公开(公告)号：US20240175165A1

公开(公告)日：2024-05-30

申请号：US17792079

申请日：2021-10-28

申请人： EBARA CORPORATION

发明人： Masaki TOMITA ,  Yasuyuki MASUDA

IPC分类号： C25D17/00 ,  C25D17/06 ,  C25D21/04 ,  C25D21/12

CPC分类号： C25D17/002 ,  C25D17/06 ,  C25D21/04 ,  C25D21/12

摘要： Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, and a membrane module 40. The membrane module includes a first membrane 41 and a second membrane 42. The second membrane has an inflow port 42c for causing a plating solution in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined portion 42b inclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.

公开(公告)号：US11992915B2

公开(公告)日：2024-05-28

申请号：US17115764

申请日：2020-12-08

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Toru Maruyama ,  Mitsunori Komatsu

IPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

CPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

摘要： A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).

公开(公告)号：US20240165675A1

公开(公告)日：2024-05-23

申请号：US18514511

申请日：2023-11-20

申请人： EBARA CORPORATION

发明人： Yosuke HIMORI ,  Koichi FUKAYA

IPC分类号： B08B1/40 ,  B08B1/36

CPC分类号： B08B1/40 ,  B08B1/36

摘要： According to one embodiment, provided is a substrate cleaning apparatus including: a cleaning member configured to clean a substrate; a plate having a horizontal plane provided with a hole; and a pressing mechanism configured to press the cleaning member vertically downward against the plate, wherein the hole penetrates the plate, and a liquid discharged from the cleaning member is discharged below via the hole, whereby absorption of the liquid discharged from the cleaning member into the cleaning member is suppressed.

公开(公告)号：US20240145277A1

公开(公告)日：2024-05-02

申请号：US18280137

申请日：2022-03-03

申请人： EBARA CORPORATION

发明人： Yosuke NAGASAWA ,  Tensei SATO ,  Hideki WAKABAYASHI

IPC分类号： H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC分类号： H01L21/67259 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68785

摘要： The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectangular substrate. This semiconductor manufacturing device: comprises a first sensor pair, which is used to measure a first length of the rectangular substrate along a first line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the first line and a sensor configured to detect the position of the other end of the rectangular substrate on the first line, and a second sensor pair, which is used to measure a second length of the rectangular substrate along a second line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the second line and a sensor configured to detect the position of the other end of the rectangular substrate on the second line; and identifies the size or shape of the rectangular substrate on the basis of the first length and the second length.

公开(公告)号：US11967508B2

公开(公告)日：2024-04-23

申请号：US17607999

申请日：2020-05-29

申请人： EBARA CORPORATION

发明人： Akira Imamura ,  Mitsuru Miyazaki ,  Junji Kunisawa

IPC分类号： H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67034 ,  H01L21/6704 ,  H01L21/67253 ,  H01L21/67742

摘要： The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system (300) includes an exhaust damper (310), a first pressure sensor (311), and a controller (315) configured to control an opening degree of the exhaust damper (310). The controller (315) is configured to switch the opening degree of the exhaust damper (310) to an opening degree smaller than a full opening on condition that a shutter (217) is opened.

公开(公告)号：US11958163B2

公开(公告)日：2024-04-16

申请号：US17511340

申请日：2021-10-26

申请人： EBARA CORPORATION

发明人： Osamu Nabeya ,  Makoto Fukushima ,  Keisuke Namiki ,  Shingo Togashi ,  Satoru Yamaki ,  Masahiko Kishimoto ,  Tomoko Owada

IPC分类号： B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/687

CPC分类号： B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/68721

摘要： A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：US20240118070A1

公开(公告)日：2024-04-11

申请号：US18376168

申请日：2023-10-03

申请人： EBARA CORPORATION

发明人： Katsuya MINATOZAKI

IPC分类号： G01B7/06 ,  B24B37/013

CPC分类号： G01B7/105 ,  B24B37/013

摘要： A retainer holds reference data for identifying a first AC generated signal corresponding to an output signal output in a reference state from a detection coil. When a film thickness of a conductor is to be measured, an AC signal generator generates the first AC generated signal based on the reference data and outputs it as a reference signal. When a film thickness of a conductor is to be measured, a difference circuitry receives input of an output signal and a reference signal output from the AC signal generator and acquires and outputs a film thickness amplitude that is a difference between the amplitude of the film thickness signal and the amplitude of the reference signal. The data generator in the reference state measures an amplitude of the output signal and generates the reference data.

公开(公告)号：USD1021832S1

公开(公告)日：2024-04-09

申请号：US29874375

申请日：2023-04-19

申请人： EBARA CORPORATION

设计人： Kenichi Akazawa ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Tomoko Owada ,  Cheng Cheng ,  Yuichi Kato

摘要： FIG. 1 is a top perspective view of an elastic membrane showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross sectional view taken along section line 7-7 in FIG. 3; and,
FIG. 8 is an enlarged portion view taken along line 8-8 in FIG. 7.
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.

公开(公告)号：US11948827B2

公开(公告)日：2024-04-02

申请号：US17838248

申请日：2022-06-12

申请人： EBARA CORPORATION

发明人： Mitsuru Miyazaki ,  Hisajiro Nakano ,  Takuya Inoue

IPC分类号： H01L21/687 ,  B08B3/02 ,  B08B13/00 ,  H01L21/67

CPC分类号： H01L21/68728 ,  B08B3/022 ,  B08B13/00 ,  H01L21/67028

摘要： The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.

公开(公告)号：US20240091899A1

公开(公告)日：2024-03-21

申请号：US18521813

申请日：2023-11-28

申请人： EBARA CORPORATION

发明人： Kenichi KOBAYASHI ,  Masayuki NAKANISHI ,  Makoto KASHIWAGI ,  Manao HOSHINA

IPC分类号： B24B37/04 ,  B24B7/22 ,  B24B21/00 ,  B24B21/10 ,  B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B41/06 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC分类号： B24B37/042 ,  B24B7/228 ,  B24B21/004 ,  B24B21/008 ,  B24B21/10 ,  B24B37/005 ,  B24B37/105 ,  B24B37/30 ,  B24B41/067 ,  H01L21/0209 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68764

摘要： A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.