公开(公告)号：US11742221B2

公开(公告)日：2023-08-29

申请号：US17376369

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Min Shin ,  Seok-Hoon Kim ,  Young-Hoo Kim ,  In-Gi Kim ,  Tae-Hong Kim ,  Sung-Hyun Park ,  Jin-Woo Lee ,  Ji-Hoon Cha ,  Yong-Jun Choi

IPC: H01L21/67 ,  H01L21/02 ,  H01J37/32 ,  G02B27/09 ,  B23K26/352 ,  B08B7/00 ,  H01L29/66 ,  H10B41/27 ,  H10B43/27

CPC classification number: H01L21/67034 ,  B08B7/0042 ,  B23K26/352 ,  G02B27/0955 ,  H01J37/3244 ,  H01J37/32568 ,  H01L21/02098 ,  H01J2237/335 ,  H01L29/66545 ,  H01L29/66795 ,  H10B41/27 ,  H10B43/27

Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

公开(公告)号：US11605545B2

公开(公告)日：2023-03-14

申请号：US16692051

申请日：2019-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hun Jae Jang ,  Seung Min Shin ,  Seok Hoon Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Jinwoo Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC: H01L21/67 ,  B08B7/00

Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

公开(公告)号：US20200335361A1

公开(公告)日：2020-10-22

申请号：US16692051

申请日：2019-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hun Jae JANG ,  Seung Min Shin ,  Seok Hoon Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Jinwoo Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC: H01L21/67 ,  B08B7/00

Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

公开(公告)号：US10388537B2

公开(公告)日：2019-08-20

申请号：US15428963

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung Kim ,  Tae-Hong Kim ,  Jung-Min Oh ,  Yungjun Kim ,  Ingi Kim ,  Boun Yoon ,  Hyosan Lee ,  Sol Han

IPC: B08B3/02 ,  H01L21/306 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02 ,  H01L21/67

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

公开(公告)号：US09343432B2

公开(公告)日：2016-05-17

申请号：US14094996

申请日：2013-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chung-Sun Lee ,  Jung-Hwan Kim ,  Tae-Hong Kim ,  Hyun-Jung Song ,  Sun-Pil Youn

IPC: H01L23/48 ,  H01L21/82 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/81 ,  H01L2224/83

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip.

Abstract translation: 公开了一叠半导体芯片，半导体器件和制造方法。 堆叠的半导体芯片可以包括堆叠的第一芯片，第一芯片上的堆叠的第二芯片，导电凸块，均匀的整体底部填充材料和模制材料。 导电凸块可以在第一芯片的上表面和第二芯片的下表面之间延伸。 均匀整体的底部填充材料可以插入在第一芯片和第二芯片之间，封装导电凸块，并且沿着第二芯片的侧壁延伸。 均匀整体的底部填充材料可以具有在与第二芯片的上表面平行的方向上延伸并且位于第二芯片的上表面附近的上表面。 模制材料可以在第一芯片的上表面之上的均匀整体底部填充材料的外侧表面上，其中，从第一横截面轮廓的角度来看，模制材料通过均匀的积分与第二芯片的侧壁分离 底部填充材料，使得模制材料不接触第二芯片的侧壁。

公开(公告)号：US20150204001A1

公开(公告)日：2015-07-23

申请号：US14594435

申请日：2015-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SNU R&DB FOUNDATION

Inventor： Myung-Seob SONG ,  Dae Wook Park ,  Soon Cheol Kweon ,  Seung Kyung Park ,  Ho-Young Kim ,  Tae-Hong Kim ,  Junhee Choi

IPC: D06F35/00

CPC classification number: D06F35/002 ,  D06F17/10 ,  D06F19/00 ,  D06F37/266

Abstract: A washing machine includes a tub; a drum rotatably disposed inside the tub; and an ultrasound generator configured to emit ultrasonic waves to washing water loaded in the drum, and to generate bubbles. The ultrasound generator applies ultrasonic energy to the washing water to cause chaotic oscillation of the bubbles.

Abstract translation: 洗衣机包括浴缸; 可旋转地设置在所述桶内的滚筒; 以及超声波发生器，被配置为发射超声波以洗涤装载在所述滚筒中的水并产生气泡。 超声波发生器对洗涤水施加超声能量，引起气泡的混乱振荡。