC: H01L33/50 ,  H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/52 ,  H01L33/06 ,  H01L33/28 ,  H01L33/32 ,  H01L33/48

CPC classification number: H01L33/502 ,  H01L33/06 ,  H01L33/28 ,  H01L33/32 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/505 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaving free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is absorbent and/or reflective and/or scattering for the primary radiation.

公开(公告)号：US09614134B2

公开(公告)日：2017-04-04

申请号：US14783255

申请日：2014-04-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Christian Ziereis ,  Michael Zitzlsperger

IPC: H01L33/56 ,  H01L25/00 ,  H01L25/075 ,  H01L33/08 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/08 ,  H01L33/48 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.

公开(公告)号：US20160380172A1

公开(公告)日：2016-12-29

申请号：US15039861

申请日：2014-11-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Brandl ,  Stefan Groetsch ,  Tobias Gebuhr ,  Michael Zitzlsperger ,  Thomas Schwarz

IPC: H01L33/62 ,  F21S8/10 ,  H01L25/075

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S43/14 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each of the electrical components have at least two electrical terminal contacts and the components arranged next to one another are mechanically connected to one another by an adhesive arranged between the components, and the component arrangement is designed for the individual components of the component arrangement to be applied together to a circuit carrier.

Abstract translation: 各种实施例可以涉及具有在产品配置中彼此相邻布置的至少两个电气部件的部件布置。 每个电气部件具有至少两个电气端子触点，并且彼此相邻布置的部件通过布置在部件之间的粘合剂彼此机械连接，并且部件布置被设计用于部件布置的各个部件为 一起应用于电路载体。

公开(公告)号：US09520539B2

公开(公告)日：2016-12-13

申请号：US14784879

申请日：2014-04-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Michael Zitzlsperger

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/483 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.

Abstract translation: 光电子部件包括塑料壳体，其中第一引线框架部分嵌入到塑料壳体中，第一引线框架部分的芯片着陆面和焊接接触面至少部分地不被塑料壳体覆盖，焊接接触面具有 凹槽，并且凹槽不被塑料外壳的材料覆盖。

公开(公告)号：US09490397B2

公开(公告)日：2016-11-08

申请号：US14654500

申请日：2013-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stephan Preuβ ,  Michael Zitzlsperger ,  Caroline Kistner

IPC: H01L29/49 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L23/00 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.

Abstract translation: 规定了制造光电薄膜芯片半导体器件的方法。 导体结构被施加在载体上，并且多个光电半导体芯片布置在导体结构之间。 每个光电半导体芯片包括在顶侧的层。 此外，建立了半导体芯片和导体结构之间的电连接，例如使用接合线。 半导体芯片和导体结构被成型体包围。 成型体在远离载体的顶侧不会突出超过光电子半导体芯片。 此外，移除载体，并且通过模制包围的半导体芯片被分割。

公开(公告)号：US20160240756A1

公开(公告)日：2016-08-18

申请号：US15022573

申请日：2014-09-18

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Zitzlsperger ,  Christian Ziereis ,  Tobias Gebuhr

IPC: H01L33/62 ,  H01L33/54 ,  H01L21/66 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L22/14 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.

Abstract translation: 光电子部件包括壳体，其包括塑料材料和至少部分地嵌入在塑料材料中的第一引线框架部分，第一凹部和第二凹部，其中第一引线框架部分的上侧的第一上部部分不是 在第一凹部中由塑料材料覆盖，第一引线框架部分的上侧的第二上部部分不被第二凹部中的塑料材料覆盖，第一凹部和第二凹部彼此分开一个 在第一凹部中配置光电子半导体芯片，在第二凹部内不设置光电子半导体芯片。

公开(公告)号：US20150221585A1

公开(公告)日：2015-08-06

申请号：US14423835

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

公开(公告)号：US20140299911A1

公开(公告)日：2014-10-09

申请号：US14356554

申请日：2012-12-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger

IPC: H01L33/62 ,  H01L23/00 ,  H01L23/60 ,  H01L21/66

CPC classification number: H01L33/62 ,  H01L22/14 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/60 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing a packaged component is disclosed. In one embodiment, a lead frame composite has first lead frame parts, second lead frame parts and test contacts, electrically connecting via first electrical connections the first lead frame parts to the other first lead frame parts. A potting body is formed on the lead frame composite thereby mechanically connecting the first lead frame parts to the second lead frame parts and encapsulating the first electrical connections. First semiconductor components are placed on the first lead frame parts after forming the potting body. The first semiconductor components are electrically connected to the second lead frame parts via second electrical connections. The first semiconductor components are electrically tested at the test contacts prior to singulating the lead frame composite and the potting body. The lead frame composite and the potting body are singulated thereby forming the packaged semiconductor components.

Abstract translation: 公开了一种制造封装件的方法。 在一个实施例中，引线框架复合材料具有第一引线框架部件，第二引线框架部件和测试触点，通过第一电连接将第一引线框架部件电连接到其它第一引线框架部件。 在引线框架复合体上形成灌封体，从而将第一引线框架部件机械地连接到第二引线框架部件并封装第一电连接。 第一半导体部件在形成灌封体之后放置在第一引线框架部件上。 第一半导体部件经由第二电连接与第二引线框部件电连接。 在分离引线框架复合材料和灌封体之前，在测试触点处对第一半导体部件进行电测试。 引线框架复合体和灌封体被分割，从而形成封装的半导体部件。