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    Energy absorbing assembly
    21.
    发明授权
    Energy absorbing assembly 有权
    能量吸收组件

    公开(公告)号：US08851539B2

    公开(公告)日：2014-10-07

    申请号：US13477367

    申请日：2012-05-22

    Applicant: Dinesh Mana ,  Taehoon Kim

    Inventor： Dinesh Mana ,  Taehoon Kim

    IPC: B60R19/03

    CPC classification number: B60R19/18 ,  B60R19/03 ,  B60R2019/1846

    Abstract: An energy absorbing assembly for impact energy absorption can comprise: an elongated plastic member having a major axis, a first side and a second side, comprising a central portion disposed between a first end portion and a second end portion, the second side defines a channel extending from the first end portion to the second end portion; and an elongated insert having a front, edges, tips, and a rear, wherein the insert is configured to flex upon impact, and is removably friction fit within the channel such that the plastic member surrounds the front, and greater than or equal to 50% of the edges and tips. The energy absorbing assembly can be configured to attach to a vehicle to absorb energy absorption impact. A vehicle can comprise: a vehicle rail and the energy absorbing assembly attached to the vehicle rail.

    Abstract translation: 用于冲击能量吸收的能量吸收组件可以包括：具有长轴的细长塑料构件，第一侧和第二侧，包括设置在第一端部和第二端部之间的中心部分，第二侧限定通道 从所述第一端部延伸到所述第二端部; 以及具有前部，边缘，尖端和后部的细长插入件，其中所述插入件构造成在冲击时弯曲，并且可移除地摩擦配合在所述通道内，使得所述塑料构件围绕所述前部，并且大于或等于50 ％的边缘和尖端。 能量吸收组件可以被配置成附接到车辆以吸收能量吸收冲击。 车辆可以包括：车辆轨道和附接到车辆轨道的能量吸收组件。

    METHOD FOR MANUFACTURING MODEL
    22.
    发明申请
    METHOD FOR MANUFACTURING MODEL 审中-公开
    制造模型的方法

    公开(公告)号：US20140082917A1

    公开(公告)日：2014-03-27

    申请号：US14118921

    申请日：2011-06-13

    Applicant: Taehoon Kim

    Inventor： Taehoon Kim

    IPC: B23P19/04

    CPC classification number: B23P19/04 ,  A63F9/1288 ,  A63F2009/1292 ,  A63F2009/1296 ,  A63H9/00 ,  A63H33/42 ,  B44C3/025 ,  B44C3/12 ,  G09B19/10 ,  Y10T29/49789 ,  Y10T29/49798 ,  Y10T29/49826 ,  Y10T29/49885

    Abstract: A method for manufacturing a model is disclosed. The disclosed method for manufacturing the model comprises the steps of: a) preparing a plurality of pieces having contours in the shape of cross-sections of an object from specific distances away from a random axis direction; and b) assembling the plurality of pieces according to an integration process of connecting surfaces of adjacent pieces from the plurality of pieces and fixing same to each other so as to form the model which corresponds to the shape of the object.

    Abstract translation: 公开了一种用于制造模型的方法。 所公开的用于制造模型的方法包括以下步骤：a）准备多个具有距离随机轴方向特定距离的物体的横截面形状的轮廓的部件; 以及b）根据从所述多个片的相邻片的连接表面的整合过程将所述多个片组合，并将它们彼此固定，以形成与所述物体的形状对应的模型。

    Method of manufacturing build-up printed circuit board
    29.
    发明授权
    Method of manufacturing build-up printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US07707716B2

    公开(公告)日：2010-05-04

    申请号：US11709215

    申请日：2007-02-22

    Applicant: Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    Inventor： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    IPC: H01K3/10

    CPC classification number: H05K3/381 ,  H05K3/108 ,  H05K3/146 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

    Abstract translation: 一种积层印刷电路板的制造方法，其中通过使用干法形成芯层的金属种子层来实现包括芯层和外层的积层印刷电路板的电路，其包括 的离子束表面处理和真空沉积，而不是常规的湿法，包括湿表面粗糙化处理和无电镀。 当在本发明的方法中用干法代替湿法时，电路层可以以环境友好的方式形成，并且可以制造包括芯层和外层的基片的所有电路层 通过半加成过程。 此外，可以提高树脂基板和金属层之间的剥离强度，从而实现高可靠性的精细电路。

    Apparatus for dry-surface cleaning using a laser
    30.
    发明申请
    Apparatus for dry-surface cleaning using a laser 审中-公开
    使用激光干燥表面清洁的设备

    公开(公告)号：US20060108330A1

    公开(公告)日：2006-05-25

    申请号：US11194445

    申请日：2005-08-02

    Applicant: Jong-Myoung Lee ,  Taehoon Kim

    Inventor： Jong-Myoung Lee ,  Taehoon Kim

    IPC: B23K26/00

    CPC classification number: C21D10/005 ,  B08B7/0042

    Abstract: A dry-surface cleaning apparatus includes a laser for generating laser beams, a focus lens for generating a plasma shock wave around a laser focus by converging the laser beams into the laser focus around a workpiece to be cleaned, wherein contaminants on the workpiece are removed by colliding the plasma shock wave against the workpiece, and a thermal radiation protector for avoiding a surface damage on the workpiece induced by a plasma thermal radiation entailed by the generation of the plasma shock wave. The thermal radiation protector is installed between the laser focus and the workpiece and is extended toward a downstream of the laser focus to a position where a portion of remaining laser beam when generating the plasma shock wave reaches in order to reflect the remaining laser beam.

    Abstract translation: 干式表面清洁装置包括用于产生激光束的激光器，聚焦透镜，用于通过将激光束聚焦在待清洁的工件周围的激光焦点中来产生激光焦点周围的等离子体冲击波，其中去除工件上的污染物 通过使等离子体冲击波与工件相撞，以及热辐射保护器，用于避免由等离子体冲击波的产生所引起的等离子体热辐射引起的对工件的表面损伤。 热辐射保护器安装在激光焦点和工件之间，并且朝向激光焦点的下游延伸到当产生等离子体冲击波时剩余激光束的一部分到达以便反射剩余的激光束的位置。

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