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    Electronic Part
    22.
    发明申请
    Electronic Part 有权
    电子零件

    公开(公告)号：US20140340816A1

    公开(公告)日：2014-11-20

    申请号：US14450347

    申请日：2014-08-04

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

    IPC: H01G4/12 ,  H01G4/008 ,  H01G2/04

    CPC classification number: H01G4/12 ,  H01G2/04 ,  H01G4/008 ,  H01G4/2325 ,  H01G4/252 ,  H01G4/30

    Abstract: An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

    Abstract translation: 电子部件，其包括电子部件主体和电子部件主体的表面上的外部电极。 外部电极包括从Cu-Ni合金层和Cu-Mn合金层中选​​择的至少一种合金层和在合金层的外侧的含Sn层。 含Sn层是外部电极的最外层。 含Sn层与合金层接触。

    JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART
    23.
    发明申请
    JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART 有权
    接合方法，接头结构，电子器件，制造电子器件和电子部件的方法

    公开(公告)号：US20130299236A1

    公开(公告)日：2013-11-14

    申请号：US13904072

    申请日：2013-05-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

    IPC: H01R4/02 ,  B23K1/00

    CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

    Abstract: A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

    Abstract translation: 一种将具有至少由第一金属构成的表面的第一金属构件与至少具有由第二金属制成的表面的第二金属构件接合在一起的方法。 接合材料包括熔点低于第一金属和/或第二金属的低熔点金属。 组成接合材料的低熔点金属是Sn或含有Sn的合金。 第一金属和第二金属中的至少一个是与低熔点金属形成金属间化合物的金属或合金，并且与金属间化合物的晶格常数差为50％以上。 位于第一金属构件和第二金属构件之间的接合材料在低熔点金属熔化的温度下进行热处理。

    Multilayer ceramic electronic component
    24.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11170937B2

    公开(公告)日：2021-11-09

    申请号：US16529881

    申请日：2019-08-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shogo Kanbe ,  Masahiro Andatsu ,  Kosuke Nakano ,  Hideki Otsuka

    IPC: H01G4/232 ,  H01G4/30 ,  H01G2/06 ,  H01G4/12

    Abstract: A multilayer ceramic electronic component includes a laminate including external electrodes connected to a pair of metal terminals through a bonding material. Each of the pair of metal terminals includes a terminal body, an extension portion, and a mounting portion. The terminal body includes side-surface ribs, opposed to the side surfaces of the electronic component body. The bonding material is provided between the side-surface ribs and the external electrode opposed to the side-surface rib and is not provided between the terminal body and the end surface center portion of the external electrode.

    ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION STRUCTURE USING THE SAME
    28.
    发明申请
    ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION STRUCTURE USING THE SAME 审中-公开
    电磁材料，连接方法和连接结构

    公开(公告)号：US20140193650A1

    公开(公告)日：2014-07-10

    申请号：US14208386

    申请日：2014-03-13

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

    IPC: B23K35/24 ,  B23K1/00

    CPC classification number: B23K35/24 ,  B22F1/0003 ,  B23K1/00 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  C22C9/00 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463 ,  H05K3/3484 ,  Y10T428/31678

    Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Cr alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

    Abstract translation: 一种导电材料，其包括含有第一金属的金属成分和具有比第一金属高的熔点的第二金属，并且具有第一金属为Sn或含有Sn的合金的构造，第二金属为Cu -Cr合金，其与第一金属形成熔点为310℃以上的金属间化合物。 第一金属可以是单独的Sn或含有Sn和Cu，Ni，Ag，Au，Sb，Zn，Bi，In，Ge，Al，Co，Mn，Fe，Cr，Mg，Pd，Si中的至少一种的合金 ，Sr，Te和P.

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