公开(公告)号：US5343073A

公开(公告)日：1994-08-30

申请号：US1014

申请日：1993-01-06

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L29/44 ,  H01L29/52 ,  H01L29/62

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

Abstract translation: 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬和锌混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US5024883A

公开(公告)日：1991-06-18

申请号：US407511

申请日：1989-09-14

Applicant: Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

Inventor： Narendra N. SinghDeo ,  Deepak Mahulikar ,  Sheldon H. Butt

IPC: A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H01L23/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/498 ,  H05K1/03

CPC classification number: H01L23/15 ,  A61F2/30965 ,  C03C14/004 ,  H01L23/10 ,  H01L23/3677 ,  H01L23/49805 ,  H01L23/49861 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  H01L2224/32188 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/256

Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.

Abstract translation: 本发明涉及形成用于容纳半导体器件的部件的部件和工艺。 这些部件由独特的陶瓷 - 玻璃 - 金属复合材料制成，陶瓷颗粒，金属颗粒和玻璃基体，所述陶瓷和金属颗粒遍布整个分散。 金属元件可以嵌入到材料中，以简化诸如半导体封装的器件的制造。

公开(公告)号：US4939316A

公开(公告)日：1990-07-03

申请号：US253639

申请日：1988-10-05

Applicant: Deepak Mahulikar ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  James M. Popplewell

IPC: H01L23/02 ,  C25D11/04 ,  H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14

CPC classification number: H01L23/06 ,  H01L23/057 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195 ,  Y10T29/49121

Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

Abstract translation: 本发明涉及一种适于容纳诸如半导体集成电路的电子设备的封装。 包装部件由铝或铝基合金构成。 包装部件的表面的至少一部分被阳极化以增强耐腐蚀性并增加粘结强度。 基于铝的包装的特征在于比基于铜的包装更轻的重量，并且比基于塑料的包装具有更好的导热性。

公开(公告)号：US4578320A

公开(公告)日：1986-03-25

申请号：US587750

申请日：1984-03-09

Applicant: Deepak Mahulikar ,  Eugene Shapiro

Inventor： Deepak Mahulikar ,  Eugene Shapiro

IPC: B23K35/30 ,  C22C9/06 ,  B32B15/20

CPC classification number: B23K35/302 ,  C22C9/06 ,  Y10T428/12903

Abstract: The present invention relates to copper-nickel alloys having improved ductility at elevated temperatures. The alloys consist essentially of about 5% to about 45%, preferably about 5% to 35% nickel, about 0.4% to about 1.1%, preferably about 0.6% to about 1% manganese, about 0.003% to about 0.04%, preferably about 0.008% to about 0.03% phosphorous and the balance essentially copper. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract translation: 本发明涉及在升高的温度下具有改善的延展性的铜 - 镍合金。 合金基本上由约5％至约45％，优选约5％至35％的镍，约0.4％至约1.1％，优选约0.6％至约1％的锰，约0.003％至约0.04％，优选约 0.008％至约0.03％的磷，余量基本上为铜。 本文所述的合金在钎焊制品或组件中具有特别的用途。

公开(公告)号：US08779011B2

公开(公告)日：2014-07-15

申请号：US13405027

申请日：2012-02-24

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

IPC: C01B33/141 ,  C01B33/143 ,  C09C1/68 ,  C09K13/06

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and less than 2 ppm residual alcohol. The method comprises dissolving a fumed silica in an aqueous solvent comprising an alkali metal hydroxide to produce an alkaline silicate solution, removing the alkali metal via ion exchange to generate a silicic acid solution, adjusting temperature, concentration and pH of said silicic acid solution to values sufficient to initiate nucleation and particle growth, and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion.

Abstract translation: 公开了一种制备和使用超纯胶体二氧化硅分散体的方法。 超纯胶体二氧化硅分散体中含有少于200ppb的痕量金属杂质，不包括钾和钠，少于2ppm的残余醇。 该方法包括将热解法二氧化硅溶解在包含碱金属氢氧化物的水性溶剂中以产生碱性硅酸盐溶液，通过离子交换除去碱金属以产生硅酸溶液，将所述硅酸溶液的温度，浓度和pH值调节至数值 足以引发成核和颗粒生长，并以足以产生胶体二氧化硅分散体的速率冷却硅酸溶液。

