公开(公告)号：US08975418B2

公开(公告)日：2015-03-10

申请号：US14013097

申请日：2013-08-29

Applicant: Wenjian Shi ,  Yanli Song ,  Yuhui Bao ,  Jun Lu ,  Yao Huang ,  Dirk Weber

Inventor： Wenjian Shi ,  Yanli Song ,  Yuhui Bao ,  Jun Lu ,  Yao Huang ,  Dirk Weber

IPC: C07C69/78 ,  C07D209/12 ,  C07D209/36 ,  C07D209/34 ,  C07C207/04 ,  C07C201/12 ,  C07D209/42 ,  C07C205/56

CPC classification number: C07D209/34 ,  C07C69/78 ,  C07C201/12 ,  C07C205/56 ,  C07C207/04 ,  C07D209/12 ,  C07D209/42 ,  C07C205/12

Abstract: Disclosed is a method for the synthesis of 6-iodo-2-oxindole useful as intermediate in the manufacture of pharmaceutically active ingredients. Also disclosed is a novel intermediate used in the synthesis of this compound.

Abstract translation: 公开了用作合成制备药物活性成分的6-碘-2-羟基吲哚的方法。 还公开了用于合成该化合物的新型中间体。

公开(公告)号：US08952025B2

公开(公告)日：2015-02-10

申请号：US13855133

申请日：2013-04-02

Applicant: Sidney Hecht ,  Omar Khdour ,  Jun Lu ,  Pablo Arce

Inventor： Sidney Hecht ,  Omar Khdour ,  Jun Lu ,  Pablo Arce

IPC: A01N43/54 ,  A61K31/505 ,  C07D239/47 ,  C07D213/74 ,  C07D237/22 ,  C07D239/42 ,  C07D213/73 ,  C07D239/52 ,  C07D403/04 ,  C07D471/04

CPC classification number: C07D239/47 ,  C07D213/73 ,  C07D213/74 ,  C07D237/22 ,  C07D239/42 ,  C07D239/52 ,  C07D403/04 ,  C07D471/04

Abstract: The present disclosure provides biologically active compounds of formula (I): and pharmaceutically acceptable salts thereof: compositions comprising these compounds, and methods of using these compounds in a variety of applications, such as treatment or suppression of diseases associated with decreased mitochondrial function resulting in diminished ATP production and/or oxidative stress and/or lipid peroxidation.

Abstract translation: 本公开提供式（I）的生物活性化合物及其药学上可接受的盐：包含这些化合物的组合物，以及在各种应用中使用这些化合物的方法，例如治疗或抑制与线粒体功能降低相关的疾病，导致 减少ATP产生和/或氧化应激和/或脂质过氧化。

公开(公告)号：US20140361418A1

公开(公告)日：2014-12-11

申请号：US13913183

申请日：2013-06-07

Applicant: Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu

Inventor： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu

IPC: H01L23/495

CPC classification number: H01L23/4951 ,  H01L23/492 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a semiconductor package of a flip chip and a method for making the semiconductor package. The semiconductor chip comprises a metal-oxide-semiconductor field effect transistor. On a die paddle including a first base, a second base and a third base, half-etching or punching is performed on the top surfaces of the first base and the second base to obtain plurality of grooves that divide the top surface of the first base into a plurality of areas comprising multiple first connecting areas, and divide the top surface of the second base into a plurality of areas comprising at least a second connecting area. The semiconductor chip is connected to the die paddle at the first connecting areas and the second connecting area.

Abstract translation: 本发明涉及倒装芯片的半导体封装以及制造半导体封装的方法。 半导体芯片包括金属氧化物半导体场效应晶体管。 在包括第一基底，第二基底和第三基底的裸片上，在第一基底和第二基底的顶表面上进行半蚀刻或冲孔，以获得多个凹槽，该凹槽将第一基底 进入包括多个第一连接区域的多个区域，并且将第二基座的顶表面分成包括至少第二连接区域的多个区域。 半导体芯片在第一连接区域和第二连接区域处连接到管芯焊盘。

公开(公告)号：US08874960B1

公开(公告)日：2014-10-28

申请号：US13315007

申请日：2011-12-08

Applicant: Tameen Khan ,  Jun Lu ,  Robert Spier ,  Laura Werner ,  Sandor Szego ,  Shibani Sanan

Inventor： Tameen Khan ,  Jun Lu ,  Robert Spier ,  Laura Werner ,  Sandor Szego ,  Shibani Sanan

IPC: G06F11/00

CPC classification number: G06F11/1425 ,  G06F11/2028 ,  G06F11/2038 ,  G06F2201/825

Abstract: Systems and method of automated master election for high availability database system are discussed herein. Automated lock competition and master worker selection based on factors that may include geographic parameters, processing power, connection speed, and relative locations of database(s) and worker(s) are also discussed.

