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    Optoelectronic device
    24.
    发明授权
    Optoelectronic device 有权

    公开(公告)号：US11387381B2

    公开(公告)日：2022-07-12

    申请号：US17071694

    申请日：2020-10-15

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

    IPC: H01L31/16 ,  H01L23/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

    Electronic device including electrical connections on an encapsulation block
    26.
    发明授权
    Electronic device including electrical connections on an encapsulation block 有权

    公开(公告)号：US11114404B2

    公开(公告)日：2021-09-07

    申请号：US16704082

    申请日：2019-12-05

    Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

    Inventor： Romain Coffy ,  Patrick Laurent ,  Laurent Schwartz

    IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

    Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

    Electronic device comprising a chip of integrated circuits stacked with an optical plate
    28.
    发明授权
    Electronic device comprising a chip of integrated circuits stacked with an optical plate 有权
    电子设备包括堆叠有光学板的集成电路芯片

    公开(公告)号：US09245914B2

    公开(公告)日：2016-01-26

    申请号：US14552800

    申请日：2014-11-25

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Olivier Le-Briz ,  Romain Coffy

    IPC: H01L31/0203 ,  H01L27/146

    CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/11

    Abstract: An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.

    Abstract translation: 电子器件由集成电路芯片和光学板的堆叠形成。 集成电路芯片包括形成在半导体衬底板上或其中的集成电路（例如光学电路）。 光学集成电路可以形成光学传感器。 电连接网络设置在半导体衬底板的顶侧上。 通过电气连接通孔连接到电气连接网络的电连接凸耳安装在半导体衬底板的背面。 通孔通过位于距离半导体衬底板的周边一定距离的硅通孔。 光学板被配置为允许光辐射传递到光学集成电路。

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