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95 条记录 (耗时 0.019 秒)

    CIRCUIT BOARD FOR BODY FLUID COLLECTION, AND BIOSENSOR
    21.
    发明申请
    CIRCUIT BOARD FOR BODY FLUID COLLECTION, AND BIOSENSOR 审中-公开
    身体液体收集电路板和生物传感器

    公开(公告)号：US20100331729A1

    公开(公告)日：2010-12-30

    申请号：US12735923

    申请日：2009-01-21

    申请人： Toshiki Naito ,  Tetsuya Ohsawa

    发明人： Toshiki Naito ,  Tetsuya Ohsawa

    IPC分类号： A61B5/151

    CPC分类号： A61B5/150503 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150358 ,  A61B5/150427 ,  A61B5/150435 ,  A61B5/15142 ,  A61B5/15186 ,  A61B2562/0295 ,  H05K1/118

    摘要： A circuit board for body fluid collection include a first substrate including a puncture needle; a second substrate disposed at an upstream side of the first substrate in a direction of puncturing with the puncture needle with a space provided therebetween; a flexible insulation layer that extends between the first substrate and the second substrate; and a conductive pattern provided on the flexible insulation layer, the conductive pattern integrally including an electrode, a terminal, and a wiring that electrically connects the electrode and the terminal.

    摘要翻译： 用于体液收集的电路板包括：包括穿刺针的第一基底; 第二基板，其设置在所述第一基板的上游侧，沿着与所述穿刺针穿刺的方向，其间设置有间隙; 柔性绝缘层，其在所述第一基板和所述第二基板之间延伸; 以及设置在所述柔性绝缘层上的导电图案，所述导电图案一体地包括电极，端子和将所述电极和所述端子电连接的布线。

    SUBSTANCE DETECTION SENSOR
    22.
    发明申请
    SUBSTANCE DETECTION SENSOR 有权
    物质检测传感器

    公开(公告)号：US20100072065A1

    公开(公告)日：2010-03-25

    申请号：US12448853

    申请日：2007-10-16

    申请人： Toshiki Naito ,  Hiroshi Yamazaki ,  Toshihiko Omote

    发明人： Toshiki Naito ,  Hiroshi Yamazaki ,  Toshihiko Omote

    IPC分类号： G01N27/26

    CPC分类号： G01N27/12 ,  G01N27/126

    摘要： A substance detection sensor comprises an insulation layer (2) having flexibility, two electrodes (3A, 3B) so disposed on the insulation layer as to be opposite to each other at a space therebetween and connected to an electric resistance detector, and a conductive layer (4) which is so formed on the insulation layer as to span the two electrodes and to be electrically connected to the two electrodes. The swelling ratio of the conductive layer (4) is changed according to the type and/or the quantity of a specific substance.

    摘要翻译： 一种物质检测传感器包括具有柔性的绝缘层（2），两个电极（3A，3B），其设置在绝缘层上，在它们之间的空间处彼此相对并连接到电阻检测器，以及导电层 （4），其形成在绝缘层上以跨越两个电极并与两个电极电连接。 导电层（4）的溶胀比根据特定物质的种类和/或数量而改变。

    Suspension board with circuit and producing method thereof
    23.
    发明申请
    Suspension board with circuit and producing method thereof 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US20100002986A1

    公开(公告)日：2010-01-07

    申请号：US12457617

    申请日：2009-06-17

    申请人： Toshiki Naito ,  Jun Ishii

    发明人： Toshiki Naito ,  Jun Ishii

    IPC分类号： G02B6/12 ,  H05K3/00

    CPC分类号： H05K1/0274 ,  G02B6/423 ,  G11B5/486 ,  G11B5/4866 ,  H05K1/056 ,  Y10T29/49124

    摘要： A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is adhered on the metal supporting board, the insulating base layer, or the insulating cover layer.

    摘要翻译： 具有电路的悬挂板包括金属支撑板; 形成在金属支撑板上的绝缘基底层; 形成在绝缘基底层上的导电图案; 绝缘覆盖层，形成在所述绝缘基底层上以覆盖所述导电图案; 和光波导。 光波导粘附在金属支撑板，绝缘基底层或绝缘覆盖层上。

    Suspension Board with Circuit and Production Method Thereof
    24.
    发明申请
    Suspension Board with Circuit and Production Method Thereof 审中-公开
    具有电路和制造方法的悬架

    公开(公告)号：US20090255717A1

    公开(公告)日：2009-10-15

    申请号：US12385626

    申请日：2009-04-14

    申请人： Aya Mizushima ,  Toshiki Naito

    发明人： Aya Mizushima ,  Toshiki Naito

    IPC分类号： H05K1/03 ,  C25D5/02

    CPC分类号： H05K3/44 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/108 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09718 ,  H01L2924/00

    摘要： A suspension board with circuit includes an insulating layer formed with a first opening, a conductive layer formed on the insulating layer so as to fill the first opening, a metal thin film formed so as to cover a surface of the conductive layer exposed from the first opening, and be interposed between the conductive layer and the insulating layer, and a metal supporting layer formed with a second opening surrounding the first opening so as to underlie the insulating layer. The metal supporting layer includes a covering portion provided in the second opening so as to cover the first opening.

