公开(公告)号：US20050109533A1

公开(公告)日：2005-05-26

申请号：US11023012

申请日：2004-12-28

申请人： Mamoru Kurashina ,  Yoshikatsu Ishizuki ,  Nawalage Cooray ,  Masataka Mizukoshi

发明人： Mamoru Kurashina ,  Yoshikatsu Ishizuki ,  Nawalage Cooray ,  Masataka Mizukoshi

IPC分类号： H05K3/00 ,  H05K3/28 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K3/28 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2201/09881 ,  H05K2203/0508

摘要： A manufacturing method of a circuit board includes the steps of: forming projecting electrodes on a substrate; forming a photosensitive resin film on the substrate so as to cover the projecting electrodes; exposing a substantially entire surface of the photosensitive film; and melting the surface of the photosensitive film so as to expose the projecting electrodes.

摘要翻译： 电路板的制造方法包括以下步骤：在基板上形成突出电极; 在基板上形成感光树脂膜以覆盖突出电极; 曝光感光膜的大致整个表面; 并且使感光膜的表面熔融以使突出电极露出。

公开(公告)号：US06391210B2

公开(公告)日：2002-05-21

申请号：US09901848

申请日：2001-07-09

申请人： Bernd K. Appelt ,  John M. Lauffer ,  Voya R. Markovich ,  Irving Memis ,  David J. Russell

发明人： Bernd K. Appelt ,  John M. Lauffer ,  Voya R. Markovich ,  Irving Memis ,  David J. Russell

IPC分类号： H01B1300

CPC分类号： H05K3/4652 ,  H05K3/0023 ,  H05K3/0035 ,  H05K2203/0508 ,  H05K2203/0554

摘要： A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling techniques and by photoimaging techniques. A process is also disclosed for the manufacture of a multi-level circuit on a substrate having a first-level circuitry pattern on at least one side. The process comprises applying a permanent photoimageable dielectric over the first-level circuitry pattern; exposing the permanent photoimageable dielectric to radiation; laminating a conductive metal layer to the dielectric; making holes in the conductive metal layer and dielectric by mechanical drilling or by laser or plasma ablation; and making a second-level circuitry pattern and filling the holes with a conductive material to electrically connect the first and second layers of circuitry. A further process is claimed for designing a multi-level circuit board product comprising making a prototype having the above structure in which the holes are manufactured by mechanical drilling or by laser or plasma ablation, evaluating the prototype, and then manufacturing a commercial circuit board having essentially the same structure and materials of construction as the prototype, but wherein the holes are manufactured by photoimaging techniques.

摘要翻译： 一种电路板，其结构包括适用于通过激光烧蚀，等离子体消融或机械钻孔技术制造通孔的永久可光成像介电材料，以及通过光成像技术。 还公开了一种用于在至少一侧具有第一级电路图案的衬底上制造多电平电路的工艺。 该过程包括在第一级电路图案上施加永久可光成像电介质; 将永久可光成像电介质暴露于辐射; 将导电金属层层叠到电介质上; 通过机械钻孔或通过激光或等离子体消融在导电金属层和电介质中形成孔; 以及制作二级电路图案，并用导电材料填充所述孔，以电连接所述第一和第二层电路。 要求设计多级电路板产品的另一方法包括制造具有上述结构的原型，其中通过机械钻孔或通过激光或等离子体烧蚀制造孔，评估原型，然后制造商业电路板，其具有 基本上与原型相同的结构和结构材料，但是其中孔通过光成像技术制造。

公开(公告)号：US5259926A

公开(公告)日：1993-11-09

申请号：US950286

申请日：1992-09-24

申请人： Kazuhiro Kuwabara ,  Yuji Mori ,  Yoshiro Mikami

发明人： Kazuhiro Kuwabara ,  Yuji Mori ,  Yoshiro Mikami

IPC分类号： C23F1/00 ,  G03F7/00 ,  G03F7/26 ,  H01L21/027 ,  H01L21/033 ,  H01L21/302 ,  H01L21/3065 ,  H05K3/06 ,  B44C1/22

CPC分类号： B29C43/003 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0274 ,  H01L21/0337 ,  H05K3/061 ,  B29C2043/025 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2203/0108 ,  H05K2203/0508 ,  H05K2203/1189 ,  Y10S438/942

摘要： Disclosed is an improvement in a thin-film pattern manufacturing method which includes the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching. According to the improvement, the mask is manufactured by forming a layer of an organic resin on the thin film on the substrate and by forming the organic resin layer in the desired pattern by a mechanical forming member. In another embodiment, the organic resin is directly formed or moulded on the thin film by a forming or moulding member.

