摘要:
The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO3, SrTiO3 and Ta2O5 produce the most effective results.
摘要:
A multi-layer ceramic capacitor and method of manufacturing the capacitor, the capacitor having signal vias surrounded by an area containing a material having a low dielectric constant, the via and surrounding area of low dielectric constant material inserted in a material having a high dielectric constant.
摘要:
A sealed composite ceramic structure is formed by first forming a plurality of composite green sheets. Each of the green sheets is a composite structure comprising a central portion of partially densifiable material and an outer portion of fully densifiable material. Next, top and bottom green sheets of fully densifiable material are formed. The greensheets are then stacked to form a laminated structure in the following order: the bottom green sheet, the plurality of composite green sheets, and the top green sheet. The substrate laminate is sintered to form the sealed structure having a porous central portion. The composite structure has particular application to ceramic substrates for mounting semiconductor devices requiring low dielectric constant substrates, but the structure also has applications in fluid processing using porous laminated structures. In both applications, the creation of a porous ceramic body with solid, sealed edges and/or external surfaces hold significant advantages.
摘要:
A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/° C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt % and MgO in a range of 10-25 wt %. A method of making the glass-ceramic is also provided. Further, an electronic package is also provided, including a base member and a glass-ceramic substrate bonded to the base member.
摘要:
A glass-ceramic is provided having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm/° C., a dielectric constant in a range of 5–7 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 40–55 wt %, Al2O3 in a range of 7–22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %. An electronic package is also provided, including one of a metal and sintered ceramic base member and a glass-ceramic substrate bonded to the base member.
摘要翻译:玻璃陶瓷的热膨胀系数为4.0〜8.5ppm /℃,介电常数为5-7,质量系数Q为400以上。玻璃陶瓷基本上由 的SiO 2 2在40-55重量%的范围内,Al 2 O 3 O 3在7-22重量%的范围内,MgO在 6至小于26重量%的范围和至多35重量%的BaO中的至少一种,至多37重量%的SrO和至多17重量%的ZnO。 还提供了一种电子封装件,包括金属和烧结陶瓷基底构件中的一种以及粘合到基底构件的玻璃陶瓷基底。
摘要:
An inventive method for forming a thin film comprises the steps of preparing a sputter-target of a material which is fully oxidized and crystallized to a perovskite structure, sputter-depositing a thin film on top of a sample with the target in an inert gas atmosphere, and annealing the thin film in non-oxygen ambient. With the use of such a target, it is possible to reduce the negative ion effect during the sputter deposition and to eliminate the presence of oxygen during the annealing process.
摘要:
Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.
摘要:
Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
摘要:
A non-crystallizing sealing glass composition is described consisting essentially of from about 75.50 to 84.00 wt. % lead oxide, from about 11.25 to 14.25 wt. % boron oxide, an additional component selected from the group consisting of up to 3.10 wt. % zinc oxide and up to 9.33 wt. % bismuth oxide; other compositions could include up to 0.88 wt. % tin oxide, and up to 1.51 wt. % germainium oxide. The glass compositions include .beta.-eucryptite in an amount sufficient to provide a coefficient of expansion of about 83.5 to 71.5.times.10.sup.-7 .degree. C..sup.-1 (about 13.5 to 17.0 wt %); the glass is particularly useful in sealing a gas panel.