公开(公告)号：US06988244B1

公开(公告)日：2006-01-17

申请号：US09571427

申请日：2000-05-15

申请人： Fumitaka Honda ,  Koji Kondo

发明人： Fumitaka Honda ,  Koji Kondo

IPC分类号： G11B27/00 ,  H04N5/44 ,  H04N7/173

CPC分类号： G11B27/34 ,  G06F17/30843 ,  G11B27/034 ,  G11B27/28 ,  H04N7/17318 ,  H04N21/23412 ,  H04N21/234336 ,  H04N21/44016 ,  H04N21/47202 ,  H04N21/8153 ,  H04N21/8455 ,  H04N21/8549

摘要： An index picture as a still picture obtained by summarizing the contents of a moving picture, which is generated by using a video browser technique can be formed in various modes. A plurality of kinds of generating modes for generating an index picture by summarizing the contents of a moving picture are prepared, any of the modes is selected, and a generating process is performed in the selected mode. It enables an index picture to be generated in a proper form according to the property, use, and the like of a moving picture material.

摘要翻译： 作为通过使用视频浏览器技术生成的运动图像的内容的总结获得的静态图像的索引图像可以以各种模式形成。 准备通过总结运动图像的内容来生成索引图像的多种生成模式，选择任何模式，并且以所选择的模式执行生成处理。 它能够根据运动图像材料的属性，用途等以正确的形式生成索引图像。

公开(公告)号：US20050267427A1

公开(公告)日：2005-12-01

申请号：US10522961

申请日：2003-08-07

申请人： Hiroyuki Hanao ,  Koji Kondo ,  Keiji Torigoshi

发明人： Hiroyuki Hanao ,  Koji Kondo ,  Keiji Torigoshi

IPC分类号： A61F13/15

CPC分类号： A61F13/531 ,  A61F13/534 ,  A61F2013/530481

摘要： An absorbent article which can be thin without decreasing absorption capability and strength. An absorbent body having a pulp fiber and a super absorbent polymer, in which a content of the super absorbent polymer is not less than 55% by weight, is provided. The absorbent body may be covered with a top sheet which is liquid permeable and uses a non-woven fabric.

摘要翻译： 一种吸收性物品，可以在不降低吸收能力和强度的情况下变薄。 提供具有纸浆纤维和高吸水性聚合物的吸收体，其中高吸收性聚合物的含量不小于55重量％。 吸收体可以被透液性的顶片覆盖并使用无纺织物。

公开(公告)号：US06818836B2

公开(公告)日：2004-11-16

申请号：US10163998

申请日：2002-06-07

申请人： Yoshihiko Shiraishi ,  Koji Kondo

发明人： Yoshihiko Shiraishi ,  Koji Kondo

IPC分类号： H05K116

CPC分类号： H05K3/4632 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49211 ,  H01L2224/0401

摘要： A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

摘要翻译： 在由热塑性树脂制成的树脂膜上形成导体图案。 每个单面导体图案膜具有填充有导电浆料的通孔。 印刷导体图案和印刷电阻器形成在陶瓷基板上。 单面导体图案膜层叠在陶瓷基板上。 然后，将多层组件从其两侧加热并压制，得到印刷电路板。 在热压处理期间，在导体图案之间以及在导体图案和印刷导体图案之间获得层间连接的情况下，各自的单面导体图案膜和陶瓷基板结合在一起。

公开(公告)号：US06548765B2

公开(公告)日：2003-04-15

申请号：US09858500

申请日：2001-05-17

申请人： Kenji Kondo ,  Masayuki Aoyama ,  Koji Kondo ,  Masanori Takemoto

发明人： Kenji Kondo ,  Masayuki Aoyama ,  Koji Kondo ,  Masanori Takemoto

IPC分类号： H05K116

CPC分类号： H05K3/244 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K2201/09227 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.

