公开(公告)号：US11655379B2

公开(公告)日：2023-05-23

申请号：US17182814

申请日：2021-02-23

Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA

Inventor： Guoyun Zhou ,  Yan Hong ,  Jiujuan Li ,  Wei He ,  Yuanming Chen ,  Shouxu Wang ,  Dainan Zhang ,  Chong Wang

IPC: C09D5/24 ,  C09D165/00 ,  C25D3/38 ,  C25D21/10 ,  C25D5/56 ,  C08G73/02 ,  C08K3/08

CPC classification number: C09D5/24 ,  C08G73/0266 ,  C09D165/00 ,  C25D3/38 ,  C25D5/56 ,  C25D21/10 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2201/001

Abstract: A composite conductive polymer, a preparation method thereof and application thereof are disclosed, wherein a mixed solution A is used in the preparation process of the composite conductive polymer, which comprises the following two components: (i) a strong oxidant selected from at least one of permanganate, persulfate, dichromate and perchlorate; (ii) an oxidizing agent containing a metal ion capable of being reduced to elementary substance. The preparation process is simple and easy to operate, with low cost and favorable environmental protection and the obtained composite conductive polymer containing metal in elementary form, has good film-forming property and the film thereof can completely cover the surface of the insulating substrate, with excellent electrical conductivity, which therefore can be widely used in electroplating materials and semiconductor materials and other fields.

公开(公告)号：US20230142163A1

公开(公告)日：2023-05-11

申请号：US18152089

申请日：2023-01-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Yu Tsai ,  Ku-Feng Yang ,  Wen-Chih Chiou

IPC: C25D21/04 ,  C25D7/12 ,  C25D17/00 ,  C25D17/08 ,  C25D21/10 ,  H01L21/768

CPC classification number: C25D21/04 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  C25D21/10 ,  H01L21/7684 ,  H01L21/76898

Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

公开(公告)号：US20180274116A1

公开(公告)日：2018-09-27

申请号：US15925490

申请日：2018-03-19

Applicant: EBARA CORPORATION

Inventor： Mitsuhiro SHAMOTO ,  Masashi SHIMOYAMA

IPC: C25D3/38 ,  C25D5/18 ,  C25D17/00 ,  C25D17/12 ,  C25D7/12 ,  H05K3/24 ,  H01L21/288 ,  H01L21/768 ,  C25D21/10 ,  C25D21/08

CPC classification number: C25D3/38 ,  C25D5/18 ,  C25D7/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/005 ,  C25D17/008 ,  C25D17/06 ,  C25D17/12 ,  C25D21/08 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76873 ,  H05K3/187 ,  H05K3/241 ,  H05K2203/1518

Abstract: There is provided a plating apparatus for plating a rectangular substrate using a substrate holder holding the rectangular substrate. The plating apparatus comprises a plating bath configured to store the substrate holder holding the rectangular substrate, and an anode disposed inside the plating bath so as to face the substrate holder. The substrate holder includes an electrical contact configured to feed two opposite sides of the rectangular substrate. The rectangular substrate and the anode are placed inside the plating bath so as to satisfy the relationship of 0.59×L1−43.5 mm≤D1≤0.58×L1−19.8 mm, where L1 is the shortest distance between a substrate center of the rectangular substrate and the electrical contact, and D1 is the distance between the rectangular substrate and the anode.

公开(公告)号：US10001754B2

公开(公告)日：2018-06-19

申请号：US14782624

申请日：2014-03-26

Applicant: Universo S.A.

Inventor： Gerard Rossier

IPC: B25B1/20 ,  G04D1/06 ,  G04D3/00 ,  G04D3/08 ,  C25D17/06 ,  C25D17/00 ,  C25D17/08 ,  C25D21/10

CPC classification number: G04D1/06 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/10 ,  G04D3/0069 ,  G04D3/08

Abstract: A support for cleaning and/or galvanic deposition including a carrier structure including attachment points for watch hands each provided with a hole. The attachment points include at least one rigid pin, if necessary a conductive pin, onto which the hands are threaded via their hole and held apart from each other by a spacer.

公开(公告)号：US20180163320A1

公开(公告)日：2018-06-14

申请号：US15736365

申请日：2016-06-17

Applicant: Maxence RENAUD

Inventor： Maxence RENAUD

IPC: C25D17/08 ,  C25D21/10

CPC classification number: C25D17/08 ,  C25D11/005 ,  C25D21/10

Abstract: A part-carrier for electrolytically treating geometrically complex parts includes a reinforcement vertically supporting supports that are movable in rotation and designed to carry the parts to be treated, and a control member which, when activated, pivots the movable supports in sequence to either side of a neutral initial position. Application to electroplating.