Abstract translation: 本文讨论了高可用性数据库系统的自动主选的系统和方法。 还讨论了基于可能包括地理参数，处理能力，连接速度以及数据库和工作人员的相对位置的因素的自动锁定竞争和主工作者选择。

公开(公告)号：US08865523B2

公开(公告)日：2014-10-21

申请号：US13833341

申请日：2013-03-15

Applicant: Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

Inventor： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

IPC: H01L23/495 ,  H01L21/78

CPC classification number: H01L23/49562 ,  H01L21/561 ,  H01L21/78 ,  H01L23/06 ,  H01L23/3114 ,  H01L23/492 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49568 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies.

Abstract translation: 一种制造半导体封装器件的方法包括将引线框架安装在模制半导体芯片的底部，该底部具有覆盖半导体芯片的顶面的第一塑料封装体，用第二塑料封装体封装引线框和半导体芯片 导电接触体的顶表面电连接到半导体芯片的顶表面上的电极，并暴露在组件结构的顶表面上的导电焊盘，以通过导电接触体提供与电极的外部电连接。

公开(公告)号：US20140066634A1

公开(公告)日：2014-03-06

申请号：US14013097

申请日：2013-08-29

Applicant: Wenjian SHI ,  Yanli Song ,  Yuhui Bao ,  Jun Lu ,  Yao Huang ,  Dirk Weber

Inventor： Wenjian SHI ,  Yanli Song ,  Yuhui Bao ,  Jun Lu ,  Yao Huang ,  Dirk Weber

IPC: C07D209/34 ,  C07C201/12 ,  C07D209/42 ,  C07C207/04

CPC classification number: C07D209/34 ,  C07C69/78 ,  C07C201/12 ,  C07C205/56 ,  C07C207/04 ,  C07D209/12 ,  C07D209/42 ,  C07C205/12

Abstract: Disclosed is a method for the synthesis of 6-iodo-2-oxindole useful as intermediate in the manufacture of pharmaceutically active ingredients. Also disclosed is a novel intermediate used in the synthesis of this compound.

Abstract translation: 公开了用作合成制备药物活性成分的6-碘-2-羟基吲哚的方法。 还公开了用于合成该化合物的新型中间体。

公开(公告)号：US20130230783A1

公开(公告)日：2013-09-05

申请号：US13411841

申请日：2012-03-05

Applicant: Khalil Amine ,  Larry A. Curtiss ,  Jun Lu ,  Kah Chun Lau ,  Zhengcheng Zhang ,  Yang-Kook Sun

Inventor： Khalil Amine ,  Larry A. Curtiss ,  Jun Lu ,  Kah Chun Lau ,  Zhengcheng Zhang ,  Yang-Kook Sun

IPC: H01M8/22 ,  B82Y30/00

CPC classification number: H01M12/08 ,  B82Y30/00 ,  H01M2/162 ,  H01M2/1626 ,  H01M4/405 ,  H01M4/96 ,  H01M2300/0025 ,  H01M2300/0028 ,  Y02E60/128 ,  Y02E60/50

Abstract: A lithium-air battery includes a cathode including a porous active carbon material, a separator, an anode including lithium, and an electrolyte including a lithium salt and polyalkylene glycol ether, where the porous active carbon material is free of a metal-based catalyst.

Abstract translation: 锂空气电池包括具有多孔活性炭材料的阴极，隔膜，包含锂的阳极，以及包含锂盐和聚亚烷基二醇醚的电解质，其中多孔活性炭材料不含金属基催化剂。

公开(公告)号：US08455303B2

公开(公告)日：2013-06-04

申请号：US13545225

申请日：2012-07-10

Applicant: Xiaotian Zhang ,  Jun Lu

Inventor： Xiaotian Zhang ,  Jun Lu

IPC: H01L21/60 ,  H01L21/78

CPC classification number: H01L24/37 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/0603 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8585 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.

