Abstract:
A method for growing an epitaxial layer includes obtaining a semiconductor substrate having a plurality of insulating and conductive surfaces, adsorbing a first source gas into the plurality of conductive surfaces to grow a first epitaxial layer thereon, such that the first epitaxial layer has lateral portions overhanging the insulating surfaces, etching the first epitaxial layer to form an etched epitaxial layer, such that the etched epitaxial layer has curved surfaces, and supplying a second source gas to trigger additional epitaxial growth in the etched epitaxial layer.
Abstract:
A radiation detector made from a compound, or alloy, comprising CdxZn1−xTe (0=x=1), Pb in a concentration between 10 and 10,000 atomic parts per billion and at least one element selected from the group consisting of (i) Cl and (ii) elements in column III of the periodic table in a concentration between 10 and 10,000 atomic parts per billion. The radiation detector exhibits full electrical compensation, high-resistivity, full depletion under an applied electrical bias and excellent charge transport.
Abstract translation:由CdxZn1-xTe(0 = x = 1)的化合物或合金制成的辐射探测器,浓度在10至10,000原子百分数之间的Pb和至少一种选自(i)Cl 和(ii)周期表第三列元素的浓度为10至10,000原子百分之十十。 辐射探测器在施加的电气偏压和优异的电荷传输下,表现出全电补偿,高电阻率,全耗尽。
Abstract:
A crystallization mask for laser illumination for converting amorphous silicon into polysilicon is provided, which includes: a plurality of transmissive areas having a plurality of first slits for adjusting energy of the laser illumination passing through the mask; and an opaque area.
Abstract:
The present invention are a method for producing a silicon wafer having a crystal orientation from a silicon single crystal ingot grown by a Floating Zone method (FZ method), wherein, at least, an FZ silicon single crystal ingot is grown by being made to be dislocation-free by Dash Necking method using a seed crystal having its crystal axis inclined at a specified angle from a crystal orientation , and the grown FZ silicon single crystal ingot is sliced at the just angle of a crystal orientation to produce a silicon wafer having a crystal orientation , and a silicon wafer produced by the method. Thereby, there are provided a method for producing a silicon wafer having a crystal orientation from a silicon single crystal ingot made to be dislocation-free at a high success rate by using Dash Necking method by FZ method, and a silicon wafer having an crystal orientation .
Abstract:
Provided is a monocrystalline silicon carbide ingot containing a dopant element, wherein a maximum concentration of the dopant element is less than 5×1017 atoms/cm3 and the maximum concentration is 50 times or less than that of a minimum concentration of the dopant element. Also provided is a monocrystalline silicon carbide wafer made by cutting and polishing the monocrystalline silicon carbide ingot, wherein a electric resistivity at room temperature of the wafer is 5×103 Ωcm or more. Further provided is a method for manufacturing the monocrystalline silicon carbide including growing the monocrystalline silicon carbide on a seed crystal from a sublimation material by a sublimation method. The sublimation material includes a solid material containing a dopant element, and the specific surface of the solid material containing the dopant element is 0.5 m2/g or less.
Abstract:
The main subject of the present invention are solid compounds capable of generating hydrogen by a self-sustaining combustion reaction. Their composition comprises borazane and/or polyaminoborane and at least one inorganic oxidant, advantageously chosen from ammonium nitrate, alkali metal nitrates, alkaline-earth metal nitrates, metal nitrates, metal oxides, oxidants of the family of dinitramines and mixtures thereof. It also relates to the generation of hydrogen by self-sustaining combustion of at least one such compound.
Abstract:
The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity.
Abstract:
A micro-manipulator machine for harvesting and cryofreezing crystals for cryogenic storage and subsequent analysis includes a micropositioner mechanism for converting motions manually input to a position control knob to fractionally-scaled motions of a follower mechanism which includes a tool head support arm and tool head that releasably holds a filamentary polymer cryoloop for immersion into a liquid crystal growth media and extraction of a liquid drop containing a selected crystal from the media. A first automatic actuator mechanism orbits the tool head support arm, tool head, cryoloop, liquid drop and harvested crystal from a harvesting location to a retrieval location when the micropositioner input control arm has been moved manually away from the crystal harvesting location by the operator after extracting a crystal drop, and a second automatic actuator mechanism pivots the toll head into a flowing stream of a cryogenic gas to freeze the liquid drop and crystal.
Abstract:
An improved system based on the Czochralski process for continuous growth of a single crystal ingot comprises a low aspect ratio, large diameter, and substantially flat crucible, including an optional weir surrounding the crystal. The low aspect ratio crucible substantially eliminates convection currents and reduces oxygen content in a finished single crystal silicon ingot. A separate level controlled silicon pre-melting chamber provides a continuous source of molten silicon to the growth crucible advantageously eliminating the need for vertical travel and a crucible raising system during the crystal pulling process. A plurality of heaters beneath the crucible establish corresponding thermal zones across the melt. Thermal output of the heaters is individually controlled for providing an optimal thermal distribution across the melt and at the crystal/melt interface for improved crystal growth. Multiple crystal pulling chambers are provided for continuous processing and high throughput.
Abstract:
A process and system for processing a thin film sample, as well as the thin film structure are provided. In particular, a beam generator can be controlled to emit successive irradiation beam pulses at a predetermined repetition rate. Each irradiation beam pulse may be masked to define a first plurality of beamlets and a second plurality of beamlets. The first and second plurality of beamlets of each of the irradiation pulses being provided for impinging the film sample and having an intensity which is sufficient to at least partially melt irradiated portions of the section of the film sample. A particular portion of the section of the film sample is irradiated with the first beamlets of a first pulse of the irradiated beam pulses to melt first areas of the particular portion, the first areas being at least partially melted, leaving first unirradiated regions between respective adjacent ones of the first areas, and being allowed to resolidify and crystallize. After the irradiation of the particular portion with the first beamlets, the particular portion is again irradiated with the second beamlets of a second pulse of the irradiated beam pulses to melt second areas of the particular portion, the second areas being at least partially melted, leaving second unirradiated regions between respective adjacent ones of the second areas, and being allowed to resolidify and crystallize. The first irradiated and re-solidified areas and the second irradiated and re-solidified areas are intermingled with one another within the section of the film sample. In addition, the first areas correspond to first pixels, and the second areas correspond to second pixels.