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25 条记录 (耗时 0.038 秒)

    Semiconductor package and printed wiring board for semiconductor package
    15.
    发明授权
    Semiconductor package and printed wiring board for semiconductor package 失效
    用于半导体封装的半导体封装和印刷电路板

    公开(公告)号：US06534873B1

    公开(公告)日：2003-03-18

    申请号：US09655785

    申请日：2000-09-06

    申请人： Yoshizumi Sato ,  Kenji Sasaoka

    发明人： Yoshizumi Sato ,  Kenji Sasaoka

    IPC分类号： H01L2348

    CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： A ground pattern (12) and power supply pattern (13) which are formed on the surface of a printed wiring board (10) are connected to a ground layer (21) and power supply layer (22) formed as the internal layers via bumps (24a, 24b). The ground pattern (12) need not be connected to the ground layer (21) by uniformly plating the inner side surface of a cavity (43), contributing to an increase in yield and a decrease in cost. When a power supply pattern (13) is to be connected to a power supply layer (22) using through holes, the power supply pattern (13) must be spaced apart from signal pins (14) detouring the region where the through holes are to be formed. However, the distance between the power supply pattern and the signal pins can.be reduced by using bumps. The distance between a semiconductor chip (41) and the signal pins (14) can be reduced to improve the electrical characteristics.

    摘要翻译： 形成在印刷电路板（10）的表面上的接地图案（12）和电源图案（13）通过凸块连接到形成为内层的接地层（21）和电源层（22） （24a，24b）。 接地图案（12）不需要通过均匀地电镀空腔（43）的内侧表面而连接到接地层（21），有助于提高产量并降低成本。 当使用通孔将电源图案（13）连接到电源层（22）时，电源模式（13）必须与通孔所在区域的信号引脚（14）间隔开， 形成。 然而，通过使用凸块来减小电源图案和信号引脚之间的距离。 可以减小半导体芯片（41）和信号引脚（14）之间的距离，以改善电气特性。

    Wiring board with a built-in component and method for manufacturing the same
    16.
    发明授权
    Wiring board with a built-in component and method for manufacturing the same 有权
    具有内置组件的接线板及其制造方法

    公开(公告)号：US08737085B2

    公开(公告)日：2014-05-27

    申请号：US12299861

    申请日：2006-05-24

    申请人： Kenji Sasaoka

    发明人： Kenji Sasaoka

    IPC分类号： H05K1/18

    CPC分类号： H05K3/4632 ,  H05K1/0366 ,  H05K1/186 ,  H05K1/188 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10636 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1189 ,  Y02P70/611 ,  Y10T29/4913

    摘要： Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.

    摘要翻译： 公开了具有内置部件的布线板及其制造方法，所述布线板包括：布线图案; 与所述布线图案的表面电气机械连接的电气/电子部件; 并且形成在与所述电气/电子部件的所述布线图案的同一表面上的绝缘层被连接并构造成嵌入所述电气/电子部件，所述绝缘层具有绝缘树脂和包含在绝缘树脂中的增强材料， 其中所述绝缘层的增强材料存在于所述绝缘树脂中，而不会在横向方向上到达所述电气/电子部件的区域，并且其中所述绝缘层的绝缘树脂到达所述电子/电子部件以便粘附到所述电气 /电子元件。