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公开(公告)号：US07750455B2
公开(公告)日：2010-07-06
申请号：US12188210
申请日：2008-08-08
申请人： Reza Argenty Pagaila , Byung Tai Do
发明人： Reza Argenty Pagaila , Byung Tai Do
IPC分类号： H01L23/02 , H01L23/538
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/30107 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit package system includes: providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof.
摘要翻译： 集成电路封装系统包括：提供第一封装，其具有安装在第一集成电路上的第一插入件和由第一封装封装的第一集成电路; 并且在所述第一插入件上连接第二封装，并且在所述第一封装上，所述第二封装包括其上具有线内胶粘剂的第二集成电路，安装在所述线对膜粘合剂上并由第二封装体封装的第二插入件 封装第二集成电路的封装，第二插入器包括用于将第三封装连接到其顶部的互连焊盘。
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公开(公告)号：US20100033941A1
公开(公告)日：2010-02-11
申请号：US12188995
申请日：2008-08-08
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/31 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.
摘要翻译： 集成电路封装系统包括：提供衬底; 在基板上方安装集成电路; 使用线内胶粘剂将插入件连接到集成电路; 将具有上表面的暴露的互连件连接到所述基板; 并用封装封装集成电路。
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23.发明授权Integrated circuit packaging system having planar interconnect and method for manufacture thereof 有权具有平面互连的集成电路封装系统及其制造方法公开(公告)号：US09029205B2
公开(公告)日：2015-05-12
申请号：US13041869
申请日：2011-03-07
CPC分类号： H01L23/5385 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/13 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/105 , H01L2224/04042 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/06135 , H01L2224/06136 , H01L2224/13099 , H01L2224/131 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4918 , H01L2224/73215 , H01L2224/73265 , H01L2225/1023 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.
摘要翻译： 一种用于制造集成电路封装系统的方法，包括：在集成电路的非有源侧上将具有平面互连的集成电路安装在载体上，其中所述平面互连面与所述载体的非有源侧的有源侧 ; 连接集成电路和载体; 连接平面互连和载体; 以及在集成电路，载体和平面互连上形成封装。
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24.发明授权Integrated circuit packaging system with lead encapsulation and method of manufacture thereof 有权具有铅封装的集成电路封装系统及其制造方法公开(公告)号：US08519518B2
公开(公告)日：2013-08-27
申请号：US12890409
申请日：2010-09-24
IPC分类号： H01L23/495
CPC分类号： H01L21/4832 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85439 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
摘要翻译： 一种集成电路封装系统的制造方法，包括：形成封装焊盘; 在所述封装焊盘附近形成引线，所述引线在引线主体顶侧具有孔和从引线非水平侧突出的引线脊; 在封装桨上安装集成电路; 将电连接器连接到引线和集成电路; 并在孔内形成填充层。
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25.发明授权Integrated circuit packaging system with film encapsulation and method of manufacture thereof 有权具有膜封装的集成电路封装系统及其制造方法公开(公告)号：US08378477B2
公开(公告)日：2013-02-19
申请号：US12882067
申请日：2010-09-14
IPC分类号： H01L23/02
CPC分类号： H01L24/97 , H01L21/561 , H01L21/566 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/50 , H01L2224/13025 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2924/3511 , H01L2224/81 , H01L2924/00011 , H01L2924/00012 , H01L2924/00 , H01L2224/13099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基板底面和与基板底面相对的基板顶面的封装基板; 将集成电路安装在封装基板上，该集成电路具有非活动侧和与非活动侧相对的有效侧; 将堆叠连接器连接到基板顶侧; 在基板顶侧，集成电路和堆叠连接器上施加多层膜，具有基膜层，可穿透膜层和可穿透粘合剂的多层膜; 去除基膜层和可穿透膜层以暴露可穿透粘合剂和堆叠连接器的暴露部分; 以及通过使可渗透的粘合剂硬化来形成粘合剂膜层。
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公开(公告)号：US08334169B2
公开(公告)日：2012-12-18
申请号：US13095680
申请日：2011-04-27
CPC分类号： H01L23/3128 , H01L21/76898 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2224/94 , H01L2225/0651 , H01L2225/1023 , H01L2225/1052 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/10156 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/03 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有有源侧和非有源侧的集成电路; 通过集成电路形成通道; 从非活动侧的周边区域形成具有凸缘和凹口侧的凹口; 以及在缩进下形成具有偏移段，倾斜段和凸缘段的共形互连。
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27.发明授权Integrated circuit packaging system with interposer and method of manufacture thereof 有权具有插入器的集成电路封装系统及其制造方法公开(公告)号：US08143098B2
公开(公告)日：2012-03-27
申请号：US12411040
申请日：2009-03-25
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L22/32 , H01L23/3107 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device contacts at a device perimeter region of the interposer with the device perimeter region within the interior of the interconnect perimeter region, and the test pads at a test perimeter region of the interposer with the test perimeter region encompassing the device perimeter region; and mounting an integrated circuit over the device contacts.