摘要翻译： 电子部件单元包括具有多个孔的插入器和设置在插入器的一个表面上的电路布线层。 电子部件电连接到电路布线层。 多个焊料凸块通过形成在插入件中的孔电连接到电路布线层的一个表面。 电路布线层通过焊料凸块与外部电路电连接。 电路布线层和每个焊料凸点之间的结界面由延性金属制成。

公开(公告)号：US06464585B1

公开(公告)日：2002-10-15

申请号：US09554728

申请日：2000-05-18

申请人： Shigeru Miyamoto ,  Yoichi Yamada ,  Eiji Onozuka ,  Koji Kondo ,  Yoji Inagaki ,  Tsuyoshi Kihara

发明人： Shigeru Miyamoto ,  Yoichi Yamada ,  Eiji Onozuka ,  Koji Kondo ,  Yoji Inagaki ,  Tsuyoshi Kihara

IPC分类号： A63F1300

CPC分类号： G10H1/0008 ,  A63F2300/1018 ,  A63F2300/6063 ,  A63F2300/63 ,  A63F2300/8047 ,  A63F2300/807 ,  G10H1/043 ,  G10H1/34 ,  G10H2210/026 ,  G10H2210/201 ,  G10H2220/246 ,  G10H2220/315

摘要： When any of push-button switches on a handheld controller is pressed in a sound input mode, a video game machine generates and temporarily stores frequency data of a tone corresponding to the depressed switch. When a joystick on the controller is tilted to a predetermined direction, the video game machine changes the generated frequency data according to the amount of tilt of the joystick. It is therefore possible to input various sounds in tone using a limited number of switches. The frequency data stored in the video game machine is read later to be converted into audio signals, and outputted from a speaker incorporated in a CRT display. When a melody based on the inputted sound coincides with a predetermined melody set, the video game machine makes various changes in the progress of the game. For example, a hero character can be warped to a position that is different from the present position, or provided with various items.

摘要翻译： 当在声音输入模式中按下手持控制器上的任何按钮开关时，视频游戏机产生并临时存储与按下的开关相对应的音调的频率数据。 当控制器上的操纵杆倾斜到预定方向时，视频游戏机根据操纵杆的倾斜量来改变产生的频率数据。 因此，可以使用有限数量的开关输入音调中的各种声音。 存储在视频游戏机中的频率数据被稍后读取以被转换为音频信号，并且从并入CRT显示器的扬声器输出。 当基于输入的声音的旋律与预定的旋律组一致时，视频游戏机在游戏的进程中进行各种改变。 例如，英雄角色可以扭曲到与当前位置不同的位置，或者具有各种项目。

公开(公告)号：US6043986A

公开(公告)日：2000-03-28

申请号：US715515

申请日：1996-09-18

申请人： Koji Kondo ,  Kiyoshi Nakakuki ,  Hideki Kabune ,  Hajime Kumabe

发明人： Koji Kondo ,  Kiyoshi Nakakuki ,  Hideki Kabune ,  Hajime Kumabe

IPC分类号： H05K1/11 ,  H01L23/12 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H05K7/20

CPC分类号： H05K1/0206 ,  H01L24/32 ,  H05K7/205 ,  H05K1/0201 ,  H05K2201/09609 ,  H05K2201/10166 ,  H05K3/341 ,  H05K3/42

摘要： A printed circuit board, having a plurality of via-holes provided in an area where circuit elements are arranged, includes a thermally conductive material having thermally good conductivity, for example copper, and the thermally good conductive material is formed in an inner wall of each of the plurality of via-holes. Each of the plurality of via-holes has, for example, a circular shape, and is arranged in the form of hexagonal or triangular lattice in the area where the circuit elements are arranged. Further, preferably, a diameter of each of the plurality of via-holes is equal to a hole pitch having an allowance .+-.0.3 mm. According to above structure, it is possible to provide a plurality of via-holes per unit area with high density on the printed circuit board and to improve the thermal conductivity of the printed circuit board by effectively radiating the heat generated from the circuit elements.

摘要翻译： 具有设置在电路元件布置的区域中的多个通孔的印刷电路板包括具有导热性良好的例如铜的导热材料，并且热良好的导电材料形成在每个的内壁上 的多个通孔。 多个通孔中的每一个具有例如圆形，并且在布置电路元件的区域中以六角形或三角形格子的形式布置。 此外，优选地，多个通孔中的每一个的直径等于具有余量+/- 0.3mm的孔间距。 根据上述结构，可以在印刷电路板上提供高密度单位面积的多个通孔，并且通过有效地辐射由电路元件产生的热量来提高印刷电路板的导热性。

公开(公告)号：US08182729B2

公开(公告)日：2012-05-22

申请号：US12382138

申请日：2009-03-10

申请人： Toshikazu Harada ,  Koji Kondo ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Keiji Okamoto

发明人： Toshikazu Harada ,  Koji Kondo ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Keiji Okamoto

IPC分类号： B29C65/02

CPC分类号： H05K1/0366 ,  B29C43/003 ,  B29C43/18 ,  B29C43/203 ,  B29C2043/025 ,  B32B37/185 ,  B32B2309/025 ,  B32B2457/08 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2203/065 ,  H05K2203/1178

摘要： In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.