摘要翻译： 公开了薄膜图案制造方法的改进，其包括以下步骤：在基板上提供薄膜，在薄膜上形成具有期望图案的掩模，并且通过去除薄膜的暴露部分来对薄膜进行图案化 电影通过蚀刻。 根据改进，通过在基板上的薄膜上形成有机树脂层，并通过机械形成部件形成所需图案的有机树脂层来制造掩模。 在另一个实施方案中，有机树脂通过成型或模制构件直接形成或模制在薄膜上。

公开(公告)号：US4610941A

公开(公告)日：1986-09-09

申请号：US713550

申请日：1985-03-19

申请人： Donald F. Sullivan

发明人： Donald F. Sullivan

IPC分类号： G03F7/20 ,  H05K3/00 ,  H05K3/12 ,  H05K3/28 ,  G03C5/00

CPC分类号： H05K3/0082 ,  G03F7/2022 ,  H05K3/28 ,  H05K2201/0166 ,  H05K2203/0508 ,  H05K2203/056 ,  H05K2203/0759 ,  H05K2203/1476 ,  H05K3/1216

摘要： A process is described for improving the quality of images which have been formed by screen printing a liquid photo curable photopolymer. Images formed by screen printing, especially heavy coatings such as solder masks on printed wiring boards, inherently have indistinct boundaries, and may have feathered edges and photopolymer smears. These indistinct boundaries are removed and the resolution improved by a process which utilizes the oxygen inhibition effect characteristic of selected photopolymers. Thus, a screen printed image can be 0.001 inches thick at the center of a line, tapering off to 0.0001 inch thick smears, and these smears may be eliminated by irradiating the entire image with a moderate amount light energy, which cures the thick image portion and leaves a liquid boundary layer on the order of 0.0001 inch thick due to the oxygen effect. When washed with a mild solvent the liquid layer is removed, including the smears, leaving the thick image portion undisturbed. In a preferred embodiment a phototransparency is interposed over and out of contact with the images and then irradiated with non-collimated UV light so as to harden the thicker image sections while indistinct boundary areas are shielded by opaque phototransparency areas. Light undercutting due to the use of non-collimated light does not polymerize the smears because of the oxygen-inhibition effect and the thinness of the smears, and thus only the undersirable smears will be inhibited and left in the liquid state for removal to improve the resolution.

摘要翻译： 描述了一种用于提高通过丝网印刷液体光固化光聚合物形成的图像质量的方法。 通过丝网印刷形成的图像，特别是印刷线路板上的重涂层，例如焊接掩模，固有地具有不清楚的边界，并且可能具有羽化边缘和光聚合物涂片。 除去这些不清楚的边界，并且通过利用选择的光聚合物的氧抑制作用特征的方法改进分辨率。 因此，丝网印刷图像在线的中心可以为0.001英寸厚，逐渐变细到0.0001英寸厚的涂片，并且可以通过用适度的光能照射整个图像来消除这些涂片，这固化了厚图像部分 并且由于氧气效应而留下厚度为0.0001英寸的液体边界层。 当用温和的溶剂洗涤时，除去液体层，包括涂片，使厚的图像部分不受干扰。 在一个优选实施例中，将光透明度置于图像上并与图像接触之后，然后用非准直的UV光照射，以便使不透明的边界区域被不透明的透光区域屏蔽，从而使较厚的图像部分变硬。 由于使用非平行光而引起的光底切不会由于阻氧效果和涂片的薄度而聚合涂片，因此只有不合需要的污迹将被抑制并留在液态以除去以改善 解析度。

公开(公告)号：US20160007455A1

公开(公告)日：2016-01-07

申请号：US14769953

申请日：2014-01-31

申请人： ISHIHARA CHEMICAL CO., LTD.

发明人： Yuichi KAWATO ,  Hidetoshi ARIMURA ,  Tomio KUDO

IPC分类号： H05K1/09 ,  B22F7/04 ,  H01B1/02 ,  H05K3/10

CPC分类号： H05K1/092 ,  B22F3/008 ,  B22F7/04 ,  C09D5/24 ,  C09D7/40 ,  C09D7/61 ,  H01B1/02 ,  H01B1/22 ,  H05K1/0386 ,  H05K1/097 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/0302 ,  H05K2203/0508 ,  H05K2203/10 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1476

摘要： Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a dispersion vehicle and copper particulates dispersed in the dispersion vehicle. The copper particulate dispersion contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates during the photo-sintering of the copper particulates.