    摘要翻译： 具有电路的悬挂板包括形成有第一开口的绝缘层，形成在绝缘层上以便填充第一开口的导电层，形成为覆盖从第一开口露出的导电层的表面的金属薄膜 开口并插入在导电层和绝缘层之间，金属支撑层形成有围绕第一开口的第二开口，以便在绝缘层的下面。 金属支撑层包括设置在第二开口中以覆盖第一开口的覆盖部分。

    Production method of wired circuit board
    26.
    发明授权
    Production method of wired circuit board 失效
    有线电路板的生产方法

    公开(公告)号：US06996901B2

    公开(公告)日：2006-02-14

    申请号：US10992009

    申请日：2004-11-19

    申请人： Mitsuru Honjo ,  Toshiki Naito

    发明人： Mitsuru Honjo ,  Toshiki Naito

    IPC分类号： H05K3/02

    CPC分类号： H05K3/108 ,  H05K3/062 ,  H05K2201/0347 ,  H05K2203/0542 ,  H05K2203/0597 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A production method of a wired circuit board can prevent corrosion of a first thin metal film inwardly of a conductor layer, due to the forming of an undercut portion caused by a skirt portion of a plating resist. A first thin metal film is formed on an insulating base layer. A plating resist is formed in a reversal pattern to a wiring circuit pattern on the first thin metal film, and a conductor layer is formed in the wiring circuit pattern on the first thin metal film exposed from the plating resist. Thereafter, the plating resist is removed and, then, a second thin metal film is formed on the conductor layer and first thin metal film. Thereafter, the second thin metal film and then all portions of the first thin metal layer, except portions thereof where the conductor layer is formed, are removed.

    摘要翻译： 由于形成由电镀抗蚀剂的裙部引起的底切部分，布线电路板的制造方法可以防止导体层内部的第一薄金属膜的腐蚀。 第一薄金属膜形成在绝缘基底层上。 以与第一薄金属膜上的布线电路图案相反的图案形成电镀抗蚀剂，并且在从电镀抗蚀剂暴露的第一薄金属膜上的布线电路图案中形成导体层。 然后，除去电镀抗蚀剂，然后在导体层和第一薄金属膜上形成第二薄金属膜。 此后，除去第二薄金属膜，然后除去其中形成导体层的部分之外的第一薄金属层的所有部分。

    Wired circuit forming board, wired circuit board, and thin metal layer forming method
    27.
    发明申请
    Wired circuit forming board, wired circuit board, and thin metal layer forming method 有权
    有线电路板，布线电路板和薄金属层成型方法

    公开(公告)号：US20050280153A1

    公开(公告)日：2005-12-22

    申请号：US11147345

    申请日：2005-06-08

    申请人： Toshiki Naito ,  Hiroshi Yamazaki

    发明人： Toshiki Naito ,  Hiroshi Yamazaki

    IPC分类号： C23C14/14 ,  C23C14/16 ,  C23C14/56 ,  H01L21/44 ,  H01L29/40 ,  H05K3/10 ,  H05K3/38

    CPC分类号： C23C14/562 ,  C23C14/16 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/0338 ,  H01L2924/00

    摘要： A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer 2 is formed on the insulating base layer 1 by sputtering the first metal 35 and the second metal 36 in such a condition that a first metal diffusing region 37 for the first metal 35 to be diffused and a second metal diffusing region 38 for the second metal 36 to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion 4 in which the first metal 35 is unevenly distributed and which is adjacent to the insulating base layer 1, (ii) a second unevenly-distributed metal portion 5 in which the second metal 36 is unevenly distributed and which is adjacent to the conductive pattern 6, and (iii) a metal coexisting portion 3 which is interposed between the first unevenly-distributed metal portion 4 and the second unevenly-distributed metal portion 5 and in which the first metal 35 and the second metal 36 are coexistent with each other in such a relation as to be continuously present in the thin metal layer 2 without defining any boundaries therebetween.

    摘要翻译： 一种布线电路形成板，其能够提供绝缘层和导电图案之间的改善的粘附性，并且还可以防止薄金属层中的分层，使用相同布线电路形成板的布线电路板和形成金属层的薄金属层 用于形成薄金属层的方法。 薄金属层2通过溅射第一金属35和第二金属36而形成在绝缘基底层1上，使得要扩散的第一金属35的第一金属扩散区37和第二金属扩散区38 因为要扩散的第二金属36彼此重叠。 这可以形成（i）第一不均匀分布的金属部分4，其中第一金属35不均匀地分布并且与绝缘基底层1相邻，（ii）第二不均匀分布的金属部分5，其中 第二金属36不均匀分布并且与导电图案6相邻，以及（iii）介于第一不均匀分布的金属部分4和第二不均匀分布的金属部分5之间的金属共存部分3，其中 第一金属35和第二金属36彼此共存，从而连续地存在于薄金属层2中而不在其间限定任何边界。

    Wired circuit board and producing method thererof
    30.
    发明授权
    Wired circuit board and producing method thererof 有权
    有线电路板及其制造方法

    公开(公告)号：US08354597B2

    公开(公告)日：2013-01-15

    申请号：US12216511

    申请日：2008-07-07

    申请人： Takahiko Yokai ,  Toshiki Naito

    发明人： Takahiko Yokai ,  Toshiki Naito

    IPC分类号： H05K1/03 ,  G11B5/48 ,  H05K1/00

    CPC分类号： H05K1/05 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/0723 ,  Y10T29/49124

    摘要： A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.

    摘要翻译： 布线电路板包括具有至少一个凹陷部分的金属支撑板，嵌入至少一个凹陷部分中的导电部分并且由具有比金属支撑板的导电性更高的导电性的材料形成，绝缘层形成在 金属支撑板以覆盖导电部分，并且以相互间隔的关系形成在绝缘层上以与导电部分相对的多个导线。