公开(公告)号：US11862941B2

公开(公告)日：2024-01-02

申请号：US17235582

申请日：2021-04-20

申请人： SCHOTT AG

发明人： Robert Hettler ,  Amy Soon Li Ping ,  Ong Wai Li ,  Artit Aowudomsuk

IPC分类号： H01S5/40 ,  H01S5/02315 ,  H01S5/02257 ,  H01S5/02253 ,  H01S5/02251 ,  H01S5/00 ,  H01S5/02218 ,  G02B27/01 ,  G03B21/20

CPC分类号： H01S5/4093 ,  H01S5/0014 ,  H01S5/02218 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/4031 ,  G02B27/0172 ,  G03B21/2033

摘要： A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.

公开(公告)号：US11789218B2

公开(公告)日：2023-10-17

申请号：US17731868

申请日：2022-04-28

申请人： Hangzhou Guangzhiyuan Technology Co., Ltd.

发明人： Yichen Shen ,  Samuel Jiang ,  Shanshan Yu

IPC分类号： G02B6/42 ,  H01S5/0234 ,  H01S5/02218 ,  G02B6/293 ,  H01L25/16 ,  H01L23/00

CPC分类号： G02B6/4215 ,  G02B6/29304 ,  G02B6/424 ,  G02B6/4239 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/167 ,  H01S5/0234 ,  H01S5/02218 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81986

摘要： The present disclosure provides a three-dimensional packaging method and a three-dimensional package structure of a photonic-electronic chip. The method includes: fixing an electronic chip on a first area of a first surface of a photonic chip; fixing a dummy chip on a second area of the first surface of the photonic chip, wherein the photonic chip is provided with an optical coupling interface at the second area, and the dummy chip has a cavity with a single-sided opening, and the opening of the cavity faces and covers an optical coupling interface.

公开(公告)号：US11757249B2

公开(公告)日：2023-09-12

申请号：US16766037

申请日：2018-11-19

申请人： KYOCERA Corporation

发明人： Youji Furukubo

IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01S5/02208 ,  H01L33/20 ,  H01L33/48 ,  H01S5/02218

CPC分类号： H01S5/02208 ,  H01L33/20 ,  H01L33/486 ,  H01S5/02218

摘要： A substrate for mounting a light-emitting element includes a substrate with a plate shape and a base that protrudes from a front surface of the substrate, wherein the base has a mounting part for mounting a light-emitting element on a top surface thereof and composes a sloping surface that slopes with respect to the front surface and the substrate and the base are integrally formed of a ceramic.

公开(公告)号：US20230187898A1

公开(公告)日：2023-06-15

申请号：US18060859

申请日：2022-12-01

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU

IPC分类号： H01S5/02315 ,  H01S5/02218 ,  H01S5/02

CPC分类号： H01S5/02315 ,  H01S5/02218 ,  H01S5/0203

摘要： A light emitting device includes a submount, a semiconductor laser device, and a base supporting the submount. The submount includes a graphite layer having upper and lower surfaces extending in first and second directions orthogonal to each other and a support layer having upper and lower surfaces extending in the first and second directions. The graphite layer includes a plurality of graphene structures layered in the first direction. Each of the plurality of graphene structures extends in the second direction. The support layer is thicker than the graphite layer. The upper surface of the support layer supports the lower surface of the graphite layer. The semiconductor laser device emits laser light through an end surface in the first direction. The semiconductor laser device includes a waveguide that extends in the first direction and is supported by the upper surface of the graphite layer.

公开(公告)号：US20220189788A1

公开(公告)日：2022-06-16

申请号：US17513122

申请日：2021-10-28

申请人： STMicroelectronics Pte Ltd

发明人： Jing-En LUAN

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L25/18 ,  H01L25/065 ,  H01L25/00 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/02218

摘要： A molded carrier is formed by a unitary body made of a laser direct structuring (LDS) material and includes a blind opening with a bottom surface. The unitary body includes: a floor body portion defining a back side and the bottom surface of the blind opening and an outer peripheral wall body portion defining a sidewall surface of the blind opening. LDS activation followed by electro-plating is used to produce: a die attach pad and bonding pad at the bottom surface; land grid array (LGA) pads at the back side; and vias extending through the floor body portion to make electrical connections between the die attach pad and one LGA pad and between the bonding pad and another LGA pad. An integrated circuit chip is mounted to the die attach pad and wire bonded to the bonding pad. A wafer-scale manufacturing process is used to form the molded carrier.

公开(公告)号：US20220085569A1

公开(公告)日：2022-03-17

申请号：US17456827

申请日：2021-11-29

申请人： Cisco Technology, Inc.

发明人： Frederick W. WARNING, JR.

IPC分类号： H01S5/024 ,  H01S5/40 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/02218

摘要： An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

公开(公告)号：US11984373B2

公开(公告)日：2024-05-14

申请号：US17522327

申请日：2021-11-09

申请人： STMicroelectronics (Grenoble 2) SAS

发明人： Jerome Lopez

IPC分类号： H01L23/31 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52 ,  H01S5/02218 ,  H01S5/068

CPC分类号： H01L23/3114 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52

摘要： An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.

公开(公告)号：US20230031489A1

公开(公告)日：2023-02-02

申请号：US17965195

申请日：2022-10-13

申请人： Excelitas Canada, Inc.

发明人： JinHan Ju ,  Gabriel Charlebois

IPC分类号： H01S5/02208 ,  H01S5/02315 ,  H01S5/02218 ,  H01S5/02345 ,  H01S5/02257 ,  H01S5/40

摘要： A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

公开(公告)号：US11502228B2

公开(公告)日：2022-11-15

申请号：US16629422

申请日：2017-08-04

申请人： OSRAM Opto Semiconductors GmbH

发明人： Seng-Teong Chang ,  Choon Keat Or ,  Lee-Ying Jacqueline Ng ,  Chai-Yun Jade Looi

IPC分类号： H01L33/56 ,  H01S5/02218 ,  H01S5/0235 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

摘要： A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.

公开(公告)号：US20220344894A1

公开(公告)日：2022-10-27

申请号：US17730060

申请日：2022-04-26

申请人： NICHIA CORPORATION

发明人： Ryota OKUNO

IPC分类号： H01S5/0237 ,  H01S5/02218

摘要： A method for manufacturing a light emitting device includes: disposing a light emitting element on a base member; providing a bonding agent to the base member or a lid member; and bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the lid member against the base member, increasing a distance between the base member and the lid member in a state in which the lid member is pressed against the base member, while maintaining a state in which the bonding agent contacts the base member and the lid member, and solidifying the bonding agent in a state in which the distance between the base member and the lid member is increased to bond the base member and the lid member.