公开(公告)号：US09144153B2

公开(公告)日：2015-09-22

申请号：US13551911

申请日：2012-07-18

申请人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  Il Yeon Cho

发明人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  Il Yeon Cho

IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K1/03 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40

CPC分类号： H05K1/038 ,  H05K1/141 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/055 ,  Y10T29/49155

摘要： A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.

摘要翻译： 织物的两面设有导电图案的织物类型电路板及其制造方法。 织物型电路板包括织物和导电图案，其中形成从织物的一侧向织物的另一侧折叠的延伸部分，其中导电图案使用铜膜转印印刷方案，印刷中的至少一种形成 ，蚀刻，刺绣和缝制。 一种制造织物类电路板的方法包括在织物上形成具有形成在其中的延伸单元的导电图案，切割其上形成有导电图案的织物的一部分，并且通过从一侧折叠延伸单元来形成接触表面 的织物的另一面。

公开(公告)号：US09082634B2

公开(公告)日：2015-07-14

申请号：US12981386

申请日：2010-12-29

申请人： Hee-Min Shin ,  Cheol-Ho Joh ,  Eun-Hye Do ,  Ji-Eun Kim ,  Kyu-Won Lee

发明人： Hee-Min Shin ,  Cheol-Ho Joh ,  Eun-Hye Do ,  Ji-Eun Kim ,  Kyu-Won Lee

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/117 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

摘要： A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

摘要翻译： 叠层封装包括覆盖膜，具有附接到覆盖膜的第一半导体芯片的第一封装，形成为密封第一半导体芯片的第一粘合构件和覆盖膜的表面，以及第一电路图案 其设置在第一粘合构件上并与第一半导体芯片电连接; 第二封装，设置在所述第一封装上，具有与所述第一电路图案电连接的第二半导体芯片，形成为密封所述第二半导体芯片的第二粘合构件，以及形成在所述第二粘合剂上的第二电路图案 以及形成为穿过第二电路图案和第二粘合构件并且与第一电路图案和第二电路图案电连接的通孔。

公开(公告)号：US08986555B2

公开(公告)日：2015-03-24

申请号：US12892047

申请日：2010-09-28

申请人： Ji-Eun Kim ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim

发明人： Ji-Eun Kim ,  Nam-Keun Oh ,  Jung-Hyun Park ,  Young-Ji Kim ,  Jong-Gyu Choi ,  Sang-Duck Kim

IPC分类号： H01B13/00 ,  H05K3/40 ,  H05K3/06 ,  H05K3/20

CPC分类号： H05K3/4007 ,  H05K3/061 ,  H05K3/205 ,  H05K2201/0367 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.

摘要翻译： 公开了一种制造具有凸块的印刷电路板的方法。 该方法包括制备其上形成有第一电路的第一载体，将第一载体压缩到绝缘层的一个表面，使得第一电路被掩埋，根据凸点将在第一载体上堆叠抗蚀剂 通过蚀刻第一载体形成和形成凸块。 根据本发明的实施例，可以减小印刷电路板中的凸块与其相邻凸块之间的高度差，从而可以更好地实现电子部件和印刷电路板之间的电连接。

公开(公告)号：US08947213B2

公开(公告)日：2015-02-03

申请号：US13576058

申请日：2011-01-24

申请人： Yong-Ho Woo ,  Ju-Ho Lee ,  Ji-Eun Kim

发明人： Yong-Ho Woo ,  Ju-Ho Lee ,  Ji-Eun Kim

IPC分类号： H04Q5/22 ,  G06Q10/08

CPC分类号： G06Q10/087

摘要： Present invention relates to method for confirming location of product using RFID. Method for confirming location of product on a shelf in a product location confirmation system including: a plurality of shelf areas; a location tag which is provided at each shelf and transmits an RFID signal; a reader which is provided at each shelf and reads the RFID signal; and a server for analyzing the information collected through the reader comprises the steps of: the reader confirming whether a location tag signal is received; the server determining the absence of the product on the corresponding shelf when the location tag signal is received; the reader confirming whether a product tag signal as the RFID signal transmitted from the product is received when the location tag signal is not received; and the server determining the presence of the product within the corresponding shelf when the product tag signal is received.

