公开(公告)号：US20130056750A1

公开(公告)日：2013-03-07

申请号：US13605112

申请日：2012-09-06

Applicant: Jae Hoon Lee

Inventor： Jae Hoon Lee

IPC: H01L29/20 ,  H01L21/50

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/6835 ,  H01L2224/13013 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48 ,  H01L2224/81005 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/8185 ,  H01L2924/1032 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/0503 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A nitride based semiconductor package includes a nitride based semiconductor device, a package substrate, and a bonding substrate. The semiconductor device includes, on a surface thereof, a first electrode pattern having a source electrode, a drain electrode and a gate electrode. The bonding substrate includes, on a first surface thereof, a second electrode pattern corresponding to the first electrode pattern, and at least one first groove pattern. The first groove pattern exposes the second electrode pattern. The first electrode pattern is received in the at least one first groove pattern. The second electrode pattern is bonded to the first electrode pattern received in the at least one first groove pattern. A second surface of the bonding substrate is bonded to the package substrate.

Abstract translation: 氮化物基半导体封装包括氮化物基半导体器件，封装衬底和接合衬底。 半导体器件在其表面上包括具有源电极，漏电极和栅电极的第一电极图案。 接合基板在其第一表面上包括对应于第一电极图案的第二电极图案和至少一个第一凹槽图案。 第一凹槽图案暴露第二电极图案。 第一电极图案被接收在至少一个第一凹槽图案中。 第二电极图案被接合到以至少一个第一凹槽图案接收的第一电极图案。 接合基板的第二表面与封装基板接合。

公开(公告)号：US20130054099A1

公开(公告)日：2013-02-28

申请号：US13218219

申请日：2011-08-25

Applicant: TIMOTHY LORENTZ ,  MATHEW GULDAN ,  HOON LEE

Inventor： TIMOTHY LORENTZ ,  MATHEW GULDAN ,  HOON LEE

IPC: B60W10/02 ,  B60W10/10 ,  B60W10/196

CPC classification number: F16H61/0246 ,  F16H63/46 ,  F16H2312/09

Abstract: A control system for a transmission engages at least three clutches to create braking within the transmission to slow a machine during a shuttle shifting operation. The control system may apply the clutches so as to allocate wear between the clutches equally or unequally, as desired.

Abstract translation: 用于变速器的控制系统接合至少三个离合器，以在变速器内产生制动，以在换档操作期间减慢机器。 控制系统可以应用离合器，以便根据需要在离合器之间分配或不平等地分配磨损。

公开(公告)号：US08382354B2

公开(公告)日：2013-02-26

申请号：US13471967

申请日：2012-05-15

Applicant: Han Gyoul Kim ,  Hwayoung Kim ,  Il Yeong Kang ,  Hyunha Shin ,  Sang Hoon Lee ,  Jin Wook Kim ,  Hyong Jin Kim ,  JunYoung Byun ,  Jaemyeong Noh

Inventor： Han Gyoul Kim ,  Hwayoung Kim ,  Il Yeong Kang ,  Hyunha Shin ,  Sang Hoon Lee ,  Jin Wook Kim ,  Hyong Jin Kim ,  JunYoung Byun ,  Jaemyeong Noh

IPC: F21V7/04

CPC classification number: G02B6/0051 ,  F21S8/033 ,  F21S8/04 ,  F21S8/061 ,  F21V15/015 ,  F21Y2105/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B6/0031 ,  G02B6/0043 ,  G02B6/0055 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0078 ,  G02B6/0085 ,  G02B6/0088 ,  G02B6/0091

Abstract: The lighting module includes: a case including an opening from which light is emitted, a base portion corresponding to the opening, and a seat on at least one side of the base portion; a light source unit disposed on the seat; a light guide plate placed within the case and optically connected with the light source unit; and a diffusing plate placed within the case and placed below the light guide plate, wherein the lighting source unit includes a substrate, a plurality of light emitting diodes (LEDs) disposed on the substrate, and a sub-reflector which is disposed on the substrate and covers the plurality of the LEDs, and wherein at least 90% of the light emitted from the LEDs is directly irradiated onto the light guide plate.

Abstract translation: 照明模块包括：壳体，包括发光的开口，对应于开口的基部，以及位于基部的至少一侧的座; 设置在座椅上的光源单元; 导光板，放置在壳体内并与光源单元光学连接; 以及扩散板，其放置在所述壳体内并放置在所述导光板的下方，其中，所述照明源单元包括基板，设置在所述基板上的多个发光二极管（LED）以及设置在所述基板上的副反射器 并且覆盖多个LED，并且其中从LED发射的光的至少90％直接照射到导光板上。

公开(公告)号：US20130045992A1

公开(公告)日：2013-02-21

申请号：US13575812

申请日：2011-01-28

Applicant: Daniel J. Finley ,  Randall W. King ,  Byung-Hoon Lee ,  Min J. Lee ,  Timothy C. Gahman