摘要翻译： 提供一种铜颗粒分散体，其可以通过光烧结促进形成具有低电阻的导电膜。 铜颗粒分散体包括分散载体和分散在分散载体中的铜微粒。 铜颗粒分散体含有烧结促进剂。 烧结促进剂是在高于环境温度的温度下从铜中除去氧化铜的化合物。 因此，在铜微粒的光烧结期间，烧结促进剂从铜颗粒中除去表面氧化物涂层。

公开(公告)号：US08298034B2

公开(公告)日：2012-10-30

申请号：US12809687

申请日：2008-12-19

申请人： Lap-Tak Andrew Cheng

发明人： Lap-Tak Andrew Cheng

IPC分类号： H01J9/12

CPC分类号： H01J1/304 ,  H01J9/025 ,  H01J2201/30403 ,  H05K3/02 ,  H05K3/4053 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2203/0508 ,  H05K2203/0783 ,  H05K2203/308 ,  Y10T428/24339 ,  Y10T428/24802

摘要： This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.

摘要翻译： 本发明涉及使用沉积在器件结构中的预先存在的通孔中的光致抗蚀剂和厚膜糊来制造电气和电子器件的方法以及由这种方法制造的器件。 该方法允许厚膜浆料沉积在孔的角部。 本发明还涉及使用由在孔中残留的光致抗蚀剂沉积物制成的扩散层进行图案化的厚膜糊制成的装置。

公开(公告)号：US20050124091A1

公开(公告)日：2005-06-09

申请号：US10978521

申请日：2004-11-02

申请人： Katsuya Fukase ,  Toyoaki Sakai

发明人： Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H01L21/48 ,  H05K3/06 ,  H05K3/20 ,  H01L21/44 ,  H01L21/425 ,  H01L21/50 ,  H01L21/82

CPC分类号： H05K3/064 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/4846 ,  H05K3/062 ,  H05K3/202 ,  H05K2203/0369 ,  H05K2203/0508 ,  H05K2203/058 ,  H05K2203/0597 ,  H05K2203/1476

摘要： A process for forming a metal pattern comprising the following steps of: (a) half-etching a metal plate from one or respective sides thereof by means of first masking which is positioned on one or respective surfaces of the metal plate; (b) applying positive liquid resist on the half-etched metal plate from one or respective sides of the first masking; (c) exposing the positive liquid resist with light from one or respective sides of the first masking; (d) developing the positive liquid resist in such a manner that unexposed positive liquid resist located under the first masking is protected and exposed, uncured liquid resist is removed; (e) half-etching again the metal plate from one or respective sides thereof by means of second masking composed of the first masking and the protected positive liquid resist; (f) repeating the steps (b) to (e) until a metal pattern is obtained from the metal plate; and (g) removing the first masking, and the second or subsequent masking of the unexposed positive liquid resist, from the metal plate.

摘要翻译： 一种用于形成金属图案的方法，包括以下步骤：（a）通过位于金属板的一个或相应表面上的第一掩模从其一侧或两侧半蚀刻金属板; （b）从第一掩模的一个或相应的两侧向半蚀刻的金属板施加正的液体抗蚀剂; （c）用来自第一掩模的一个或相应侧面的光曝光正极液体抗蚀剂; （d）以防止位于第一掩模下面的未曝光的正性液体抗蚀剂被保护和暴露的方式显影出正的液体抗蚀剂，去除未固化的液体抗蚀剂; （e）通过由第一掩模和受保护的正性液体抗蚀剂组成的第二掩模，从其一侧或两侧再次对金属板进行蚀刻; （f）重复步骤（b）至（e），直到从金属板获得金属图案; 和（g）从金属板去除未曝光的正性液体抗蚀剂的第一掩蔽和第二次或随后的掩蔽。

公开(公告)号：US20040245213A1

公开(公告)日：2004-12-09

申请号：US10822825

申请日：2004-04-13

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Katsuya Fukase ,  Toyoaki Sakai

IPC分类号： H01B013/00 ,  B44C001/22

CPC分类号： G03F7/0035 ,  H01L21/4828 ,  H01L21/4846 ,  H05K3/062 ,  H05K3/064 ,  H05K3/202 ,  H05K2203/0369 ,  H05K2203/0508 ,  H05K2203/058 ,  H05K2203/0597 ,  H05K2203/1476

摘要： A process for making a circuit board comprises the following steps of: half-etching a metal layer formed on an insulating substrate by means of a first masking which is positioned on an upper surface of the metal layer; applying a positive liquid resist on the half-etched metal layer from an upper side of the first masking; exposing the positive liquid resist with parallel light from the upper side of the first masking and developing the positive liquid resist in such a manner that a part of the positive liquid resist located under the first masking is protected to be unexposed and undeveloped; etching again the metal layer by means of a second masking composed of the first masking and the protected positive liquid resist to form a conductive pattern on the insulating substrate; and removing the first masking and the second masking from the metal layer.