摘要翻译： 在制造具有基板和形成在基板中的布线图案的多层布线板的方法中，基膜沿预定方向堆叠以形成层叠膜结构。 每个基膜包括热塑性树脂。 压力和热量从层叠方向的两侧施加到层叠膜结构体上，使得基膜结合在一起形成基板。 基膜中的至少一个是包括纤维片的组合膜。 纤维片的两侧用热塑性树脂覆盖，使纤维片中残留有空气。

公开(公告)号：US07876006B2

公开(公告)日：2011-01-25

申请号：US11822675

申请日：2007-07-09

申请人： Koji Kondo

发明人： Koji Kondo

IPC分类号： H02K19/36 ,  H02K11/00

CPC分类号： H02K11/046 ,  H01L24/01 ,  H02K19/36

摘要： An alternator has a rectifier converting an alternating current to a direct current. The rectifier has a heat sink and rectifying elements. The sink has front and rear surfaces opposite to each other along a depth direction. The sink has holes each extending along the depth direction. Each element has a disk disposed in one hole and a semiconductor pellet attached to the disk. Each disk has upper and bottom surfaces opposite to each other along the depth direction. Each pellet is disposed on the upper surface. A contact surface of each disk is in contact with the sink. A position of the upper surface of each disk is placed between the first and second surfaces of the heat sink. A range of the contact surface of each disk is within a range between the upper and bottom surfaces of the disk.

摘要翻译： 交流发电机具有将交流电转换为直流电的整流器。 整流器具有散热器和整流元件。 水槽具有沿着深度方向彼此相对的前表面和后表面。 水槽有沿着深度方向延伸的孔。 每个元件具有设置在一个孔中的盘和附接到盘的半导体芯片。 每个盘具有沿着深度方向彼此相对的上表面和底表面。 每个颗粒设置在上表面上。 每个盘的接触表面与水槽接触。 每个盘的上表面的位置被放置在散热器的第一和第二表面之间。 每个盘的接触表面的范围在盘的上表面和底表面之间的范围内。

公开(公告)号：US20080316786A1

公开(公告)日：2008-12-25

申请号：US12213517

申请日：2008-06-20

申请人： Harumi Murakami ,  Koji Kondo

发明人： Harumi Murakami ,  Koji Kondo

IPC分类号： H05K7/20 ,  H02K11/04 ,  H02K9/00

CPC分类号： H02K11/046

摘要： A rectifier for an alternating current generator is provided. The rectifier comprise a plurality of high-side rectifying elements and a plurality of low-side rectifying elements. The high-side rectifying elements are held by a plurality of high-side cooling fins, while the high-side rectifying elements are held by a plurality of low-side cooling fins. By way of example, the plurality of high-side cooling fins are disposed to be apart from each other by a predetermined distance and the plurality of low-side cooling fins are disposed to be apart from each other by a predetermined distance.

摘要翻译： 提供了一种用于交流发电机的整流器。 整流器包括多个高侧整流元件和多个低侧整流元件。 高侧整流元件由多个高侧冷却片保持，高侧整流元件由多个低侧散热片保持。 作为示例，多个高侧冷却片被布置成彼此隔开预定距离，并且多个低侧冷却片被布置成彼此分开预定距离。

公开(公告)号：US07378745B2

公开(公告)日：2008-05-27

申请号：US11213867

申请日：2005-08-30

申请人： Akimori Hayashi ,  Katsunobu Suzuki ,  Ryuichi Oikawa ,  Makoto Nakagoshi ,  Naoko Sera ,  Tadashi Murai ,  Chiho Ogihara ,  Ryohei Kataoka ,  Koji Kondo ,  Tomohiro Yokochi

发明人： Akimori Hayashi ,  Katsunobu Suzuki ,  Ryuichi Oikawa ,  Makoto Nakagoshi ,  Naoko Sera ,  Tadashi Murai ,  Chiho Ogihara ,  Ryohei Kataoka ,  Koji Kondo ,  Tomohiro Yokochi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12 ,  H01L23/29

CPC分类号： H05K3/4632 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2224/0401

摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.

摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。