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公开(公告)号：US09279861B2
公开(公告)日：2016-03-08
申请号：US13845042
申请日：2013-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Shang Hoon Seo , Seung Hwan Kim , Suk Jin Ham
CPC classification number: G01R31/42
Abstract: Disclosed herein is an apparatus for testing switching of a power semiconductor module, including: a power semiconductor module including a plurality of power semiconductor devices corresponding to a plurality of phases to test a switching operation of a corresponding power semiconductor device; a power supply unit supplying power to the power semiconductor module; a relay switching unit including a plurality of relay switch devices that connects or disconnects between the power semiconductor module and the power supply unit according to a relay control signal; and a control unit controlling the relay switching unit to test on/off characteristics of at least one of the plurality of power semiconductor devices individually or simultaneously, By this configuration, the on/off operations of the plurality of power semiconductor devices are tested individually or simultaneously by the control of the plurality of relay switch devices, thereby improving the user convenience and reducing the test time.
Abstract translation: 本发明公开了一种用于测试功率半导体模块切换的装置，包括：功率半导体模块，包括对应于多个相的多个功率半导体器件，以测试对应的功率半导体器件的开关操作; 向所述功率半导体模块供电的电源单元; 一个继电器切换单元，包括根据继电器控制信号在功率半导体模块和电源单元之间连接或断开的多个继电器开关装置; 以及控制单元，其控制所述继电器开关单元来单独或同时地测试所述多个功率半导体器件中的至少一个的导通/截止特性。通过该配置，所述多个功率半导体器件的接通/断开操作被单独测试或 同时通过多个中继开关装置的控制，从而提高用户便利性并减少测试时间。
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公开(公告)号：US09192050B2
公开(公告)日：2015-11-17
申请号：US13765650
申请日：2013-02-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Yeol Park , Suk Jin Ham , Jung Tae Park , Seung Heon Han , Jung Eun Noh
CPC classification number: H05K1/185 , H01L2224/04105 , H01L2224/19 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H05K3/4644 , H05K3/4697 , H05K2201/10515 , H05K2201/1053 , Y10T29/4913
Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.
Abstract translation: 本文公开了一种制造印刷电路板的方法，包括： 形成包括形成在主体的至少一侧的电极的电子部件; 在电极的上部形成端子和主体的上部; 提供其中形成空腔的基板; 将形成有端子的电子部件安装在基板的空腔中; 以及在所述基板的上部和所述电子部件的上部形成积聚层。
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公开(公告)号：US09164145B2
公开(公告)日：2015-10-20
申请号：US13750882
申请日：2013-01-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Shang Hoon Seo , Seung Hwan Kim , Suk Jin Ham
IPC: G01R31/28
CPC classification number: G01R31/2874
Abstract: There are provided an apparatus for testing a semiconductor device and a method for testing a semiconductor device. The apparatus for testing a semiconductor device includes: a temperature detection unit detecting a temperature of a semiconductor device to generate a detected temperature; a controller comparing the detected temperature with a preset control temperature to generate a comparison result, and determining whether to cool the semiconductor device according to the comparison result; and a cooling unit cooling the semiconductor device according to a control of the controller, wherein the controller resets the control temperature, when the detected temperature is outside of a range of an operational temperature of the semiconductor device.
Abstract translation: 提供了一种用于测试半导体器件的设备和用于测试半导体器件的方法。 用于测试半导体器件的装置包括：温度检测单元，其检测半导体器件的温度以产生检测温度; 控制器将检测到的温度与预设的控制温度进行比较以产生比较结果，以及根据比较结果确定是否冷却半导体器件; 以及冷却单元，其根据所述控制器的控制来冷却所述半导体器件，其中，当所述检测温度在所述半导体器件的工作温度的范围之外时，所述控制器复位所述控制温度。
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公开(公告)号：US09155192B2
公开(公告)日：2015-10-06
申请号：US14051019
申请日：2013-10-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyung Ho Lee , Seung Wan Woo , Po Chul Kim , Young Nam Hwang , Suk Jin Ham
CPC classification number: H05K1/0271 , H01L23/06 , H01L23/16 , H01L23/3171 , H01L23/562 , H01L2924/0002 , H01L2924/3511 , H05K3/285 , H05K3/3431 , H05K2201/0175 , H05K2201/0191 , H05K2201/068 , H05K2203/1327 , H01L2924/00
Abstract: Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.
