公开(公告)号：US06909929B2

公开(公告)日：2005-06-21

申请号：US10293160

申请日：2002-11-12

申请人： Warren M. Farnworth ,  Mark S. Johnson

发明人： Warren M. Farnworth ,  Mark S. Johnson

IPC分类号： B29C31/00 ,  B29C67/00 ,  B29C70/70 ,  G01R31/26 ,  G06F19/00 ,  H01L21/00

CPC分类号： H01L21/67259 ,  B29C64/135 ,  B29C70/70 ,  B29L2031/3061 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y80/00 ,  H01L21/67126 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A stereolithographic method and apparatus for applying packaging material to workpieces, such as preformed electronic components, including semiconductor dice, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a stereolithographic system for application of material so that the system may recognize the position and orientation of workpieces, such as semiconductor dice, to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes stereolithographic application of material for packaging electronic components, and the electronic components so packaged are also part of the invention.

摘要翻译： 一种立体光刻方法和装置，用于将包装材料应用到工件上，例如具有高精度的包括半导体晶片的预制电子部件，以及所得的制品。 包括至少一个相机的机器视觉系统与控制用于施加材料的立体光刻系统的计算机可操作地相关联，使得系统可以识别待施加材料的工件（例如半导体晶片）的位置和取向。 消除了对精密机械工件对准的要求，并且系统识别不同工件的尺寸，配置和形貌的能力提供了更大的制造灵活性。 该方法包括用于包装电子部件的材料的立体光刻应用，并且如此包装的电子部件也是本发明的一部分。

公开(公告)号：US09447497B2

公开(公告)日：2016-09-20

申请号：US14209383

申请日：2014-03-13

申请人： Dien-Yeh Wu ,  Mark S. Johnson ,  David M. Santi ,  Hyman Lam

发明人： Dien-Yeh Wu ,  Mark S. Johnson ,  David M. Santi ,  Hyman Lam

IPC分类号： C23C16/455

CPC分类号： C23C16/45561 ,  Y10T137/0419 ,  Y10T137/4259

摘要： Disclosed are apparatus and methods for supplying a constant flow of precursor gas to a processing chamber. The apparatus described, and methods of use, allow a precursor ampoule to be removed from the gas delivery system without interrupting the process.

摘要翻译： 公开了用于将恒定流量的前体气体供应到处理室的装置和方法。 所描述的装置和使用方法允许将前体安瓿从气体输送系统中移除而不中断该过程。

公开(公告)号：US07247520B2

公开(公告)日：2007-07-24

申请号：US11081236

申请日：2005-03-15

申请人： Mark S. Johnson

发明人： Mark S. Johnson

IPC分类号： H01L21/00

CPC分类号： H01L23/49537 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads may have an outer length and an outer edge. The dam bar may include a plurality of dam bar elements, with each dam bar element being joined to the outer lengths of two adjacent leads. In this example, each dam bar element has an outer edge that extends farther outwardly than the outer edges of the two adjacent leads. The outer edges of the leads and the outer edges of the dam bar elements together define an irregular outer edge of the dam bar. Other lead frame structures and various microelectronic component assemblies are also shown and described.

摘要翻译： 本发明提供了可用于这种组件的微电子部件组件和引线框架结构。 例如，一个这样的引线框架结构可以包括沿第一方向延伸的一组引线和坝条。 每个引线可以具有外部长度和外部边缘。 堤坝可以包括多个坝条元件，每个坝条元件连接到两个相邻引线的外长度。 在该示例中，每个阻挡杆元件具有比两个相邻引线的外边缘更向外延伸的外边缘。 引线的外边缘和堤坝元件的外边缘一起限定了坝条的不规则外边缘。 还示出和描述了其它引线框架结构和各种微电子部件组件。

公开(公告)号：US07181837B2

公开(公告)日：2007-02-27

申请号：US10861847

申请日：2004-06-04

申请人： Mark S. Johnson

发明人： Mark S. Johnson

IPC分类号： H05K3/02

CPC分类号： H05K3/242 ,  H05K3/0052 ,  H05K2201/09263 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.

公开(公告)号：US06208519B1

公开(公告)日：2001-03-27

申请号：US09386319

申请日：1999-08-31

申请人： Tongbi Jiang ,  Mark S. Johnson

发明人： Tongbi Jiang ,  Mark S. Johnson

IPC分类号： H05K720

CPC分类号： H01L23/4951 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/73253 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

摘要翻译： 描述了具有热增强特性的半导体封装。 半导体封装包括其上固定有裸片的基板。 芯片和基板各自具有分别彼此连接的触点。 通过热顺应性材料将散热器固定在模具的表面上。 柔性材料减少了温度波动引起的应力，导致散热器和模具以不同的速率膨胀和收缩。 第一模塑材料围绕模具的周边沉积，顺应性材料和散热器，从而留下基本上暴露于散热片的整个表面。

公开(公告)号：US5050356A

公开(公告)日：1991-09-24

申请号：US490747

申请日：1990-03-08

申请人： Mark S. Johnson ,  Gordon T. French, Jr.

发明人： Mark S. Johnson ,  Gordon T. French, Jr.

IPC分类号： E02D27/42 ,  E04H12/22

CPC分类号： E04H12/22 ,  E02D27/42

摘要： A foundation for supporting poles, particularly electrical power cable support poles, is formed by boring a hole only slightly larger than the pole base onto the earth a desired depth. A reinforcing structure is lowered into the hole. The reinforcing structure usually rests on the bottom of the hole and extends above the earth surface a number of feet. The hole is then filled with concrete, usually up to the earth surface, and allowed to cure. A lowermost or base section of the pole is then lowered into position about an exposed upper portion of the reinforcing structure. Concrete is placed into the interior of the pole section about the reinforcing structure until it is covered. After the concrete cures, any remaining pole sections may be installed onto the base section.

