公开(公告)号：US20140020508A1

公开(公告)日：2014-01-23

申请号：US14009544

申请日：2012-03-27

申请人： Hyun-Suk Kang ,  Byung-Cheol Lee ,  Ji-Hyun Park

发明人： Hyun-Suk Kang ,  Byung-Cheol Lee ,  Ji-Hyun Park

IPC分类号： B22F9/16

CPC分类号： B22F9/16 ,  B22F1/025 ,  B22F9/24 ,  B22F2202/11

摘要： Provided is a method for manufacturing metal nanoparticles having a core-shell structure with good oxidation stability, wherein the method comprises the steps of: heating and agitating a core metal precursor solution; mixing a shell metal precursor solution with the heated and agitated core metal precursor solution, and heating and agitating the mixed metal precursor solution; and irradiating the heated and agitated metal precursor solution with radioactive rays. Thus, since yield can be maximized through a simple and environmentally friendly process that does not use a chemical reducing agent, there is no need for a process for removing an added reducing agent, and since a post-heat-treatment of particles is not performed, the manufacturing process is rendered simple and highly economical.

摘要翻译： 本发明提供一种具有氧化稳定性好的核 - 壳结构的金属纳米粒子的制造方法，其特征在于，包括以下步骤：加热并搅拌芯金属前体溶液; 将壳金属前体溶液与加热和搅拌的芯金属前体溶液混合，并加热并搅拌混合金属前体溶液; 并用放射线照射加热和搅拌的金属前体溶液。 因此，由于可以通过不使用化学还原剂的简单且环保的方法使产量最大化，因此不需要除去添加的还原剂的方法，并且由于不进行颗粒的后热处理 ，制造过程简单而且经济。

公开(公告)号：US20130291234A1

公开(公告)日：2013-10-31

申请号：US13882168

申请日：2011-10-13

申请人： Jang Ryol Liu ,  Suk Weon Kim ,  Jong Hyun Kim ,  Sung Ran Min ,  Won Joong Jeong ,  Myung Suk Ahn ,  Young Min Park ,  Myung Jin Oh ,  Ji Hyun Park

发明人： Jang Ryol Liu ,  Suk Weon Kim ,  Jong Hyun Kim ,  Sung Ran Min ,  Won Joong Jeong ,  Myung Suk Ahn ,  Young Min Park ,  Myung Jin Oh ,  Ji Hyun Park

IPC分类号： C07K14/405 ,  C12Q1/68 ,  C12N15/82

CPC分类号： C07K14/405 ,  C07K14/195 ,  C12N15/8273 ,  C12Q1/6895

摘要： The present invention relates to a gene encoding Synechocystis putative DNA binding stress protein (SyDBSP protein) derived from cyanobacteria Synechocystis PCC6906; a method for enhancing the salt tolerance of a plant comprising transforming a plant cell with a recombinant vector comprising the SyDBSP gene and overexpressing the SyDBSP gene; a plant having enhanced salt tolerance produced by the aforementioned method, and seed of the plant.

摘要翻译： 本发明涉及来自蓝细菌集胞藻PCC6906的编码集胞藻推定DNA结合应激蛋白（SyDBSP蛋白）的基因; 一种用于增强植物耐盐性的方法，包括用包含SyDBSP基因和过表达SyDBSP基因的重组载体转化植物细胞; 通过上述方法产生的具有增强的耐盐性的植物和植物的种子。

公开(公告)号：US20130270687A1

公开(公告)日：2013-10-17

申请号：US13532362

申请日：2012-06-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

摘要翻译： 本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

公开(公告)号：US08508954B2

公开(公告)日：2013-08-13

申请号：US12910415

申请日：2010-10-22

申请人： Heung-Kyu Kwon ,  Min-Ok Na ,  Sung-Woo Park ,  Ji-Hyun Park ,  Su-Min Park

发明人： Heung-Kyu Kwon ,  Min-Ok Na ,  Sung-Woo Park ,  Ji-Hyun Park ,  Su-Min Park

IPC分类号： H01R12/16

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01064 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

摘要翻译： 一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。 第一模塑料置于第一基材和第二基材之间。 第一半导体芯片设置在第一基板上并与第一模制部分接触。 第一连接器接触第一焊盘，第二连接器接触第二焊盘。 第二连接器设置在第一连接器上。 第二连接器的体积大于第一连接器的体积。 露出第一半导体芯片的表面。 第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

公开(公告)号：US20130022642A1

公开(公告)日：2013-01-24

申请号：US13635874

申请日：2011-03-18

申请人： Young Woo Park ,  Ki Won Jo ,  Srok Ho Yoo ,  Jung Yu ,  Sun-Ha Yoon ,  Ji Hyun Park ,  Eun Jung Song ,  Jong-Ho Lee ,  Min Ji Seo ,  Sun Jung Cho ,  Mi La Cho ,  Ho Youn Kim ,  Mi Kyung Park ,  Hye Jwa Oh ,  Jin Sil Park ,  Yun Ju Woo ,  Jae Kyeong Byun ,  Jun Geol Ryu

