公开(公告)号：US07508061B2

公开(公告)日：2009-03-24

申请号：US11369444

申请日：2006-03-06

Applicant: Sun-Won Kang ,  Seung-Duk Baek

Inventor： Sun-Won Kang ,  Seung-Duk Baek

IPC: H01L23/52

CPC classification number: G11C5/04 ,  B81B7/0074 ,  H01L23/3677 ,  H01L23/467 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/065 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19107 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056

Abstract: The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The unit semiconductor device has a structure in which a semiconductor package (or semiconductor chip) is mounted on a unit wiring substrate. Ground pads to be connected to the outer-facing side surfaces of the ground block are formed on the first surface of the unit wiring substrate, the semiconductor chip is mounted on the second surface opposite to the first surface, and contact terminals electrically connected to the semiconductor chip are formed on the second surface.

Abstract translation: 本发明涉及一种三维半导体模块，其具有连接到多侧接地块的面向外侧面的至少一个单元半导体器件。 单元半导体器件具有半导体封装（或半导体芯片）安装在单元布线基板上的结构。 在单元布线基板的第一表面上形成要连接到接地块的面向外侧的接地焊盘，半导体芯片安装在与第一表面相对的第二表面上，并且接触端子电连接到 半导体芯片形成在第二表面上。

公开(公告)号：US20090050785A1

公开(公告)日：2009-02-26

申请号：US11895194

申请日：2007-08-23

Applicant: Richard Charles Flaherty

Inventor： Richard Charles Flaherty

IPC: G01J1/44 ,  G01J1/32

CPC classification number: G01J1/02 ,  F21V23/0442 ,  F21V23/0457 ,  G01J1/0271 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10121

Abstract: A photocontrol device includes a housing assembly and a flexible circuit board assembly. The housing assembly defines an enclosure cavity. The flexible circuit board assembly includes a flexible substrate and a photocontrol circuit mounted on the flexible substrate. The circuit board assembly is disposed in the enclosure cavity in a bent position.

公开(公告)号：US20090032295A1

公开(公告)日：2009-02-05

申请号：US11911914

申请日：2006-04-19

Applicant: Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

Inventor： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC: H05K1/00 ,  H05K1/16

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.

Abstract translation: 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底部表面，或者可以是阶梯状或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，每个导电电路或金属箔的厚度为5μm至450μm，每个绝缘层由树脂组合物的固化产物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。 提供覆盖层的金属基底电路板，具有磁损耗的层或具有介电损耗的层层叠在覆盖层的表面上。 一种LED光源单元，其具有安装在导电电路上的至少一个发光二极管（LED）。

公开(公告)号：US07485951B2

公开(公告)日：2009-02-03

申请号：US10435192

申请日：2003-05-09

Applicant: David L. Roper ,  Curtis Hart ,  James Wilder ,  Phill Bradley ,  James G. Cady ,  Jeff Buchle ,  James Douglas Wehrly, Jr.

Inventor： David L. Roper ,  Curtis Hart ,  James Wilder ,  Phill Bradley ,  James G. Cady ,  Jeff Buchle ,  James Douglas Wehrly, Jr.

IPC: H01L23/495 ,  H01L23/48 ,  H05K1/00 ,  H05K9/00

CPC classification number: H05K1/147 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/056 ,  H05K2201/10689 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems. In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer such as a molded plastic, for example, is formed to protect the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry. The flex circuitry is positioned above the body-protected die to create an integrated lower stack element. The integrated lower stack element may be stacked either with iterations of the integrated lower stack element or with a pre-packaged IC to create a multi-element stacked circuit module.

Abstract translation: 集成电路芯片和柔性电路结构被集成到下层堆叠元件中，该堆叠元件可以与进一步集成的下堆叠元件迭代或者以各种封装类型中的任一种封装的IC堆叠。 本发明可以用于堆叠类似的或不同的集成电路，并且可以用于创建模块化的系统。 在优选实施例中，模具位于一对柔性电路的部分表面之上。 在管芯和柔性电路之间进行连接。 形成诸如模制塑料的保护层，以保护弯曲连接的模头及其与柔性件的连接。 连接元件沿着柔性电路放置，以沿柔性电路的第二侧创建一组模块触点。 柔性电路位于身体保护的模具上方，以形成集成的下层叠元件。 集成的下堆叠元件可以通过集成的下堆叠元件的迭代或者与预先封装的IC堆叠以产生多元件堆叠电路模块。

公开(公告)号：US20090009682A1

公开(公告)日：2009-01-08

申请号：US12165265

申请日：2008-06-30

Applicant: Jaemo Chung ,  Byungjun Lee

Inventor： Jaemo Chung ,  Byungjun Lee

IPC: G02F1/1333 ,  H01J9/24

CPC classification number: H05K1/147 ,  G02B6/0083 ,  G02F1/13452 ,  H05K2201/056 ,  H05K2201/10136 ,  H05K2201/2018

Abstract: A liquid crystal display includes a frame having a coupling groove, an optical sheet adjacent the frame, and a flexible printed circuit on a side of the optical sheet, wherein the flexible printed circuit is coupled to the frame at the coupling groove. A manufacturing method for a liquid crystal display includes providing a frame having a coupling groove, providing an optical sheet adjacent the frame, and providing a flexible printed circuit on a side of the optical sheet and coupling the flexible printed circuit to the frame at the coupling groove.

