公开(公告)号：US08338941B2

公开(公告)日：2012-12-25

申请号：US12805131

申请日：2010-07-14

申请人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

发明人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.

摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。

公开(公告)号：US08569114B2

公开(公告)日：2013-10-29

申请号：US12788956

申请日：2010-05-27

申请人： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

发明人： Choongbin Yim ,  Seungkon Mok ,  Donghan Kim ,  Jin-Woo Park ,  PaLan Lee ,  Mi-yeon Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/04 ,  H01L23/3128 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2224/0401

摘要： Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a molding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the molding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously formed.

摘要翻译： 提供一种形成半导体封装的方法。 在该方法中，形成包括在第一基板上的第一芯片的第一封装，在第二基板上形成包括第二芯片的第二封装，设置有通孔和凹陷结构的成型盖， 并且所述第二包装设置在所述第一包装上，所述模制帽在其间，使得所述凹部接收所述第一芯片。 通孔和凹槽结构同时形成。

公开(公告)号：US08531034B2

公开(公告)日：2013-09-10

申请号：US13244506

申请日：2011-09-25

申请人： Hak-Kyoon Byun ,  Dae-Young Choi ,  Mi-Yeon Kim

发明人： Hak-Kyoon Byun ,  Dae-Young Choi ,  Mi-Yeon Kim

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17179 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.

公开(公告)号：US20130001800A1

公开(公告)日：2013-01-03

申请号：US13614931

申请日：2012-09-13

申请人： Tae-Hun KIM ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

发明人： Tae-Hun KIM ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/14 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00012

摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

摘要翻译： 提供了一种形成封装封装的方法。 使用晶片级成型工艺形成覆盖晶片的封装。 晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。 密封剂可以具有与TSV对齐的开口。 密封剂和半导体芯片被分割以形成多个半导体封装。 另一个半导体封装堆叠在从半导体封装中选择的一个上。 另一个半导体封装电连接到TSV。

公开(公告)号：US08293580B2

公开(公告)日：2012-10-23

申请号：US13027511

申请日：2011-02-15

申请人： Tae-Hun Kim ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

发明人： Tae-Hun Kim ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L23/5226 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/14 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00012

摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

摘要翻译： 提供了一种形成封装封装的方法。 使用晶片级成型工艺形成覆盖晶片的封装。 晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。 密封剂可以具有与TSV对齐的开口。 密封剂和半导体芯片被分割以形成多个半导体封装。 另一个半导体封装堆叠在从半导体封装中选择的一个上。 另一个半导体封装电连接到TSV。

公开(公告)号：US20110215451A1

公开(公告)日：2011-09-08

申请号：US13029736

申请日：2011-02-17

申请人： Choong-Bin Yim ,  Seung-Kon Mok ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim

发明人： Choong-Bin Yim ,  Seung-Kon Mok ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim

IPC分类号： H01L25/11

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00012

摘要： Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

摘要翻译： 半导体封装包括第一半导体封装，包括第一印刷电路板和安装在第一印刷电路板上的第一半导体器件，以及堆叠在第一半导体封装上的第二半导体封装，并且包括第二印刷电路板和第二半导体 装置安装在第二印刷电路板上。 半导体封装包括至少一个第一通孔，其通过第一半导体器件将第二半导体封装电连接到第一印刷电路板。

公开(公告)号：US20080294632A1

公开(公告)日：2008-11-27

申请号：US12158235

申请日：2006-12-20

申请人： Joon-Kee Chang ,  Soon-Sik So ,  Mi-Yeon Kim

发明人： Joon-Kee Chang ,  Soon-Sik So ,  Mi-Yeon Kim

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06F16/9558 ,  G06F16/38

摘要： A method, a system and a recorded medium for sorting and searching files are disclosed. A method of sorting and searching files have the steps of (a) outputting an annotation interface for an original file selected by a user, (b) receiving annotation details inputted through the annotation interface, (c) generating an annotation file in accordance with the annotation details, and (d) storing the annotation file. With the present invention, the efficient sorting and searching of files can be easily performed by using all kinds of fields stored in a user terminal.

摘要翻译： 公开了一种用于排序和搜索文件的方法，系统和记录介质。 一种分类和搜索文件的方法具有以下步骤：（a）输出用户选择的原始文件的注释界面，（b）接收通过注释界面输入的注释细节，（c）根据 注释细节，（d）存储注释文件。 利用本发明，可以通过使用存储在用户终端中的各种字段来容易地执行文件的有效排序和搜索。

公开(公告)号：US20060287907A1

公开(公告)日：2006-12-21

申请号：US10553479

申请日：2004-05-13

申请人： Mi Yeon Kim

发明人： Mi Yeon Kim

IPC分类号： G06F17/30

CPC分类号： G06Q10/00 ,  G06Q30/00 ,  G06Q30/02 ,  G06Q30/0203

摘要： The present invention relates to a method for providing answers to a question wherein the quality of the question and answer data posted by users is evaluated to improve the quality of the question and answer in an answer and question service in which the users can ask questions and give answers on the Internet. According to the present invention, there is provided a method for providing answers to a question, which is performed on the Internet, comprising the steps of: receiving a question from a first user, providing the question on a given web page, receiving evaluation data for the question from a second user or an operator of the web page, calculating evaluation result data by reflecting the evaluation data, and providing the evaluation result data on the web page in association with the question.

摘要翻译： 本发明涉及一种用于提供问题的答案的方法，其中评估用户发布的问题和答案数据的质量，以提高用户可以提出问题的答案和问题服务中的问题和答案的质量， 在互联网上给出答案。 根据本发明，提供了一种用于提供在互联网上执行的问题的答案的方法，包括以下步骤：从第一用户接收问题，在给定网页上提供问题，接收评估数据 对于来自网页的第二用户或操作者的问题，通过反映评估数据来计算评估结果数据，以及将评估结果数据与该问题相关联地提供在网页上。