公开(公告)号：US20170342590A1

公开(公告)日：2017-11-30

申请号：US15413252

申请日：2017-01-23

Applicant: Lam Research Corporation

Inventor： Kari Thorkelsson ,  Jacob Lee Hiester ,  Yu Ding ,  Bryan L. Buckalew

IPC: C25D21/12 ,  C25D7/12 ,  C25D5/08 ,  C25D5/18 ,  C25D17/06 ,  C25D17/00

CPC classification number: C25D21/12 ,  C25D5/08 ,  C25D5/18 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  C25D21/10

Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.

公开(公告)号：US09809898B2

公开(公告)日：2017-11-07

申请号：US13928141

申请日：2013-06-26

Applicant: Novellus Systems, Inc.

Inventor： Daniel Mark Dinneen ,  James E. Duncan

IPC: G06K9/00 ,  G01N21/00 ,  B23K26/00 ,  G01R31/26 ,  H01L21/44 ,  H04N9/47 ,  C25D17/00 ,  H01L21/67 ,  C25D21/10 ,  C25D21/12 ,  H01L21/02 ,  H01L21/768

CPC classification number: C25D17/001 ,  C25D21/10 ,  C25D21/12 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/67253 ,  H01L21/76877

Abstract: Disclosed herein are electroplating systems for forming a layer of metal on a wafer which include an electroplating module and a wafer edge imaging system. The electroplating module may include a cell for containing an anode and an electroplating solution during electroplating, and a wafer holder for holding the wafer in the electroplating solution and rotating the wafer during electroplating. The wafer edge imaging system may include a wafer holder for holding and rotating the wafer through different azimuthal orientations, a camera oriented for obtaining multiple azimuthally separated images of a process edge of the wafer while it is held and rotated (the process edge corresponding to the outer edge of the layer of metal formed on the wafer), and image analysis logic for determining an edge exclusion distance, wherein the edge exclusion distance is a distance between the wafer's edge and the process edge.

公开(公告)号：US20170274478A1

公开(公告)日：2017-09-28

申请号：US15503939

申请日：2015-07-16

Applicant: HITACHI METALS, LTD.

Inventor： Tsutomu NOZAKA ,  Hidehito MORI

IPC: B23K35/02 ,  B23K35/26 ,  B23K1/00 ,  B22F9/24 ,  H01L23/00 ,  B22F1/02 ,  C23C18/16 ,  C23C18/38 ,  C25D3/60 ,  C25D5/40 ,  B23K35/30 ,  B22F1/00

CPC classification number: B23K35/0244 ,  B22F1/0003 ,  B22F1/0048 ,  B22F1/025 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/30 ,  B22F2303/30 ,  B22F2998/10 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42 ,  C22C19/03 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/38 ,  C25D3/60 ,  C25D5/22 ,  C25D5/40 ,  C25D21/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/13014 ,  H01L2224/13083 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357

Abstract: A solder-coated ball (10A) includes a spherical core containing Ni and P; and a solder layer (12) formed to coat the core (11). A solder-coated ball (10B) further includes a Cu plating layer (13) formed between the core (11) and the solder layer (12). A solder-coated ball (10C) further includes an Ni plating layer (14) formed between the Cu plating layer (13) and the solder layer (12).

公开(公告)号：US20170241033A1

公开(公告)日：2017-08-24

申请号：US15588841

申请日：2017-05-08

Applicant: YKK Corporation

Inventor： Kenji Hasegawa

IPC: C25D5/22 ,  A44B1/02 ,  A44B1/06 ,  A44B17/00 ,  C25D21/10 ,  A44B19/42

CPC classification number: C25D5/22 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D17/00 ,  C25D21/10

Abstract: A method for subjecting garment accessories to a surface electrolytic treatment provides various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory and provide a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory.

公开(公告)号：US20170191180A1

公开(公告)日：2017-07-06

申请号：US15400586

申请日：2017-01-06

Applicant: APPLIED Materials, Inc.

Inventor： Eric J. Bergman ,  Jeffrey J. Dennison ,  Marvin L. Bernt

IPC: C25D17/00 ,  C25D21/10 ,  C25D5/08 ,  C25D17/06 ,  C25D5/02 ,  C25D5/04

CPC classification number: C25D17/002 ,  C25D5/022 ,  C25D5/04 ,  C25D17/005 ,  C25D17/008 ,  C25D21/10

Abstract: In one embodiment, an electroplating cell for depositing a metal onto a surface of a substrate includes an electroplating chamber configured to receive an electrolyte containing metal ions and a substrate having a surface disposed to contact the electrolyte, wherein the surface of the substrate is configured to serve as a cathode and wherein the surface of the substrate includes an anomaly region at or near the outer perimeter of the surface of the substrate, an anode disposed in the electrolyte chamber, a shielding device disposed between the cathode and the anode to shield the anomaly section, an oscillator configured to impart a relative oscillation between the cathode and the shielding device, and a power source to cause an electric field between the anode and the cathode.