Abstract translation: 液晶显示器包括具有耦合槽，邻近框架的光学片和在光学片的一侧的柔性印刷电路的框架，其中柔性印刷电路在耦合槽处联接到框架。 液晶显示器的制造方法包括提供具有耦合槽的框架，提供邻近框架的光学片，并且在光学片的一侧上提供柔性印刷电路，并将柔性印刷电路耦合到耦合器 槽。

公开(公告)号：US07459784B2

公开(公告)日：2008-12-02

申请号：US11961477

申请日：2007-12-20

Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

公开(公告)号：US20080232047A1

公开(公告)日：2008-09-25

申请号：US12028384

申请日：2008-02-08

Applicant: Kazuyuki YAMADA

Inventor： Kazuyuki YAMADA

IPC: G06F1/16 ,  H05K1/00

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G02F2001/13456 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/056 ,  H05K2201/10106

Abstract: A mounting structure includes a substrate, a first terminal, a first flexible circuit board, and a second terminal. The first terminal is arranged in a first region of a first face of the substrate. The first flexible circuit board is connected to the first terminal through an anisotropic conductive film. The second terminal is arranged in a second region of a second face, which is a rear face relative to the first face of the substrate, wherein the second region does not overlap the first region in plan view. A region of the second face of the substrate, which overlaps the first region in plan view, is formed to be a smooth face.

Abstract translation: 一种安装结构，包括基板，第一端子，第一柔性电路板和第二端子。 第一端子布置在基板的第一面的第一区域中。 第一柔性电路板通过各向异性导电膜连接到第一端子。 第二端子布置在相对于基板的第一面的后表面的第二面的第二区域中，其中第二区域在俯视图中不与第一区域重叠。 在平面图中与第一区域重叠的基板的第二面的区域形成为光滑面。

公开(公告)号：US07394149B2

公开(公告)日：2008-07-01

申请号：US11715303

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  G06F1/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/2018

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract translation: 低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。 或者，低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 被配置成与所述模块配合地配合的插座; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。

公开(公告)号：US07384272B2

公开(公告)日：2008-06-10

申请号：US11477937

申请日：2006-06-30

Applicant: Sang-Ju Na

Inventor： Sang-Ju Na

IPC: H05K1/10

CPC classification number: H01R12/62 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/056 ,  H05K2201/10598 ,  H05K2201/2009 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: The present invention relates to a flexible printed circuit board assembly. A flexible printed circuit board assembly of the present invention comprises a flexible printed circuit board having a plurality of circuit patterns; a connector mounted at a location spaced apart by a certain distance from an end of the flexible printed circuit board and electrically connected to the, circuit patterns; and a stiffener attached to a region on a bottom surface of the flexible printed circuit board below the connector and having a size corresponding to that of the connector. A connector inside portion and a connector outside portion of the flexible printed circuit board located inside and outside with respect to the connector can be bent. The connector outside portion is bent and bonded to a bottom surface of the stiffener, and the connector inside portion is bent and bonded to a bottom surface of the connector outside portion.

Abstract translation: 本发明涉及柔性印刷电路板组件。 本发明的柔性印刷电路板组件包括具有多个电路图案的柔性印刷电路板; 连接器，其安装在与所述柔性印刷电路板的端部间隔开一定距离并且电连接到所述电路图案的位置处; 以及加强件，其附接到所述柔性印刷电路板的位于所述连接器下方的底表面上的区域，并且具有与所述连接器的尺寸相对应的尺寸。 柔性印刷电路板的连接器内部部分和连接器外侧部分相对于连接器位于内部和外侧可以弯曲。 连接器外侧部分弯曲并结合到加强件的底表面，并且连接器内部部分弯曲并结合到连接器外侧部分的底表面。

公开(公告)号：US20080088977A1

公开(公告)日：2008-04-17

申请号：US11548681

申请日：2006-10-11

Applicant: Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

Inventor： Martin John McCaslin ,  Szu-Han Hu ,  Alex Enriquez Cayaban ,  Voon Yee Ho

IPC: G11B5/55

CPC classification number: G11B25/043 ,  G11B33/1406 ,  G11B33/1426 ,  H01L23/367 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/056 ,  H05K2203/302 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T428/24273 ,  H01L2924/00

Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Abstract translation: 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。