Abstract translation: 本文公开了一种电子部件封装，包括：设置在基板的至少一个表面上的连接部件; 通过所述连接部件与所述基板连接的有源元件; 覆盖有源元件的暴露表面的成型部件; 以及形成在模制部件的暴露表面上的附加层，以减少翘曲现象。 在电子部件封装中，与现有技术相比，翘曲现象可能会降低。
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公开(公告)号：US20150136458A1
公开(公告)日：2015-05-21
申请号：US14182206
申请日：2014-02-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Ju Yang , Gyu Seok Kim , Suk Jin Ham , Se Yoon Park , Jin Uk Cha , Hee Suk Chung , Mi Yang Kim
CPC classification number: H05K1/09 , C23C14/185 , C23C14/34 , C23C14/5833 , C23F4/00 , C23F4/04 , H05K1/03 , H05K1/0306 , H05K3/027 , H05K3/06 , H05K3/16 , H05K3/388 , H05K2201/0391 , H05K2203/092
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 具体地，根据本发明的优选实施例，印刷电路板包括：绝缘层; 以及形成在所述绝缘层上的金属层，其中在所述金属层中，（110）和（112）的晶体取向所占的比例为20〜80％。 通过这样做，本发明的优选实施例提供了一种印刷电路板，其包括具有不同晶体取向的金属层，以最小化妨碍诸如导电性的电特性的因素，并改善机械性能的各向同性和制造印刷电路板的方法 。
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Patent Agency Ranking
公开(公告)号：US20140176506A1
公开(公告)日：2014-06-26
申请号：US13831704
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hee Jin PARK , Ji Hyuk Lim , Seung Mi Lee , Suk Jin Ham
IPC: G06F3/042
CPC classification number: G06F3/042 , G02F1/13338 , G06F3/041 , G06F2203/04103
Abstract: Disclosed herein is a touch sensor, including: a window; a transparent substrate having a first electrode part formed on one surface thereof; and a first adhesive layer allowing the window and one surface of the transparent substrate to adhere to each other, wherein a first protrusion part is formed on an edge of one surface of the transparent substrate.
Abstract translation: 这里公开了一种触摸传感器，包括：窗口; 透明基板，具有形成在其一个表面上的第一电极部分; 以及允许所述窗口和所述透明基板的一个表面彼此粘合的第一粘合层，其中在所述透明基板的一个表面的边缘上形成有第一突起部。
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公开(公告)号：US20140176180A1
公开(公告)日：2014-06-26
申请号：US13845042
申请日：2013-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Shang Hoon Seo , Seung Hwan Kim , Suk Jin Ham
IPC: G01R31/26
CPC classification number: G01R31/42
Abstract: Disclosed herein is an apparatus for testing switching of a power semiconductor module, including: a power semiconductor module including a plurality of power semiconductor devices corresponding to a plurality of phases to test a switching operation of a corresponding power semiconductor device; a power supply unit supplying power to the power semiconductor module; a relay switching unit including a plurality of relay switch devices that connects or disconnects between the power semiconductor module and the power supply unit according to a relay control signal; and a control unit controlling the relay switching unit to test on/off characteristics of at least one of the plurality of power semiconductor devices individually or simultaneously, By this configuration, the on/off operations of the plurality of power semiconductor devices are tested individually or simultaneously by the control of the plurality of relay switch devices, thereby improving the user convenience and reducing the test time.