公开(公告)号：US08404143B2

公开(公告)日：2013-03-26

申请号：US13402365

申请日：2012-02-22

Applicant: Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

Inventor： Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

IPC: C09K13/00

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Abstract translation: 本公开提供了用于化学机械抛光浆料的浓缩物，以及将该浓缩物稀释到使用点浆料的方法。 浓缩物包括研磨剂，络合剂和缓蚀剂，浓缩物用水和氧化剂稀释。 这些组分的存在量使得浓缩物可以以非常高的稀释比稀释，而不影响抛光性能。

公开(公告)号：US20120145951A1

公开(公告)日：2012-06-14

申请号：US13402365

申请日：2012-02-22

Applicant: Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

Inventor： Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

IPC: C09K13/00 ,  C09K13/04

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Abstract translation: 本公开提供了用于化学机械抛光浆料的浓缩物，以及将该浓缩物稀释到使用点浆料的方法。 浓缩物包括研磨剂，络合剂和缓蚀剂，浓缩物用水和氧化剂稀释。 这些组分的存在量使得浓缩物可以以非常高的稀释比稀释，而不影响抛光性能。

公开(公告)号：US20070254964A1

公开(公告)日：2007-11-01

申请号：US11818730

申请日：2007-06-15

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken Delbridge ,  Gert Moyaerts ,  Saeed Mohseni ,  Nichole Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken Delbridge ,  Gert Moyaerts ,  Saeed Mohseni ,  Nichole Koontz ,  Bin Hu ,  Liqing Wen

IPC: B01F3/12 ,  B08B7/00

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol.

Abstract translation: 一种超纯胶体二氧化硅分散体，其包含平均或聚集体粒径为约10至约200nm的胶体二氧化硅颗粒，其中所述胶体二氧化硅分散体在其中排列的不含钾和钠的痕量金属杂质少于200ppb， 超过2 ppm的残留酒精。

公开(公告)号：US06083840A

公开(公告)日：2000-07-04

申请号：US200518

申请日：1998-11-25

Applicant: Brian Mravic, deceased ,  Anthony Mark Pasqualoni ,  Deepak Mahulikar

Inventor： Brian Mravic, deceased ,  Anthony Mark Pasqualoni ,  Deepak Mahulikar

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/321 ,  H01L21/00

CPC classification number: C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/3212

Abstract: The present invention relates to an improved chemical-mechanical polishing (CMP) method for polishing a copper coated wafer containing a copper adhesion-promoting layer and a silicon-based layer. The method polishes copper layers with high removal rates, low defect densities and reduced amounts of dishing and erosion. The method involves a two step process. The first step is to utilize a bulk copper removal slurry that rapidly removes the majority the copper on the substrate. The second step utilizes a 1:1:1 selectivity copper/tantalum/silicon dioxide (Cu/Ta/SiO.sub.2) slurry that has approximately the same polishing rates for the copper layer, the adhesion-promoting layer and the silicon-based substrate. The second slurry reduces the amount of dishing and erosion that occurs in the copper trenches and dense copper arrays.

Abstract translation: 本发明涉及一种用于抛光含铜粘合促进层和硅基层的铜涂层晶片的改进的化学机械抛光（CMP）方法。 该方法以高去除率，低缺陷密度和减少的凹陷和侵蚀量抛光铜层。 该方法涉及两步法。 第一步是使用快速去除基底上大部分铜的大量铜去除浆液。 第二步采用对铜层，粘合促进层和硅基底板具有大致相同抛光速率的1：1：1选择性铜/钽/二氧化硅（Cu / Ta / SiO2）浆料。 第二种浆料减少了在铜沟槽和致密铜阵列中发生的凹陷和腐蚀的量。

公开(公告)号：US5939214A

公开(公告)日：1999-08-17

申请号：US984147

申请日：1992-11-24

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Abid Ali Khan

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Abid Ali Khan

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L33/00 ,  H01L23/28 ,  H01L23/36

CPC classification number: H01L23/4334 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/49582 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  Y10T428/12569 ,  Y10T428/1275

Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.

Abstract translation: 公开了用于电子封装的复合材料。 复合材料包括芯层和第一和第二覆层。 选择芯层和包覆层的组成和厚度以使热和电导率最大化并使复合材料的热膨胀系数最小化。 可以使用复合材料来形成封装基座，引线框架，散热器或其组合。 在一个实施例中，去除第一包层的一部分，使得电子器件可以直接安装到高导热性核心。