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公开(公告)号：US07615335B2
公开(公告)日：2009-11-10
申请号：US11378919
申请日：2006-03-17
IPC分类号： G03C1/00
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/146 , Y10S430/155
摘要： An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
摘要翻译： 公开了一种成像方法。 将成像组合物涂覆在工件上，然后从3-D成像系统施加足够量的能量以在涂覆的工件上形成图像。 图像可以是用于对准部件的标志或标记。
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公开(公告)号：US06824665B2
公开(公告)日：2004-11-30
申请号：US09978797
申请日：2001-10-17
IPC分类号： C23C2802
CPC分类号： H01L21/76868 , C23C18/1671 , C23C18/38 , C23C18/405 , H01L21/288 , H01L21/2885 , H01L21/76843 , H01L21/76874 , H01L2221/1089 , H05K3/181 , H05K3/388 , H05K3/422 , Y10S205/916
摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
摘要翻译： 公开了在具有导电层的基板上沉积铜籽晶层的方法。 这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。
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公开(公告)号：US06804881B1
公开(公告)日：2004-10-19
申请号：US09569767
申请日：2000-05-12
IPC分类号： H05K336
CPC分类号： C25D5/54 , C25D5/022 , H05K3/0023 , H05K3/0032 , H05K3/107 , H05K3/205 , H05K3/3473 , H05K3/465 , H05K2201/0376 , H05K2203/1407 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155
摘要： A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造多层板的方法和由该方法形成的板。 该方法包括依次选择性地镀金属加强件，焊接垫，信号线和互连。 所得板最好不含玻璃纤维增强层。
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公开(公告)号：US06759596B1
公开(公告)日：2004-07-06
申请号：US09569553
申请日：2000-05-12
IPC分类号： H05K103
CPC分类号： H05K1/0271 , H05K3/205 , H05K3/421 , H05K3/465 , H05K3/4682 , H05K2201/09781 , H05K2201/2009 , H05K2203/0152 , H05K2203/0733 , Y10T29/4913 , Y10T29/49156
摘要： The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having the desired number of layers.
摘要翻译： 本发明提供了用于形成顺序构建电路板的多层电路板和方法。 除了其它方面，对于本发明的优选电路板，不需要为现有板提供强度或刚性所需的玻璃纤维增强铜包覆环氧树脂基板。 本发明的优选方法包括将介电涂层施加到载体上; 在所述电介质涂层中形成限定开口的凹部，所述开口包括用于至少一个加强构件的开口; 将铜金属沉积到所述凹部中以形成第一层; 将第二电介质涂层施加到所述第一电路层上; 在所述第二电介质涂层中形成限定开口的凹部，所述开口包括用于与所述第一层中的所述一个或多个加强构件对准的至少一个加强构件的开口; 将金属沉积到介电涂层中的凹槽中以形成第二层; 并重复该过程以形成具有所需数量层的顺序构建板。
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公开(公告)号：US06660153B2
公开(公告)日：2003-12-09
申请号：US09982398
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C25D502
CPC分类号： H01L21/76868 , C25D3/38 , C25D5/48 , C25D7/123 , H01L21/2885 , H01L21/76874 , H01L2221/1089 , H05K3/244
摘要： Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
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26.发明授权Method for electroplating using stabilized dispersions of conductive particles 失效使用稳定的导电颗粒分散体进行电镀的方法
公开(公告)号：US6039859A
公开(公告)日：2000-03-21
申请号：US82437
申请日：1998-05-20
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
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公开(公告)号：US5910394A
公开(公告)日：1999-06-08
申请号：US878398
申请日：1997-06-18
申请人： James G. Shelnut
发明人： James G. Shelnut
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/4661 , H05K3/4676 , Y10S430/106 , Y10S430/121
摘要： Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.
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公开(公告)号：US07749685B2
公开(公告)日：2010-07-06
申请号：US11378918
申请日：2006-03-17
IPC分类号： G03C1/00
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/146 , Y10S430/155
摘要： An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
摘要翻译： 公开了一种成像方法。 将成像组合物涂覆在工件上，然后从3-D成像系统施加足够量的能量以在涂覆的工件上形成图像。 图像可以是用于对准部件的标志或标记。
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公开(公告)号：US07270932B2
公开(公告)日：2007-09-18
申请号：US10773990
申请日：2004-02-06
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/127 , Y10S430/163
摘要： Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.
摘要翻译： 公开了使用组合物的成像组合物和方法。 成像组合物对低水平的能量敏感，使得当施加低水平的能量时，组合物改变颜色或阴影。 组合物可用于标记方法。
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公开(公告)号：US06944945B1
公开(公告)日：2005-09-20
申请号：US09570321
申请日：2000-05-12
CPC分类号： H05K3/465 , H05K1/0271 , H05K3/205 , H05K3/3473 , H05K3/423 , H05K2201/09781 , H05K2201/2009 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造电路板和通过该方法形成的板的方法。 该方法包括依次选择性镀覆金属加强件，焊接垫，信号和互连。 所得板最好不含玻璃纤维增强层。
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