Inventor： Daniel J. Finley ,  Randall W. King ,  Byung-Hoon Lee ,  Min J. Lee ,  Timothy C. Gahman

IPC: A61K31/454 ,  C12N5/071 ,  A61P43/00 ,  C40B30/08 ,  C12N9/50 ,  C07D401/06 ,  C12N9/99 ,  C12N9/96

CPC classification number: C07D487/04 ,  C07D207/333 ,  C07D207/335 ,  C07D209/08 ,  C07D209/44 ,  C07D233/64 ,  C07D401/04 ,  C07D401/06 ,  C07D401/10 ,  C07D401/12 ,  C07D403/04 ,  C07D403/06 ,  C07D471/04 ,  G01N33/573 ,  G01N2333/948 ,  G01N2500/04

Abstract: Proteinopathies result from the proteasome not acting efficiently enough to eliminate harmful proteins and prevent the formation of the pathogenic aggregates. As described herein, inhibition of proteasome-associated deubiquitinase Usp 14 results in increased proteasome efficiency. The present invention therefore provides novel compositions and methods for inhibition of Usp14, enhancement of proteasome activity and treatment of proteinopathies.

Abstract translation: 由蛋白酶体引起的蛋白酶体不能有效地消除有害蛋白质并阻止病原性聚集体的形成。 如本文所述，抑制蛋白酶体相关的去泛素酶Usp14导致蛋白酶体效率增加。 因此，本发明提供抑制Usp14，蛋白酶体活性增强和蛋白质病症治疗的新型组合物和方法。

公开(公告)号：US20130039223A1

公开(公告)日：2013-02-14

申请号：US13571000

申请日：2012-08-09

Applicant: In Young PARK ,  Jong Hoon Lee

Inventor： In Young PARK ,  Jong Hoon Lee

IPC: H04W4/00 ,  H04L12/16

CPC classification number: H04L65/1069 ,  H04L65/1073

Abstract: Provided is a call connecting system and method based on mobile Voice over Internet Protocol (mVoIP). The method of connecting a call based on mVoIP performed in the system for connecting a call based on mVoIP including a subscriber server and a call processing apparatus may include the subscriber server receiving a call connection request to a second user terminal from a first user terminal and providing notification of the received call connection request to the second user terminal, the call processing apparatus receiving a call attempt message from the first user terminal, the call processing apparatus receiving a call waiting notification, providing notification of a ready state from the second user terminal, and the call processing apparatus establishing a call connection between the first user terminal and the second user terminal by transmitting the received call attempt message to the second user terminal.

Abstract translation: 提供了一种基于移动互联网语音协议（mVoIP）的呼叫连接系统和方法。 基于在用于连接基于包含订户服务器和呼叫处理装置的mVoIP的呼叫的系统中执行的基于mVoIP的呼叫连接的方法可以包括订户服务器从第一用户终端接收到第二用户终端的呼叫连接请求，以及 向所述第二用户终端提供所接收的呼叫连接请求的通知，所述呼叫处理装置从所述第一用户终端接收呼叫尝试消息，所述呼叫处理装置接收呼叫等待通知，从所述第二用户终端提供就绪状态的通知 呼叫处理装置通过向第二用户终端发送接收到的呼叫尝试消息来建立第一用户终端与第二用户终端之间的呼叫连接。

公开(公告)号：US08374119B2

公开(公告)日：2013-02-12

申请号：US12987911

申请日：2011-01-10

Applicant: Dong Youn Seo ,  Jung Hoon Lee ,  Ki Jun Kim ,  Joon Kui Ahn

Inventor： Dong Youn Seo ,  Jung Hoon Lee ,  Ki Jun Kim ,  Joon Kui Ahn

IPC: H04B7/212

CPC classification number: H04W72/042 ,  H04B7/0665 ,  H04L5/0007 ,  H04L5/0039 ,  H04L5/0092 ,  H04L5/0094 ,  H04W16/10 ,  H04W36/0066 ,  H04W48/12 ,  H04W72/0446 ,  H04W72/0493 ,  H04W72/12

Abstract: A method for adjusting a granularity of resource allocation in a wireless mobile communication system supporting a compact scheduling is discussed. A resource indication value (RIV) corresponds to a start index (S) of one set of consecutive virtual resource blocks (VRBs) and a length of the VRBs. The start index (S) is selected from among ‘s’ values (where s=P+mT

Abstract translation: 讨论了一种在支持紧凑调度的无线移动通信系统中调整资源分配粒度的方法。 资源指示值（RIV）对应于一组连续虚拟资源块（VRB）的开始索引（S）和VRB的长度。 起始索引（S）从s值（其中s = P + mT

公开(公告)号：US08373782B2

公开(公告)日：2013-02-12

申请号：US12662673

申请日：2010-04-28

Applicant: Eric Fossum ,  Kyoung Lae Cho ,  Yoon Dong Park ,  Young Gu Jin ,  Seung Hoon Lee ,  Sung-Jae Byun

Inventor： Eric Fossum ,  Kyoung Lae Cho ,  Yoon Dong Park ,  Young Gu Jin ,  Seung Hoon Lee ,  Sung-Jae Byun

IPC: H04N3/14 ,  H04N5/335

CPC classification number: H04N5/3575 ,  H04N5/378

Abstract: An image sensor including a noise removing unit may sense images accurately by measuring the amount of noise generated when the image sensor does not perform a sensing operation, storing information about the measured noise amount in each pixel, and removing photocharge corresponding to the information about the measured noise amount during image sensing.