摘要翻译： 一种制造集成电路封装系统的方法包括：提供具有器件触点，互连触点和测试焊盘的插入件，所述测试焊盘包括沿插入器的互连周边区域的互连触点，该器件在插入器的器件周边区域处接触， 所述互连周边区域内部的所述设备周边区域以及所述插入器的测试周边区域处的所述测试焊盘与所述测试周边区域包围所述器件周边区域; 并在设备触点上安装集成电路。
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28.发明授权Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof 有权具有通孔的集成电路封装系统，具有基座和凹槽及其制造方法公开(公告)号：US08119447B2
公开(公告)日：2012-02-21
申请号：US12486271
申请日：2009-06-17
CPC分类号： H01L23/3128 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L29/0657 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/32225 , H01L2224/48225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2225/06541 , H01L2225/06544 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.
摘要翻译： 一种集成电路封装系统的制造方法，其特征在于：提供一种结构体，该结构具有通过所述结构完全通过导电材料填充的通孔，凹部和与所述凹部接合的基座部分; 将半导体器件安装在结构中的凹部内; 并将结构和半导体器件封装在封装中。
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公开(公告)号：US07994624B2
公开(公告)日：2011-08-09
申请号：US12237344
申请日：2008-09-24
IPC分类号： H01L23/02
CPC分类号： H01L24/48 , H01L21/565 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L24/29 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05554 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system includes attaching an adhesive segment spacer to an interposer assembly; mounting an integrated circuit over a carrier; mounting the interposer assembly over the integrated circuit with the adhesive segment spacer exposing an inner region of the integrated circuit and covering a periphery of the integrated circuit; and forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly exposed with a recess in the encapsulation.
摘要翻译： 集成电路封装系统包括将粘合剂段隔离件附接到插入件组件; 在载体上安装集成电路; 将所述插入器组件安装在所述集成电路上，所述粘合剂段间隔件暴露所述集成电路的内部区域并覆盖所述集成电路的外围; 以及在所述集成电路，所述插入器组件和所述粘合剂段间隔件之间形成封装，所述插入器组件在所述封装中暴露有凹部。
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公开(公告)号：US07952176B2
公开(公告)日：2011-05-31
申请号：US12331347
申请日：2008-12-09
IPC分类号： H01L23/495
CPC分类号： H01L23/3128 , H01L21/76898 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2224/94 , H01L2225/0651 , H01L2225/1023 , H01L2225/1052 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/10156 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/03 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent.
摘要翻译： 一种集成电路封装系统的制造方法，包括提供具有有源侧和非有源侧的集成电路; 通过集成电路形成通道; 从非活动侧的周边区域形成具有凸缘和凹口侧的凹口; 以及在缩进下形成具有偏移段，倾斜段和凸缘段的共形互连。
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