摘要翻译： 用于支撑杆，特别是电力电缆支撑杆的基础是通过将仅仅稍微大于极基座的孔钻到地球上形成所需的深度而形成。 加强结构下降到孔中。 加固结构通常位于孔的底部，并在地表面上延伸数英尺。 然后，孔中充满混凝土，通常直到地表，并允许固化。 然后，极的最下部或底部部分围绕加强结构的暴露的上部部分下降到位置。 将混凝土放置在围绕加强结构的极部分的内部，直到其被覆盖。 在混凝土固化后，任何剩余的极板部分可以安装在基部上。

公开(公告)号：US4775473A

公开(公告)日：1988-10-04

申请号：US23246

申请日：1987-03-09

申请人： Mark S. Johnson ,  Manojlo Jovanovic ,  Rudolph C. Valenta

发明人： Mark S. Johnson ,  Manojlo Jovanovic ,  Rudolph C. Valenta

IPC分类号： C09K3/32 ,  B01D15/00

CPC分类号： C09K3/32

摘要： An absorbent article suitable for absorption of aqueous as well as oleaginous liquids such as metal cutting fluids, hydraulic fluids, oils and the like is disclosed. The absorbent article is a spunlaced material sleeve closed at both ends and filled with an inherently flameproof particulate material, such as particulate clay material, having a certain particle size range. The spunlaced material is liquid permeable, oleophilic, and hydrophilic. The spunlaced material also has a liquid wicking rate that is at least equal to that of the particulate clay material contained within the sleeve. Preferred spunlaced materials are woodpulp/polyester spunlaced materials having a woodpulp-rich face and a polyester-rich face. The polyester-rich face is situated contiguous to the particulate absorbent material.

摘要翻译： 公开了适用于吸收水性以及含油液体如金属切削液，液压油，油等的吸收制品。 吸收制品是在两端封闭的水刺材料套筒，其中填充有固有的防火颗粒材料，例如具有一定粒度范围的颗粒状粘土材料。 水刺的材料是液体可渗透的，亲油的和亲水的。 水刺的材料还具有至少等于包含在套筒内的颗粒状粘土材料的液体芯吸速率。 优选的水刺的材料是具有木浆丰富的面和富含聚酯的面的木浆/聚酯水刺的材料。 富含聚酯的面与颗粒状吸收材料相邻。

公开(公告)号：US08946873B2

公开(公告)日：2015-02-03

申请号：US11846460

申请日：2007-08-28

申请人： Mark S. Johnson

发明人： Mark S. Johnson

IPC分类号： H01L23/552 ,  H01L23/522 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/76846 ,  H01L23/3114 ,  H01L23/5225 ,  H01L23/5226 ,  H01L23/5286 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/05599

摘要： Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.

摘要翻译： 公开了具有减少或消除线路干扰的再分布结构的微特征模具。 微特征模具可以包括具有键合位置的基底和与该键合位置电连接的集成电路。 微特征模具还可以包括耦合到衬底的再分配结构。 再分布结构可以包括被配置为接收电耦合器的外部接触部位，电连接到外部接触部位和接合部位的导电线以及至少部分地围绕导电线的导电屏蔽。

公开(公告)号：US08400780B2

公开(公告)日：2013-03-19

申请号：US12820704

申请日：2010-06-22

申请人： Mung Suan Heng ,  Kok Chua Tan ,  Vince Chan Seng Leong ,  Mark S. Johnson

发明人： Mung Suan Heng ,  Kok Chua Tan ,  Vince Chan Seng Leong ,  Mark S. Johnson

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16148 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4846 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48496 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/4554 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399

摘要： Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

摘要翻译： 公开了堆叠的微特征装置和相关的制造方法。 根据一个实施例的封装包括具有彼此面对的相应的第一和第二接合焊盘表面的第一和第二微特征器件。 第一接合焊盘可以至少靠近第一接合焊盘表面定位，并且第二接合焊盘可以至少靠近第二接合焊盘表面定位。 包装连接部位可以在第一微型装置和包装外部的部件之间提供电连通。 引线键可以耦合在第一接合焊盘和封装连接位置中的至少一个上，并且导电链路可以耦合在第一微功能设备和第二微功能设备的至少一个第二接合焊盘之间。 因此，第一微功能设备可以形成到第二微功能设备的电连接的一部分。

公开(公告)号：US08222727B2

公开(公告)日：2012-07-17

申请号：US12613413

申请日：2009-11-05

申请人： Mark S. Johnson

发明人： Mark S. Johnson

IPC分类号： H01L23/04

CPC分类号： H05K3/428 ,  H01L21/4857 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H05K1/0287 ,  H05K3/108 ,  H05K2201/09609 ,  H05K2201/10378

摘要： Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.

摘要翻译： 在此公开了使用这种方法形成的在和/或介入装置和微特征装置之间的导电结构的制造方法。 在一个实施例中，一种用于制造具有衬底的插入器器件的方法包括以第一图案在第一衬底上形成多个导电部分。 该方法通过在第二图案的第二基板上形成多个导电部分来继续。 该方法还包括在第一基板和第二基板上在公共第三图案中构造多条导线。 导电线可以在形成第一衬底上的第一导电部分图案之前或之后形成在第一衬底和第二衬底上，和/或在第二衬底上形成导电部分的第二图案。