Abstract translation: 本发明公开了一种用于测试功率半导体模块切换的装置，包括：功率半导体模块，包括对应于多个相的多个功率半导体器件，以测试对应的功率半导体器件的开关操作; 向所述功率半导体模块供电的电源单元; 一个继电器切换单元，包括根据继电器控制信号在功率半导体模块和电源单元之间连接或断开的多个继电器开关装置; 以及控制单元，控制所述继电器开关单元单独地或同时地测试所述多个功率半导体器件中的至少一个的导通/截止特性。通过该配置，所述多个功率半导体器件的接通/断开操作被单独测试或 同时通过多个中继开关装置的控制，从而提高用户便利性并减少测试时间。
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28.发明申请INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING THE SAME, AND METHOD FOR MANUFACTURING THE SUBSTRATE 审中-公开绝缘组合物，包括使用其的绝缘层的基板以及用于制造基板的方法公开(公告)号：US20140170412A1
公开(公告)日：2014-06-19
申请号：US13827374
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Soo Young JI , Shang Hoon Seo , Suk Jin Ham , Seung Hwan Kim
CPC classification number: C09D11/324 , C09D11/38 , H05K1/0373 , H05K3/28 , H05K2201/0141 , H05K2201/0257 , H05K2201/0293 , H05K2203/013 , Y10T428/26
Abstract: An insulating composition including a graphene oxide and an insulating material including the same; and a polar solvent having a solvent polarity index (P) of greater than 5.5, a substrate including an insulating layer using the same, and a method for manufacturing the substrate. It is possible to provide an insulating composition including a specific solvent that can secure dispersibility of the graphene oxide while including the graphene oxide having excellent insulating and mechanical properties as an insulating material. Further, it is possible to provide a substrate including a fine insulating layer pattern as well as a bulk insulating layer pattern by using the insulating composition to overcome an aggregation problem in a conventional inkjet printing method.
Abstract translation: 包含石墨烯氧化物和包含其的绝缘材料的绝缘组合物; 和具有大于5.5的溶剂极性指数（P）的极性溶剂，使用其的绝缘层的基板以及该基板的制造方法。 可以提供包含能够确保石墨烯氧化物的分散性的特定溶剂的绝缘组合物，同时包括具有优异的绝缘和机械性能的石墨烯氧化物作为绝缘材料。 此外，通过使用绝缘组合物来克服常规喷墨打印方法中的聚集问题，可以提供包括精细绝缘层图案的衬底以及体绝缘层图案。
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公开(公告)号：US20140139835A1
公开(公告)日：2014-05-22
申请号：US14060385
申请日：2013-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ji Hoon KIM , Suk Jin Ham , Ji Hyuk Lim
CPC classification number: G01N21/47 , G01N21/274 , G01N2021/4769
Abstract: A measurement device of a degree of cure, and more particularly, a measurement device of a degree of cure capable of using while being portable in a production line. The measurement device of the degree of cure includes: a light source; a light transmission and reflection mirror passing through a light irradiated from the light source and reflecting scattered light reflected and returned from a sample; a light splitting mirror transmitting and reflecting the scattered light so as to detect intensity of the scattered light reflected by the light transmission and reflection mirror; a detector detecting the intensity of the scattered light transmitted and reflected by the light splitting mirror; and a data obtaining unit collecting data of the intensity of the scattered light detected by the detector.
Abstract translation: 一种固化度的测量装置，更具体地说，可以在生产线中携带便携时能够使用的固化程度的测量装置。 固化度的测量装置包括：光源; 透光反射镜通过从光源照射的光并反射从样品反射和返回的散射光; 透射和反射散射光以便检测由透光和反射镜反射的散射光的强度的分光镜; 检测由所述分光镜透射和反射的散射光的强度的检测器; 以及数据获取单元，其收集由检测器检测到的散射光的强度的数据。
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公开(公告)号：US20140131081A1
公开(公告)日：2014-05-15
申请号：US13827656
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin Cho , Se Kyung Lee , Bae Soon Son , Suk Jin Ham
IPC: H05K3/20
CPC classification number: H05K3/284 , H01L21/563 , H01L2224/16225 , H05K3/3436 , H05K2201/0129 , H05K2201/0145 , H05K2201/09909 , H05K2201/10977 , H05K2203/013 , H05K2203/0514 , H05K2203/0545
Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam.
Abstract translation: 本文公开了一种印刷电路板，包括：基底，其上形成有连接垫; 与连接垫的一侧隔开的坝; 以及形成为围绕坝的保护层。
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