摘要翻译： 制造电路板的方法包括以下步骤：通过位于金属层的上表面上的第一掩模半蚀刻在绝缘基板上形成的金属层; 从第一掩模的上侧在半蚀刻金属层上施加正的液体抗蚀剂; 用来自第一掩蔽的上侧的平行光暴露正的液体抗蚀剂，并以这样的方式显影正极液体抗蚀剂，使得位于第一掩蔽下的正极抗蚀剂的一部分被保护为未曝光和未显影; 通过由第一掩模和受保护的正性液体抗蚀剂构成的第二掩模再次蚀刻金属层，以在绝缘基板上形成导电图案; 以及从金属层去除第一掩蔽和第二掩蔽。

公开(公告)号：US20010042733A1

公开(公告)日：2001-11-22

申请号：US09901848

申请日：2001-07-09

发明人： Bernd K. Appelt ,  John M. Lauffer ,  Voya R. Markovich ,  Irving Memis ,  David J. Russell

IPC分类号： H01B013/00

CPC分类号： H05K3/4652 ,  H05K3/0023 ,  H05K3/0035 ,  H05K2203/0508 ,  H05K2203/0554

摘要： A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling techniques and by photoimaging techniques. A process is also disclosed for the manufacture of a multi-level circuit on a substrate having a first-level circuitry pattern on at least one side. The process comprises applying a permanent photoimageable dielectric over the first-level circuitry pattern; exposing the permanent photoimageable dielectric to radiation; laminating a conductive metal layer to the dielectric; making holes in the conductive metal layer and dielectric by mechanical drilling or by laser or plasma ablation; and making a second-level circuitry pattern and filling the holes with a conductive material to electrically connect the first and second layers of circuitry. A further process is claimed for designing a multi-level circuit board product comprising making a prototype having the above structure in which the holes are manufactured by mechanical drilling or by laser or plasma ablation, evaluating the prototype, and then manufacturing a commercial circuit board having essentially the same structure and materials of construction as the prototype, but wherein the holes are manufactured by photoimaging techniques.

摘要翻译： 一种电路板，其结构包括适用于通过激光烧蚀，等离子体消融或机械钻孔技术制造通孔的永久可光成像介电材料，以及通过光成像技术。 还公开了一种用于在至少一侧具有第一级电路图案的衬底上制造多电平电路的工艺。 该过程包括在第一级电路图案上施加永久可光成像电介质; 将永久可光成像电介质暴露于辐射; 将导电金属层层叠到电介质上; 通过机械钻孔或通过激光或等离子体消融在导电金属层和电介质中形成孔; 以及制作二级电路图案，并用导电材料填充所述孔，以电连接所述第一和第二层电路。 要求设计多级电路板产品的另一方法包括制造具有上述结构的原型，其中通过机械钻孔或通过激光或等离子体烧蚀制造孔，评估原型，然后制造商业电路板，其具有 基本上与原型相同的结构和结构材料，但是其中孔通过光成像技术制造。

公开(公告)号：US5221426A

公开(公告)日：1993-06-22

申请号：US799804

申请日：1991-11-29

申请人： Theodore G. Tessier ,  John W. Stafford ,  William F. Hoffman

发明人： Theodore G. Tessier ,  John W. Stafford ,  William F. Hoffman

IPC分类号： H01L21/3213 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01L21/32131 ,  H05K3/027 ,  H05K3/108 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0508 ,  H05K2203/0597 ,  H05K3/062 ,  H05K3/388 ,  H05K3/4644 ,  Y10S438/94

摘要： An improved laser etch-back process forms a metal feature on an area of a polymeric or other non-metallic substrate. The process comprises forming a metal layer on the area that includes a first, relatively thick section, and a second, relatively thin section. Thereafter, the metal layer is uniformly irradiated with a laser pulse, but not to vaporize metal from the thick section. Thus, the laser pulse selectively etches the thin section to remove the metal and expose the substrate, without disturbing the thick section, which forms the desired metal feature.

摘要翻译： 改进的激光蚀刻工艺在聚合物或其它非金属基底的区域上形成金属特征。 该方法包括在包括第一相对厚的部分和第二较薄的部分的区域上形成金属层。 此后，用激光脉冲均匀地照射金属层，但不从厚部分蒸发金属。 因此，激光脉冲选择性地蚀刻薄部分以去除金属并暴露衬底，而不会干扰形成所需金属特征的厚部分。