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    Method for installing axial multiple
    212.
    发明授权
    Method for installing axial multiple 失效
    安装轴向倍数的方法

    公开(公告)号：US5564182A

    公开(公告)日：1996-10-15

    申请号：US438026

    申请日：1995-05-08

    Applicant: Shary Nassimi

    Inventor： Shary Nassimi

    IPC: H01C1/02 ,  H01L23/04 ,  H05K3/34

    CPC classification number: H01C1/02 ,  H01L23/041 ,  H05K3/341 ,  H05K3/3415 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144

    Abstract: A method for installing an axial multiple connection component, for connecting to a circuit board, comprising a shell, the shell substantially cylindrical, having two opposite ends. Conducting leads extend from the opposite ends along the axis, for providing two isolated connections to other components on the circuit board. At least one contact ring encircles the shell with the axis at the center of the contact ring, and provides another connection to the other components on the circuit board. The conducting leads are inserted into lead holes on the circuit board, and the contact ring rests against a metallically plated through ring hole. The component is either manually solder utilizing a solder melting tool or alternatively wave soldered onto the circuit board, with the solder wicking up the plated through ring hole to the contact ring to make a good electrical contact therebetween.

    Abstract translation: 一种用于安装用于连接到电路板的轴向多重连接部件的方法，包括壳体，壳体基本上为圆柱形，具有两个相对的端部。 导线从轴的相对端延伸，用于提供与电路板上其他部件的两个隔离连接。 至少一个接触环围绕壳体，轴线处于接触环的中心，并提供与电路板上其他部件的另一连接。 导电引线插入电路板上的导线孔中，接触环支撑在金属电镀通孔环上。 组件是使用焊料熔化工具手工焊接或者焊接到电路板上的焊料，焊料将电镀通孔环穿过接触环，以在它们之间形成良好的电接触。

    Electrical componet mounting system
    213.
    发明授权
    Electrical componet mounting system 失效
    电子元件安装系统

    公开(公告)号：US5548488A

    公开(公告)日：1996-08-20

    申请号：US415699

    申请日：1995-04-03

    Applicant: Scott A. Hansen

    Inventor： Scott A. Hansen

    IPC: H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K7/12 ,  H05K5/02

    CPC classification number: H05K3/326 ,  H05K7/12 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10878 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/308

    Abstract: An electrical component mounting system includes a substantially rigid substrate supporting a flexible circuit having a contact terminal with at least one aperture to receive a connecting pin from an electrical component. The aperture has a diameter slightly smaller than the diameter of the component conductor pin, such that extending the pin through the aperture in the flexible circuit deforms the contact terminal into an aligned larger diameter aperture in the substrate to provide a secure electrical connection between the pin and the terminal of the flexible circuit. In one embodiment of the invention, the conductive pin includes a locking groove for lockably engaging the rigid substrate.

    Abstract translation: 电气部件安装系统包括支撑柔性电路的基本上刚性的基板，所述柔性电路具有至少一个孔的接触端子，以从电气部件接收连接销。 该孔具有稍小于部件导体销的直径的直径，使得通过柔性电路中的孔延伸销将接触端子变形成衬底中对齐的较大直径的孔，以在引脚之间提供牢固的电连接 和柔性电路的端子。 在本发明的一个实施例中，导电销包括用于可锁定地接合刚性基板的锁定槽。

    Method of manufacturing a multi-layered IC packaging assembly
    214.
    发明授权
    Method of manufacturing a multi-layered IC packaging assembly 失效
    制造多层IC封装组件的方法

    公开(公告)号：US5228192A

    公开(公告)日：1993-07-20

    申请号：US825133

    申请日：1992-01-24

    Applicant: Matthew M. Salatino

    Inventor： Matthew M. Salatino

    IPC: H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K7/02 ,  H05K7/20

    CPC classification number: H05K7/20509 ,  H05K1/189 ,  H05K7/023 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3421 ,  Y10T29/49121

    Abstract: A stacked packaging assembly for a plurality of integrated circuit devices employs a web of flexible interconnect material folded into a `layered` arrangement of parallel web fingers onto which a plurality of integrated circuit devices are surface-mounted. The leads of the integrated circuit devices are attached to interconnect links of the flexible interconnect web. A plurality of heat sink plates are interleaved with the folded web fingers of the stack, so as to engage the integrated circuit devices mounted on the web fingers. The heat sink plates are retained by thermally conductive spacer blocks along their edges. The spacer blocks are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers.

