公开(公告)号：US5563442A

公开(公告)日：1996-10-08

申请号：US449503

申请日：1995-05-24

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.

Abstract translation: 公开了一种用于将半导体器件电连接到外部电路的引线框架。 引线框架具有涂覆有抗氧化外层的导电基板。 在衬底的一部分和外部层之间设置中间层。 引线框的外引线端不存在中间层。 随后从外部引线端部移除外部层使得焊料能够直接接触引线框架基板。

公开(公告)号：US5540378A

公开(公告)日：1996-07-30

申请号：US126862

申请日：1993-09-27

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L21/58 ,  H01L23/532

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

Abstract translation: 公开了一种用于组装电子封装的方法，其中引线框的外引线端可焊接到外部电路，而不需要锡或焊料涂层。 在封装组装之前，在引线框架上沉积抗氧化层。 在外部引线焊接之前去除抗氧化层，提供清洁，无氧化的金属表面进行焊接。

公开(公告)号：US5534356A

公开(公告)日：1996-07-09

申请号：US427921

申请日：1995-04-26

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B9/00

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的可阳极氧化的铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。

公开(公告)号：US5449951A

公开(公告)日：1995-09-12

申请号：US270064

申请日：1994-07-01

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/043 ,  H01L23/544

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

Abstract translation: 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬，锌或铬和锌的混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US5234536A

公开(公告)日：1993-08-10

申请号：US858791

申请日：1992-04-01

Applicant: Arvind Parthasarathi ,  Jeffrey S. Braden

Inventor： Arvind Parthasarathi ,  Jeffrey S. Braden

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/495 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/002 ,  H01L21/4839 ,  H01L23/145 ,  H01L23/49572 ,  H05K3/4092 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2203/063 ,  H05K2203/1545 ,  H05K3/0041 ,  H05K3/386 ,  H05K3/4652

Abstract: A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate and patterned into a plurality of circuit traces. These steps may be repeated a plurality of time for a multi-metal layer structure.

Abstract translation: 提供了一种制造电子电路的方法。 基板通过蚀刻设置有索引装置和个性窗口。 粘合剂沉积在基材的一个表面上，以至少涂覆那些要层压到金属箔上的区域。 箔结合到非导电衬底并图案化成多个电路迹线。 对于多金属层结构，这些步骤可以重复多次。

公开(公告)号：US4568431A

公开(公告)日：1986-02-04

申请号：US748104

申请日：1985-06-24

Applicant: Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi

Inventor： Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi

IPC: C25D21/06 ,  C25D21/18 ,  C25D1/04 ,  C25D7/06

CPC classification number: C25D21/18 ,  C25D21/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723 ,  Y10S204/13

Abstract: The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.

Abstract translation: 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。

公开(公告)号：US4551210A

公开(公告)日：1985-11-05

申请号：US670238

申请日：1984-11-13

Applicant: Arvind Parthasarathi

Inventor： Arvind Parthasarathi

IPC: C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K3/24 ,  H05K3/38 ,  C25D17/00

CPC classification number: H05K3/384 ,  C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/241

Abstract: The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.

Abstract translation: 本发明涉及一种用于改善金属和金属合金材料，特别是铜和铜合金箔的层压粘合性的处理。 处理包括在金属或金属合金材料的表面上电解形成多个枝晶并将枝晶粘合到其上。 枝晶通过一个或多个处理阳极形成在金属或金属合金材料表面上并与金属或金属合金材料表面结合，所述一个或多个处理阳极与被处理材料成一定角度，并且具有单个电流源。

公开(公告)号：US4532014A

公开(公告)日：1985-07-30

申请号：US670235

申请日：1984-11-13

Applicant: Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi ,  Peter E. Sevier

Inventor： Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi ,  Peter E. Sevier

IPC: C25D1/04 ,  C25D7/06 ,  C25D5/04 ,  C25D17/00

CPC classification number: C25D1/04 ,  C25D7/0614 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723

Abstract: The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.

Abstract translation: 本发明涉及一种用于对准金属或金属合金箔生产线中的多个辊的系统。 对准系统包括参考框架，其具有平行于通过生产线的箔片行进方向的纵向尺寸和可移动地安装到框架的光学对准系统。 光学对准系统包括激光束发生器，分束器和用于产生用于对准生产线中的每个箔接触辊的正交参考系的反射镜。