公开(公告)号：US20080301855A1

公开(公告)日：2008-12-11

申请号：US12131764

申请日：2008-06-02

Applicant: Michael Ball

Inventor： Michael Ball

IPC: A41D1/06 ,  A41F9/00

CPC classification number: A41F9/025

Abstract: A pair of pants with an adjustable waist including an elastic band extending lengthwise around the interior of the waistband. The elastic band includes notches positioned along its length, and an engaging means (for example, a button), which is attached to the waistband near each end of the elastic band. The engaging means affixes to the elastic band through different notches to adjust the size of the waist in the pants. The pants also have a unique cut, including a shortened transverse distance from the button to the crotch in the front of the pants, and an elongated transverse distance from the crotch to the waistband in the back of the pants.

Abstract translation: 一条可调腰围的裤子，包括沿腰围内侧纵向延伸的弹性带。 弹性带包括沿其长度定位的凹口，以及接合装置（例如按钮），该接合装置附接到靠近弹性带的每一端的腰带。 接合装置通过不同的凹口固定到弹性带以调节裤子中的腰部的尺寸。 裤子还具有独特的切口，包括从裤子前方的按钮到裆部的缩短的横向距离，以及从裤子背部的裆部到腰带的细长的横向距离。

公开(公告)号：US20060277086A1

公开(公告)日：2006-12-07

申请号：US11141411

申请日：2005-06-01

Applicant: Michael Ball ,  Zhenying Zhao ,  Yoshinori Shirasu

Inventor： Michael Ball ,  Zhenying Zhao ,  Yoshinori Shirasu

IPC: G06F9/46

CPC classification number: G06Q10/04 ,  G06Q10/06315 ,  G06Q10/087

Abstract: A production capability system for automatically determining production capability quantities. The system includes a candidate generation process for generating possible production capability candidates and a quantity optimization module for calculating an optimal quantity availability for production capability candidate. The system also includes a calculation module for assigning quantities to all of the production capability candidates and means for generating a production report wherein production capability candidates and the optimal quantity are combined to generate a production capability availability which is stored in a specification for use by an external sales system. The candidate generation process and the quantity optimization module accept input data from a master database including priorities associated with different products and weights for different performance measures.

Abstract translation: 一种用于自动确定生产能力数量的生产能力系统。 该系统包括用于生成可能的生产能力候选的候选生成处理和用于计算生产能力候选者的最佳数量可用性的数量优化模块。 该系统还包括用于向所有生产能力候选者分配数量的计算模块和用于生成生产报告的装置，其中生产能力候选和最佳数量被组合以产生存储在规范中的生产能力可用性， 外部销售系统。 候选生成过程和数量优化模块接受来自主数据库的输入数据，包括与不同性能度量的不同产品和权重相关联的优先级。

公开(公告)号：US20060157532A1

公开(公告)日：2006-07-20

申请号：US11318073

申请日：2005-12-23

Applicant: Michael Ball

Inventor： Michael Ball

IPC: B23K37/00 ,  B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/4825 ,  H01L21/67138 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract translation: 一种用于在引线接合过程中支撑引线指的装置和防止接合装置和夹紧组件向模具施加力的方法。 本发明包括在引线接合过程中使用具有可定位在引线框架的引线的一部分下方的部分的可动臂，以提供引线指的增加的稳定性并防止接合装置和夹紧组件施加 对死亡的力量 本发明还提供了在引线接合过程期间将热量从热块直接转移到引线指。 本发明包括在引线接合过程中使用用于稳定引线指的夹具。

公开(公告)号：US20060027624A1

公开(公告)日：2006-02-09

申请号：US11243677

申请日：2005-10-05

Applicant: Chad Cobbley ,  Michael Ball ,  Marjorie Waddel

Inventor： Chad Cobbley ,  Michael Ball ,  Marjorie Waddel

IPC: B23K5/22

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2924/00014 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49146 ,  H01L2224/05599

Abstract: A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract translation: 公开了一种使用球形拾取工具将焊球附接到BGA封装的方法。 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。

公开(公告)号：US20050056682A1

公开(公告)日：2005-03-17

申请号：US10978050

申请日：2004-10-29

Applicant: Chad Cobbley ,  Michael Ball ,  Marjorie Waddel

Inventor： Chad Cobbley ,  Michael Ball ,  Marjorie Waddel

IPC: H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K37/00

CPC classification number: H01L24/12 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3478 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49211 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/532 ,  H01L2224/05599

Abstract: Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

公开(公告)号：US20050009236A1

公开(公告)日：2005-01-13

申请号：US10911862

申请日：2004-08-03

Applicant: Michael Ball

Inventor： Michael Ball

IPC: H01L21/98 ,  H01L25/065 ,  H01L29/06 ,  H01L21/44 ,  G01R31/26 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/6836 ,  H01L24/27 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A method for increasing integrated circuit density comprising stacking an upper wafer and a lower wafer, each of which have fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive applied over the back side of the lower wafer. The wafers are aligned so as to bring complimentary circuitry on each of the wafers into perpendicular alignment. The adhered wafer pair is then itself attached to an adhesive film to immobilize the wafer during dicing. The adhered wafer pair may be diced into individual die pairs or wafer portions containing more than one die pair.