摘要翻译： 本发明涉及使用RFID确认产品位置的方法。 一种确定产品位置确认系统的货架上产品位置的方法，包括：多个货架区域; 位置标签，其设置在每个货架处，并发送RFID信号; 读取器，其设置在每个机架上并读取RFID信号; 以及用于分析通过读取器收集的信息的服务器，包括以下步骤：读取器确认是否接收到位置标签信号; 所述服务器在接收到所述位置标签信号时确定所述对应搁板上的产品不存在; 当没有接收到位置标签信号时，读取器确认是否接收到从产品发送的RFID信号的产品标签信号; 并且当接收到产品标签信号时，服务器确定在相应搁板内产品的存在。

公开(公告)号：US08934716B2

公开(公告)日：2015-01-13

申请号：US13599111

申请日：2012-08-30

申请人： Ho Sub Yoon ,  Ji Eun Kim ,  Kyu Dae Ban ,  Dong Jin Lee ,  Jae Hong Kim ,  Joo Chan Sohn

发明人： Ho Sub Yoon ,  Ji Eun Kim ,  Kyu Dae Ban ,  Dong Jin Lee ,  Jae Hong Kim ,  Joo Chan Sohn

IPC分类号： G06K9/34 ,  G06K9/46

CPC分类号： G06K9/00865 ,  G06K9/3258 ,  G06K9/348 ,  G06K2209/01

摘要： Disclosed is a method of sequencing character information in order to increase precision of character recognition. The method includes: a pre-processing that extracts character information from an image to binarize the extracted character information through a predetermined threshold and extracts and thins a center line of the binarized character information; normalizing the pre-processed character information to character information according to a predetermined criteria; and sequencing the normalized character information using structural features including an end point or a divergence point of the character information. The present invention suggests an angle normalization method of input character information, a structural feature position determining method, and a structural feature numeral string generating method to strongly recognize characters configured by various fonts obtained from a natural scene regardless of an angle or a size of the characters.

摘要翻译： 公开了一种对字符信息进行排序以提高字符识别精度的方法。 该方法包括：预处理，其从图像提取字符信息，以将所提取的字符信息二值化为预定阈值，并提取并清除二值化字符信息的中心线; 根据预定标准将预处理字符信息规范化为字符信息; 以及使用包括字符信息的终点或发散点的结构特征对归一化字符信息进行排序。 本发明提出一种输入字符信息的角度归一化方法，结构特征位置确定方法和结构特征数字串生成方法，用于强烈地识别从自然场景获得的各种字体配置的字符，而不管角度或尺寸如何 人物。

公开(公告)号：US08913332B2

公开(公告)日：2014-12-16

申请号：US13604347

申请日：2012-09-05

申请人： Pil Sun Jung ,  Hyoung Bae Park ,  Chi Ho An ,  Jae Hoon Cho ,  Ji Eun Kim

发明人： Pil Sun Jung ,  Hyoung Bae Park ,  Chi Ho An ,  Jae Hoon Cho ,  Ji Eun Kim

IPC分类号： G02B13/00 ,  G02B3/04

CPC分类号： G02B13/0045 ,  G02B3/04

摘要： A lens optical system including first, second, third, fourth, and fifth lenses that are sequentially arranged between an object and an image sensor on which an image of the object is formed. The first lens may have a positive refractive power and may be biconvex. The second lens may have a negative refractive power and may have a meniscus shape that is convex toward the object. The third lens may have a positive refractive power. The fourth lens may have a positive refractive power and may have a meniscus shape that is convex toward the image sensor. The fifth lens may have a negative refractive power, and at least one of an incident surface and an exit surface of the fifth lens may be an aspherical surface.