发明人： Young Woo Park ,  Ki Won Jo ,  Srok Ho Yoo ,  Jung Yu ,  Sun-Ha Yoon ,  Ji Hyun Park ,  Eun Jung Song ,  Jong-Ho Lee ,  Min Ji Seo ,  Sun Jung Cho ,  Mi La Cho ,  Ho Youn Kim ,  Mi Kyung Park ,  Hye Jwa Oh ,  Jin Sil Park ,  Yun Ju Woo ,  Jae Kyeong Byun ,  Jun Geol Ryu

IPC分类号： C07K19/00 ,  C12N15/63 ,  C12N1/21 ,  C12N5/10 ,  A61K38/17 ,  A61P21/00 ,  A61P3/10 ,  A61P19/02 ,  A61P37/06 ,  A61P25/00 ,  A61P17/00 ,  C12N15/62 ,  A61P7/06

CPC分类号： C07K14/7151 ,  C07K14/7155 ,  C07K2319/00

摘要： The present invention relates to TNFR2-IL21R fusion protein acting as a double-antagonist to TNF-alpha (α) and IL-21. The composition containing the double antagonist to TNF-α and Il-21 (TNFR2-IL21R fusion protein), known as major causes of autoimmune rheumatoid arthritis, one of autoimmune diseases, can reduce the secretion of inflammatory cytokine, increase the secretion of anti-inflammatory cytokine, and suppress the differentiation of osteoclasts better than single proteins such as TNFR2-Fc and IL21R-Fc. The TNFR2-IL21R fusion protein of the present invention has not only excellent treatment effect on arthritis in CIA mouse model not also excellent treatment effect on autoimmune rheumatoid arthritis by increasing the expression of Treg, the immune suppressive cells. Therefore, the TNFR2-IL21R fusion protein of the present invention can be effectively used as an active ingredient for the composition for the prevention and treatment of autoimmune disease.

摘要翻译： 本发明涉及作为TNF-α（α）和IL-21的双重拮抗剂的TNFR2-IL21R融合蛋白。 含有TNF-α和II-21（TNFR2-IL21R融合蛋白）的双重拮抗剂的组合物，被称为自身免疫性类风湿性关节炎的主要原因（自身免疫性疾病之一）可以减少炎性细胞因子的分泌， 炎性细胞因子，并且比单一蛋白如TNFR2-Fc和IL21R-Fc更好地抑制破骨细胞的分化。 本发明的TNFR2-IL21R融合蛋白不仅对CIA小鼠模型的关节炎具有优异的治疗作用，而且通过增加免疫抑制细胞Treg的表达，对自身免疫性类风湿性关节炎也不是很好的治疗效果。 因此，本发明的TNFR2-IL21R融合蛋白可以有效地用作预防和治疗自身免疫性疾病的组合物的活性成分。

公开(公告)号：US08352993B2

公开(公告)日：2013-01-08

申请号：US12119527

申请日：2008-05-13

申请人： Ji-hyun Park ,  Ji-eun Kim ,  Hyun-jin Kim ,  Sung-baik Jo ,  Il-kown Kim

发明人： Ji-hyun Park ,  Ji-eun Kim ,  Hyun-jin Kim ,  Sung-baik Jo ,  Il-kown Kim

IPC分类号： H04N7/173

CPC分类号： H04N7/15 ,  H04N5/44543 ,  H04N21/42203 ,  H04N21/4316 ,  H04N21/435 ,  H04N21/4396 ,  H04N21/443 ,  H04N21/4622 ,  H04N21/6125

摘要： A method for providing viewing information is presented. The method includes displaying a call recipient list including at least one call recipient; and displaying a channel being viewed by each call recipient on the call recipient list.

摘要翻译： 提供了一种提供观看信息的方法。 该方法包括显示包括至少一个呼叫接收者的呼叫接收者列表; 并且在呼叫接收者列表上显示每个呼叫接收者正在观看的频道。

公开(公告)号：US20120319259A1

公开(公告)日：2012-12-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US08301006B2

公开(公告)日：2012-10-30

申请号：US12550460

申请日：2009-08-31

申请人： Ji-hyun Park ,  Dae-gu Kim ,  Il-kwon Kim

发明人： Ji-hyun Park ,  Dae-gu Kim ,  Il-kwon Kim

IPC分类号： H04N5/765 ,  H04N5/77

CPC分类号： H04N1/3871

摘要： An image displaying apparatus, an image editing apparatus, an image editing system, an image displaying method and an image editing method are disclosed. The image displaying apparatus includes an image processing unit which captures a still image, a communication module which communicates with an external device, and a control unit which controls an edited image to be displayed.

摘要翻译： 公开了一种图像显示装置，图像编辑装置，图像编辑系统，图像显示方法和图像编辑方法。 图像显示装置包括拍摄静止图像的图像处理单元，与外部设备通信的通信模块以及控制要显示的编辑图像的控制单元。

公开(公告)号：US20120085574A1

公开(公告)日：2012-04-12

申请号：US13064364

申请日：2011-03-21

申请人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

发明人： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

IPC分类号： H05K1/14 ,  H05K3/42

CPC分类号： H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

摘要翻译： 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

公开(公告)号：US20120043875A1

公开(公告)日：2012-02-23

申请号：US12964285

申请日：2010-12-09

申请人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

发明人： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC分类号： H01J7/24 ,  H01R43/00

CPC分类号： H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

摘要翻译： 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。