    Abstract translation: 用于多个集成电路器件的堆叠式封装组件使用折叠成平行网状指状物的“分层”布置的柔性互连材料的腹板，多个集成电路器件被表面安装在该布置上。 集成电路器件的引线连接到柔性互连网的互连链路。 多个散热板与堆叠的折叠腹板指状物交错，以便与安装在腹板指状物上的集成电路装置接合。 散热板沿着其边缘由导热间隔块保持。 间隔块以紧凑的层叠结构夹紧在一起，以便形成刚性支撑件，其减轻了卷筒纸指状物折叠处的机械应力。

    Electronic component
    215.
    发明授权
    Electronic component 失效
    电子元器件

    公开(公告)号：US5166570A

    公开(公告)日：1992-11-24

    申请号：US711781

    申请日：1991-06-07

    Applicant: Hiroyuki Takahashi

    Inventor： Hiroyuki Takahashi

    IPC: H01G2/06 ,  H03H9/10 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H01G2/06 ,  H03H9/0528 ,  H03H9/1042 ,  H05K3/308 ,  H05K1/0271 ,  H05K2201/10651 ,  H05K2201/10696 ,  H05K2201/10871 ,  H05K3/3447

    Abstract: A radial lead type electronic component includes a couple of plate-type lead terminals projecting from a protective resin member in the same direction. These lead terminals are provided with inclined edges, which make the body portions gradually narrowed toward leg portions, in leg-side edges of body portions. Among inclined edges, inclinations .theta..sub.1 of the outer ones with respect to the leg-projecting direction are greater than inclinations .theta..sub.2 of the inner ones with respect to the same direction. Thus, the electronic component is relieved from stresses which are applied thereto upon insertion in a printed circuit board or a cut-and-clinch operation.

    Abstract translation: 径向引线型电子部件包括从相同方向从保护性树脂部件突出的一对板状引线端子。 这些引线端子设置有倾斜的边缘，这使得主体部分在主体部分的腿侧边缘中朝向腿部逐渐变窄。 在倾斜边缘中，外侧相对于腿部伸出方向的倾斜度θ1大于相对于相同方向的内侧倾斜度θ2。 因此，电子元件在插入印刷电路板或切割和钳制操作中时被施加到其上的应力消除。

    Surface-mounted power resistors
    217.
    再颁专利
    Surface-mounted power resistors 失效
    表面贴装功率电阻

    公开(公告)号：USRE33541E

    公开(公告)日：1991-02-19

    申请号：US364472

    申请日：1989-06-09

    Applicant: Theodore S. Pryst ,  John G. Kirschner

    Inventor： Theodore S. Pryst ,  John G. Kirschner

    IPC: H01C1/14 ,  H01C17/00 ,  H05K3/34

    CPC classification number: H05K3/3426 ,  H01C1/14 ,  H01C17/006 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point of the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

    Aluminum electrolytic capacitor package with stabilizing third lead
    220.
    发明授权
    Aluminum electrolytic capacitor package with stabilizing third lead 失效
    铝电解电容器封装具有稳定的第三引线

    公开(公告)号：US4763227A

    公开(公告)日：1988-08-09

    申请号：US80937

    申请日：1987-08-03

    Applicant: William G. Novacek

    Inventor： William G. Novacek

    IPC: B32B15/08 ,  H01G9/00 ,  H01G9/008 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

    CPC classification number: H01G9/008 ,  H05K3/308 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2203/168 ,  H05K3/3447

    Abstract: A low cost aluminum electrolytic capacitor package having axial anode and cathode leads extending in one direction is capable of being seated and wave-solder connected in horizontal position to a printed circuit board without rolling, which unwanted rolling may result in withdrawal of one lead that consequently may not receive solder. A dummy lead is bonded to the opposite end of the package to stabilize the capacitor after solder mounting. One of the three leads has an ox-bow bend that tends to stop the unwanted rolling.

    Abstract translation: 具有沿一个方向延伸的轴向阳极和阴极引线的低成本铝电解电容器封装能够在水平位置连接到印刷电路板而不滚动，这种不希望的滚动可能导致一个引线的退出 可能不会接收到焊料。 封装的另一端连接一个虚拟引线，以便在焊接安装后稳定电容器。 三条线之一有一个牛弓弯，倾向于阻止不必要的滚动。

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