公开(公告)号：US20080045037A1

公开(公告)日：2008-02-21

申请号：US11576056

申请日：2004-10-13

Applicant: Francois Marion ,  Philippe Rambaud ,  Lydie Mathieu

Inventor： Francois Marion ,  Philippe Rambaud ,  Lydie Mathieu

IPC: H01L21/56

CPC classification number: H01L25/50 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This hybrid circuit comprises a substrate (20) and at least one elementary circuit (22) which comprises a first facet and a second facet, being hybridized via this second facet to a facet of the substrate. According to the invention, this facet of the substrate and each elementary circuit are coated with a first layer (24), the first layer is removed from the first facet of this elementary circuit, this first facet and the subsisting part of the first layer are coated with a second layer (28), and this subsisting part and the second layer covering it are removed. Application to obtaining an antireflection or metal layer on a chip.

Abstract translation: 该混合电路包括衬底（20）和至少一个元件电路（22），其包括第一小面和第二小面，通过该第二面与衬底的小面杂交。 根据本发明，衬底和每个基本电路的该面被涂覆有第一层（24），第一层从该基本电路的第一面移除，第一层的第一面和第一层的残存部分是 涂覆有第二层（28），并且将该存在部分和覆盖其的第二层去除。 用于获得芯片上的抗反射或金属层。

公开(公告)号：US08168478B2

公开(公告)日：2012-05-01

申请号：US13212502

申请日：2011-08-18

Applicant: Francois Marion ,  Olivier Gravrand

Inventor： Francois Marion ,  Olivier Gravrand

IPC: H01L21/82

CPC classification number: H01L24/95 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/62 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin.

Abstract translation: 本发明涉及一种用于制造电子元件基质的方法，包括在基底上制备活性层的步骤，以及通过在活性层中形成沟槽至少直至基底露出来使组分个体化的步骤。 该方法包括以下步骤：在有源层上沉积一层功能材料，将光敏树脂沉积在材料层上，以便填充所述沟槽并在组件的上表面上形成薄膜，至少 将树脂部分地暴露于辐射，同时使沟槽中树脂的部分露出，同时将树脂显影以除去适当暴露的部分，除去显影步骤后通过的功能材料层部分，并除去剩余的 部分树脂。

公开(公告)号：US08058656B2

公开(公告)日：2011-11-15

申请号：US12330805

申请日：2008-12-09

Applicant: Francois Marion ,  Olivier Gravrand

Inventor： Francois Marion ,  Olivier Gravrand

IPC: H01L21/82

CPC classification number: H01L24/95 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/62 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin.

Abstract translation: 本发明涉及一种用于制造电子元件基质的方法，包括在基底上制备活性层的步骤，以及通过在活性层中形成沟槽至少直至基底露出来使组分个体化的步骤。 该方法包括以下步骤：在有源层上沉积一层功能材料，将光敏树脂沉积在材料层上，以便填充所述沟槽并在组件的上表面上形成薄膜，至少 将树脂部分地暴露于辐射，同时使沟槽中树脂的部分露出，同时将树脂显影以除去适当暴露的部分，除去显影步骤后通过的功能材料层部分，并除去剩余的 部分树脂。

公开(公告)号：US20110041332A1

公开(公告)日：2011-02-24

申请号：US12918641

申请日：2009-02-19

Applicant: Damien Saint-Patrice ,  Francois Marion

Inventor： Damien Saint-Patrice ,  Francois Marion

IPC: H05K3/32

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/83 ,  H01L24/90 ,  H01L25/50 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/83141 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/3511 ,  Y10T29/49139 ,  H01L2924/00012

Abstract: The invention relates to a component comprising, on one face, a set of conductive inserts to be electrically connected to conductive buried regions of another component, said inserts resting on conductive blocks, advantageously produced from a deformable material and positioned at the surface of the component. The surface of the block, which is to come into contact with the insert, has at least one dimension larger than that of the buried region.

Abstract translation: 本发明涉及一种在一个面上包括一组电连接到另一部件的导电掩埋区的导电插入件的部件，所述插入件放置在导电块上，有利地由可变形材料制成并且定位在部件的表面 。 要与插入件接触的块的表面具有比掩埋区的尺寸更大的至少一个尺寸。

公开(公告)号：US20070049065A1

公开(公告)日：2007-03-01

申请号：US11503856

申请日：2006-08-14

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H05K1/00

CPC classification number: B81C1/00269 ,  B81C2201/0153 ,  B81C2203/019 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/062 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for producing a mechanism for connecting and/or soldering or sealing a component on a substrate, including depositing on the substrate a layer made of a ductile material which, if applicable, conducts electricity, and stamping the layer thus produced by means of an etched die, the etching depending on the shape that one wishes to give the mechanism for connecting and/or soldering.

Abstract translation: 一种用于生产用于连接和/或焊接或密封基底上的部件的机构的方法，包括在基底上沉积由可延展材料制成的层，如果适用的话，该导电材料可传导电，并且通过 蚀刻，取决于希望给出用于连接和/或焊接的机构的形状的蚀刻。

公开(公告)号：US20050074203A1

公开(公告)日：2005-04-07

申请号：US10496354

申请日：2002-11-27

Applicant: Francois Marion

Inventor： Francois Marion

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/28 ,  G02B6/30 ,  G02B6/34 ,  H04J14/02 ,  G02B6/26

CPC classification number: G02B6/2804 ,  G02B6/4246 ,  H04J14/0201

Abstract: Device for multiplexing a matrix of optical channels, application to wavelength division multiplexing and add-drop. This device comprises N plane optical wave guides (16), each being capable of multiplexing M channels to 1 channel, where M>1 and N>1, the set of N wave guides thus being capable of multiplexing M×N channels to N first channels, and a complementary plane optical wave guide (24) capable of multiplexing N second channels to at least one coupling channel, these N second channels being optically coupled to the N first channels respectively.