摘要翻译： 一种透镜光学系统，包括顺序地布置在物体和形成有物体的图像的图像传感器之间的第一，第二，第三，第四和第五透镜。 第一透镜可以具有正屈光力并且可以是双凸面。 第二透镜可以具有负折光力并且可以具有朝向物体凸出的弯月形状。 第三透镜可以具有正折射光焦度。 第四透镜可以具有正折射光焦度并且可以具有向图像传感器凸起的弯月形状。 第五透镜可以具有负折光力，并且第五透镜的入射表面和出射表面中的至少一个可以是非球面。

公开(公告)号：US08633392B2

公开(公告)日：2014-01-21

申请号：US13354438

申请日：2012-01-20

申请人： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

发明人： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC分类号： H05K1/02

CPC分类号： H05K1/0265 ,  H05K1/116 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361

摘要： A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.

摘要翻译： 一种电路板，包括：具有沟槽的绝缘体; 形成为埋入沟槽的一部分的第一电路图案; 以及形成在其中形成有沟槽的绝缘体的表面上的第二电路图案。

公开(公告)号：US08564141B2

公开(公告)日：2013-10-22

申请号：US13038831

申请日：2011-03-02

申请人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

发明人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.

摘要翻译： 芯片单元包括：第一半导体芯片和第二半导体芯片，其布置成使得其用于形成第一焊盘和第二焊盘的表面彼此面对; 第一和第二连接构件，设置在第一和第二半导体芯片的表面上，用于形成第一和第二接合焊盘，并且具有一端与第一和第二接合焊盘连接的再分配线，另一端突出超过 第一和第二半导体芯片和薄膜; 插入在所述第一连接构件和所述第二连接构件之间的粘合构件; 并且通过图案通过粘合构件并将第一和第二连接构件的再分配线的突出部彼此连接。

公开(公告)号：US20130265652A1

公开(公告)日：2013-10-10

申请号：US13588583

申请日：2012-08-17

申请人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

发明人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

IPC分类号： G02B13/18 ,  G02B9/34

CPC分类号： G02B13/004 ,  G02B5/208 ,  G02B13/18

摘要： A lens optical system includes first, second, third, and fourth lenses that are arranged between an object and an image sensor, in order from an object side, wherein the first lens has positive refractive power and an incident surface that is convex toward the object, the second lens has negative refractive power and both surfaces of which are concave, the third lens has positive refractive power and a meniscus shape that is convex toward the image sensor, and the fourth lens has negative refractive power and at least one of an incident surface and an exit surface of which is an aspherical surface, wherein the system satisfies the inequality, 3.0

摘要翻译： 透镜光学系统包括从物体侧开始依次布置在物体和图像传感器之间的第一透镜，第二透镜，第三透镜​​和第四透镜，其中第一透镜具有正折光力，并且朝向物体凸出的入射表面 第二透镜具有负屈光力并且其两个表面都是凹形的，第三透镜​​具有正的折光力和朝向图像传感器凸起的弯月形状，并且第四透镜具有负折光力，并且至少一个入射 表面，其出射表面是非球面，其中系统满足不等式3.0

公开(公告)号：US08546943B2

公开(公告)日：2013-10-01

申请号：US12923037

申请日：2010-08-30

申请人： Jung Hyun Park ,  Nam Keun Oh ,  Sang Duck Kim ,  Jong Gyu Choi ,  Young Ji Kim ,  Ji Eun Kim ,  Myung Sam Kang

发明人： Jung Hyun Park ,  Nam Keun Oh ,  Sang Duck Kim ,  Jong Gyu Choi ,  Young Ji Kim ,  Ji Eun Kim ,  Myung Sam Kang

IPC分类号： H01L23/13 ,  H01L23/498

CPC分类号： H01L21/76885 ,  H01L21/02112 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.

摘要翻译： 提供了一种球栅阵列基板，半导体芯片封装及其制造方法。 球栅阵列基板包括绝缘层，其具有提供半导体芯片的安装区域的第一表面，与第一表面相对的第二表面和连接第二表面与半导体芯片的安装区域的开口，以及电路图案 埋在第二面。 由于球栅阵列基板通过堆叠两个绝缘层的方法制造，因此可以使用现有的装置，并且可以将球栅阵列基板制造为超薄板。 此外，由于电路图案被埋在绝缘层中，因此可以形成高密度电路图案。