Abstract translation: 本发明公开了一种半导体封装，其具有预先印刷在引线框架和芯片上的粘合剂材料及其制造方法。 粘合剂材料通过预打印被施加到芯片载体和引线框架的引脚以及半导体芯片的前电极上。 半导体芯片的背面粘附在芯片载体上，并且半导体芯片的前电极和引脚分别与金属连接器连接。 根据不同的应用要求，根据半导体芯片和金属连接器的接触区域的尺寸和形状来施加粘合材料的尺寸，形状和厚度。 特别地，通过预先印刷粘合剂材料形成粘合剂区域，从而显着提高半导体产品的质量和性能，并提高生产率。

公开(公告)号：US08447494B2

公开(公告)日：2013-05-21

申请号：US12361109

申请日：2009-01-28

Applicant: Zhong Wang ,  Brian Spohn ,  Miles K. Maxey ,  Jonathan J Stec ,  Timothy E. McCarthy ,  Vincent A. White ,  John F. Van Gilder ,  Lan Wang ,  Jun Lu

Inventor： Zhong Wang ,  Brian Spohn ,  Miles K. Maxey ,  Jonathan J Stec ,  Timothy E. McCarthy ,  Vincent A. White ,  John F. Van Gilder ,  Lan Wang ,  Jun Lu

IPC: G06F17/00 ,  F02M63/02 ,  F02M33/02 ,  F02M37/00

CPC classification number: B60W20/15 ,  B60L2240/441 ,  B60W10/06 ,  B60W20/00 ,  B60W2510/0638 ,  B60W2550/12 ,  B60W2710/0605 ,  B60W2710/065 ,  F02D41/00 ,  F02D41/0032 ,  F02D41/042 ,  F02D41/123 ,  F02M25/0836 ,  F02M25/089 ,  Y02T10/48 ,  Y02T10/6269 ,  Y02T90/14

Abstract: A control module for an engine of a vehicle includes a mode determination module that determines whether the vehicle is in a fuel-saving mode based on an acceleration of the vehicle. A diurnal control valve (DCV) control module selectively closes a DCV a predetermined time after at least one of determining that the vehicle is in the fuel-saving mode and determining that the engine is stopped.

Abstract translation: 用于车辆的发动机的控制模块包括模式确定模块，其基于车辆的加速度来确定车辆是否处于节油模式。 昼夜控制阀（DCV）控制模块在确定车辆处于燃料节省模式中并确定发动机停止的至少一个之后，在预定时间内选择性地关闭DCV。

公开(公告)号：US20130121551A1

公开(公告)日：2013-05-16

申请号：US13294038

申请日：2011-11-10

Applicant: Per Rugaard Poulsen ,  Walther Fledelius ,  Paul Keall ,  Elisabeth Weiss ,  Jun Lu ,  Emily Brackbill ,  Geoffrey Hugo

Inventor： Per Rugaard Poulsen ,  Walther Fledelius ,  Paul Keall ,  Elisabeth Weiss ,  Jun Lu ,  Emily Brackbill ,  Geoffrey Hugo

IPC: G06K9/00

CPC classification number: G06T11/008 ,  A61N5/1049 ,  A61N2005/1061 ,  G06T17/00 ,  G06T2210/41

Abstract: A method of determining a model of a marker includes obtaining projection images, each of the projection images having an image of a marker that indicates a shape of the marker, determining binary images of the marker for respective ones of the projection images, and constructing a three-dimensional model of the marker using the binary images, the three-dimensional model comprising a set of voxels in a three-dimensional space that collectively indicates a three-dimensional shape of the marker, wherein the act of constructing the three-dimensional model is performed using a processing unit.

Abstract translation: 确定标记的模型的方法包括获得投影图像，每个投影图像具有指示标记的形状的标记的图像，确定各个投影图像的标记的二值图像，并且构建一个 使用二值图像的标记的三维模型，三维模型包括三维空间中的一组体素，其共同表示标记的三维形状，其中构建三维模型的动作 使用处理单元执行。