Abstract translation: 一种用于增加集成电路密度的方法，包括堆叠上晶片和下晶片，每个晶片和下晶片在其各自的表面上的特定区域中具有制造的电路。 上部晶片与下部晶片背靠背连接，并且在下部晶片的背面上施加一层粘合剂。 对准晶片以使每个晶​​片上的互补电路成垂直对准。 然后，粘附的晶片对本身连接到粘合剂膜，以在切割期间固定晶片。 粘附的晶片对可以切成单个管芯对或包含多于一个管芯对的晶片部分。

公开(公告)号：US06186392B1

公开(公告)日：2001-02-13

申请号：US09489272

申请日：2000-01-21

Applicant: Michael Ball

Inventor： Michael Ball

IPC: B23K3524

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11823 ,  H01L2224/11849 ,  H01L2224/13124 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13366 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81024 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract translation: 提供了一种用于在半导体部件上形成接触的方法和系统，例如晶片，芯片和封装。 该方法采用磁体来对准和保持组件衬底的结合位置上的铁磁性球。 该系统包括用于保持组件衬底的保持器，并且保持器上的磁体与构件上的结合位置对准。 该系统还包括用于将铁磁球放置在接合位置上的球放置机构，以及用于将铁磁球结合到接合位置的接合机构，例如烘箱或聚焦能量源。 铁磁球可以作为具有外部焊料层的铁磁芯提供，作为具有导电粘合剂外层的固体铁磁材料，或者作为嵌入可结合基质材料中的铁磁性颗粒。 替代实施例系统包括用于将铁磁球动态对准到结合位置的聚焦磁源。

公开(公告)号：US5652841A

公开(公告)日：1997-07-29

申请号：US487342

申请日：1995-06-07

Applicant: Paul Nemirovsky ,  Michael Ball ,  Roy Dahl

Inventor： Paul Nemirovsky ,  Michael Ball ,  Roy Dahl

IPC: H04L12/56 ,  H04M7/00 ,  G06F17/60

CPC classification number: H04L45/04 ,  H04L45/46

Abstract: A method and apparatus for aggregating terminals into clusters that assists in the construction of a distributed data communication network. Terminal locations to be clustered are used as input along with a weight for each one representing the traffic carried by that location. The terminals are placed into boxes based on their geographic coordinates and only boxes with substantial traffic are retained. Any terminals included in a box not retained are assigned to the closest retained box. The retained boxes are merged into clusters so long as the maximum cluster traffic and maximum cluster radius are not exceeded. The center of mass of the resulting clusters are then determined. The representative locations of the resulting clusters are determined as the location of the terminal in the cluster closest to the center of mass.

Abstract translation: 一种用于将终端聚合成有助于建立分布式数据通信网络的群集的方法和装置。 将要聚类的终端位置用作输入以及每个表示该位置携带的业务的权重。 终端根据其地理坐标放置在盒子中，并且仅保留具有实质流量的盒子。 包含在未保留的盒子中的任何终端都被分配到最接近的保留框。 只要未超过最大集群流量和最大集群半径，保留框将合并到集群中。 然后确定所得簇的质心。 所得到的簇的代表性位置被确定为最靠近质心的簇中的终端的位置。

公开(公告)号：US5426674A

公开(公告)日：1995-06-20

申请号：US141502

申请日：1993-10-25

Applicant: Paul Nemirovsky ,  Michael Ball

Inventor： Paul Nemirovsky ,  Michael Ball

IPC: H04L12/24 ,  G06F15/00 ,  G06F19/00

CPC classification number: H04L41/22

Abstract: A method for constructing and utilizing a distributed data communication network that will meet its performance specifications in the most economical and efficient manner. The steps of the method include clustering terminals based on their proximity and traffic; selecting backbone node sites based on cost; designing the access network composed of terminals, concentrators, backbone nodes and the links between them; generating a backbone link topology; and determining routes in the backbone given the backbone topology and a traffic matrix.

Abstract translation: 一种构建和利用分布式数据通信网络的方法，以最经济高效的方式满足其性能规范。 该方法的步骤包括基于其邻近度和流量来聚类终端; 根据成本选择骨干节点站点; 设计由终端，集中器，骨干节点和它们之间的链路组成的接入网络; 生成骨干链路拓扑; 并确定骨干拓扑和业务矩阵中的骨干网中的路由。

公开(公告)号：US5404451A

公开(公告)日：1995-04-04

申请号：US38756

申请日：1993-03-29

Applicant: Paul Nemirovsky ,  Michael Ball ,  Michael Post

Inventor： Paul Nemirovsky ,  Michael Ball ,  Michael Post

IPC: H04L12/24 ,  G06F13/00

CPC classification number: H04L41/083 ,  H04L41/0826

Abstract: A method for selecting the most cost-efficient configuration for backbone links in a distributed data network is disclosed. The method identifies candidate links between pairs of backbone nodes, evaluates the effect on the network of adding each candidate link to the network, and adds to the network those candidate links which produce a cost savings in the network. The method also routes data through the backbone to minimize transmission delays, and eliminates redundant lines from underutilized links, and removes from the network those links whose removal reduces the cost of the backbone.

Abstract translation: 公开了一种在分布式数据网络中为骨干链路选择最具成本效益的配置的方法。 该方法识别骨干节点对之间的候选链路，评估对网络添加每个候选链路到网络的影响，并向网络添加这些在网络中产生成本节省的候选链路。 该方法还通过骨干路由数据以最小化传输延迟，并消除来自未充分利用的链路的冗余线路，并从网络中删除那些删除骨干链路的链路。