Abstract translation: 用于复用光通道矩阵的设备，应用于波分复用和分插。 该装置包括N个平面光波导（16），每个能够将M个信道复用到1个信道，其中M> 1和N> 1，所述N个波导组能够将M×N个信道复用到N个第一信道， 以及能够将N个第二通道复用到至少一个耦合通道的互补平面光波导（24），这N个第二通道分别光耦合到N个第一通道。

公开(公告)号：US5131584A

公开(公告)日：1992-07-21

申请号：US508807

申请日：1990-04-12

Applicant: Michelle Boitel ,  Francois Marion ,  Jean-Louis Pornin ,  Michel Ravetto

Inventor： Michelle Boitel ,  Francois Marion ,  Jean-Louis Pornin ,  Michel Ravetto

IPC: H01L21/60 ,  H01L21/98 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L24/75 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/1465 ,  H01L27/1469 ,  H01L27/14696 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436

Abstract: Method and machine to interconnect electric components by welding elements.The components (20,24) are provided with electric contact blocks and, given the fact that two components are to be interconnected, the blocks of one of these components are covered with welding elements made of a low melting point metallic material able to be welded to the blocks, the latter being wettable by the material in its molten state, whereas their environment is not so. The components are placed in contact so that these elements cover the corresponding blocks of the other component and the assembly obtained is heated to a temperature enabling the material to be melted.Application for microelectronics.

Abstract translation: 通过焊接元件互连电气元件的方法和机器。 组件（20,24）设置有电接触块，并且考虑到两个部件要相互连接的事实，这些部件之一的块被由能够被焊接的低熔点金属材料制成的焊接元件覆盖 这些块可以被熔融状态的材料润湿，而它们的环境不是这样。 这些部件被放置成接触，使得这些元件覆盖另一部件的相应块，并且所获得的组件被加热到能使材料熔化的温度。 微电子应用。

公开(公告)号：US5107078A

公开(公告)日：1992-04-21

申请号：US569397

申请日：1990-08-17

Applicant: Francois Marion ,  Michel Ravetto

Inventor： Francois Marion ,  Michel Ravetto

IPC: H05K1/11 ,  H01H37/76 ,  H01L21/82 ,  H01L23/538 ,  H05K1/00 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L23/5382 ,  H01L24/98 ,  H05K1/0293 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0305 ,  H05K2201/09427 ,  H05K2201/10181 ,  H05K2201/10363 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/0545 ,  H05K3/3484 ,  Y02P70/613

Abstract: An electric connection of disconnection element is described as well as the corresponding connection or disconnection method and integrated circuits using such elements.The disconnection element consists of a disk or ingot joining two conductive tracks whose extremities are laid on wettable surfaces. Melting of the disk frees surface tension forces which separate its material into two balls centered on the wettable surfaces.The connection element is formed of two separate disks and, from the wettable surface pads, these disks are disposed opposite each other so that their material, once melted, unites to form a single droplet.A process is also disclosed for using these connection and disconnection elements for repairing defective integrated circuits.

Abstract translation: 描述断开元件的电连接以及使用这些元件的相应的连接或断开方法以及集成电路。 断开元件由连接两个导电轨道的圆盘或锭组成，其四肢铺设在可润湿的表面上。 盘的熔化释放表面张力，将其材料分离成两个以可润湿表面为中心的球。 连接元件由两个分离的盘形成，并且从可湿性表面垫片中，这些盘彼此相对设置，使得它们的材料一旦熔化就结合形成单个液滴。 还公开了使用这些连接和断开元件来修复有缺陷的集成电路的过程。

公开(公告)号：US08291586B2

公开(公告)日：2012-10-23

申请号：US12852726

申请日：2010-08-09

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H05K3/00 ,  H01L21/00

CPC classification number: H01L25/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/13005 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13186 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13669 ,  H01L2224/1601 ,  H01L2224/16105 ,  H01L2224/81099 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81201 ,  H01L2224/81898 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49826 ,  H01L2924/01014 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/207

Abstract: A method for bonding two electronic components includes inserting hollow and open inserts into full convex elements of a lower hardness than that of the inserts, where, when an insert is inserted into a full element at least one surface of the open end of the insert is left free from the full element so as to create an outlet passage for gases contained in the insert.

Abstract translation: 一种用于接合两个电子部件的方法包括将中空的和开放的插入件插入比嵌入件的硬度更低的完整的凸形元件中，其中当插入件插入到完整的元件中时，插入件的开口端的至少一个表面是 离开整个元件，以便为包含在插入件中的气体形成出口通道。

公开(公告)号：US08272556B2

公开(公告)日：2012-09-25

申请号：US12722793

申请日：2010-03-12

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B23K101/36

CPC classification number: F16J15/0887 ,  H01L23/10 ,  H01L2224/75

Abstract: This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements.

Abstract translation: 能够确保两个元件之间的密封性的该金属唇形密封件包括：两个弹性构件，每个都要容纳在两个元件中的一个元件的空腔中，所述空腔与两个元件与另一个元件之间的接合区域 其中需要紧密度; 以及固定到容纳弹性构件的元件的柔性主体，其设置有两个自由端，所述自由端至少与所述接合区域一致延伸并与弹性构件接触。 每个弹性构件能够在自由端上施加接触力，以确保两个元件之间的紧密度。