Abstract translation: 包括噪声消除单元的图像传感器可以通过测量当图像传感器不执行感测操作时产生的噪声量，存储关于每个像素中测得的噪声量的信息，并且除去与关于 测量图像感测时的噪声量。

公开(公告)号：US20130032947A1

公开(公告)日：2013-02-07

申请号：US13482415

申请日：2012-05-29

Applicant: Sang-sick Park ,  Tae-je Cho ,  Sang-wook Park ,  Teak-hoon Lee ,  Kwang-chul Choi ,  Myung-sung Kang

Inventor： Sang-sick Park ,  Tae-je Cho ,  Sang-wook Park ,  Teak-hoon Lee ,  Kwang-chul Choi ,  Myung-sung Kang

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/544 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer.

Abstract translation: 公开了一种稳定地保护内部半导体芯片免受外部冲击的半导体封装以及半导体封装的制造方法。 该半导体封装包括第一半导体芯片，该第一半导体芯片包括具有第一表面，第二表面和第一表面与第二表面之间的侧表面的第一本体层，以及暴露第一表面的边缘部分的第一保护层和 与第一表面形成阶梯差; 封装结构，其覆盖第一主体层的侧面和第一表面的边缘部分，以便将第一半导体芯片封装成具有锁定结构; 以及通过保护层形成在第一主体层上的第一导电端子。

公开(公告)号：US20130032793A1

公开(公告)日：2013-02-07

申请号：US13367061

申请日：2012-02-06

Applicant: Do-Hyun KIM ,  Yoon Ho KHANG ,  Dong-Hoon LEE ,  Sang Ho PARK ,  Se Hwan YU ,  Cheol Kyu KIM ,  Yong-Su LEE ,  Sung-Haeng CHO ,  Chong Sup CHANG ,  Dong Jo KIM ,  Jung Kyu LEE

Inventor： Do-Hyun KIM ,  Yoon Ho KHANG ,  Dong-Hoon LEE ,  Sang Ho PARK ,  Se Hwan YU ,  Cheol Kyu KIM ,  Yong-Su LEE ,  Sung-Haeng CHO ,  Chong Sup CHANG ,  Dong Jo KIM ,  Jung Kyu LEE

IPC: H01L29/786 ,  H01L21/20

CPC classification number: H01L27/124 ,  H01L27/1225 ,  H01L27/1237 ,  H01L27/1262 ,  H01L27/127 ,  H01L27/1288 ,  H01L29/45 ,  H01L29/7869

Abstract: Provided is a thin film transistor array panel. The thin film transistor array panel according to exemplary embodiments of the present invention includes: a gate wiring layer disposed on a substrate; an oxide semiconductor layer disposed on the gate wiring layer; and a data wiring layer disposed on the oxide semiconductor layer, in which the data wiring layer includes a main wiring layer including copper and a capping layer disposed on the main wiring layer and including a copper alloy.

Abstract translation: 提供了一种薄膜晶体管阵列面板。 根据本发明的示例性实施例的薄膜晶体管阵列面板包括：设置在基板上的栅极布线层; 设置在所述栅极布线层上的氧化物半导体层; 以及数据布线层，其设置在所述氧化物半导体层上，所述数据布线层包括包含铜的主布线层和设置在所述主布线层上并包括铜合金的覆盖层。

公开(公告)号：US20130027133A1

公开(公告)日：2013-01-31

申请号：US13191263

申请日：2011-07-26

Applicant: Seong-Hoon Lee

Inventor： Seong-Hoon Lee

IPC: H03F3/45

CPC classification number: H03F3/45071 ,  G11C7/062 ,  G11C7/065 ,  G11C7/12 ,  G11C2207/063 ,  H03F1/301 ,  H03F3/45179 ,  H03F2200/453 ,  H03F2200/462 ,  H03F2200/91 ,  H03F2203/45154 ,  H03F2203/45176

Abstract: Sense amplifiers including bias circuits are described. Examples include bias circuits having an adjustable width transistor. A loop gain of the bias circuit may be determined in part by the adjustable width of the transistor. Examples of sense amplifiers including amplifier stages configured to bias an input/output node to a reference voltage.

Abstract translation: 描述了包括偏置电路的感应放大器。 示例包括具有可调宽度晶体管的偏置电路。 偏置电路的环路增益可以部分地由晶体管的可调宽度确定。 读出放大器的示例包括被配置为将输入/输出节点偏置到参考电压的放大器级。