公开(公告)号：US20230325646A1

公开(公告)日：2023-10-12

申请号：US17848381

申请日：2022-06-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  THUAN VU ,  STANLEY HONG ,  STEPHEN TRINH ,  STEVEN LEMKE ,  LOUISA SCHNEIDER ,  NHAN DO

IPC: G06N3/063

CPC classification number: G06N3/063

Abstract: Numerous examples are disclosed of an artificial neural network comprising a plurality of reference arrays used for configuration of a vector-by-matrix multiplication array. In one example, a system comprises a vector-by-matrix multiplication array in an artificial neural network; and a plurality of reference arrays characterized by different I-V curves, wherein one or more of the plurality of reference arrays are used to generate input voltage the vector-by-matrix multiplication array during operation.

公开(公告)号：US20220293756A1

公开(公告)日：2022-09-15

申请号：US17346524

申请日：2021-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Leo Xing ,  CHUNMING WANG ,  XIAN LIU ,  NHAN DO ,  GUO XIANG SONG

IPC: H01L29/423 ,  H01L29/788 ,  H01L21/28 ,  H01L29/66

Abstract: A method of forming a memory device that includes forming a first insulation layer, a first conductive layer, and a second insulation layer on a semiconductor substrate, forming a trench in the second insulation layer to expose the upper surface of the first conductive layer, performing an oxidation process and a sloped etch process to reshape the upper surface to a concave shape, forming a third insulation layer on the reshaped upper surface, forming a conductive spacer on the third insulation layer, removing portions of the first conductive layer leaving a floating gate under the conductive spacer with the reshaped upper surface terminating at a side surface at a sharp edge, and forming a word line gate laterally adjacent to and insulated from the floating gate. The conductive spacer includes a lower surface that faces and matches the shape of the reshaped upper surface.

公开(公告)号：US20210209457A1

公开(公告)日：2021-07-08

申请号：US16830733

申请日：2020-03-26

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  STEVEN LEMKE ,  VIPIN TIWARI ,  NHAN DO ,  MARK REITEN

IPC: G06N3/063 ,  G06F11/16 ,  G11C29/44 ,  G11C13/00

Abstract: Numerous embodiments are provided for compensating for drift error in non-volatile memory cells within a VMM array in an analog neuromorphic memory system. For example, in one embodiment, a circuit is provided for compensating for drift error during a read operation, the circuit comprising a data drift monitoring circuit coupled to the array for generating an output indicative of data drift; and a bitline compensation circuit for generating a compensation current in response to the output from the data drift monitoring circuit and injecting the compensation current into one or more bitlines of the array.

公开(公告)号：US20200335511A1

公开(公告)日：2020-10-22

申请号：US16919697

申请日：2020-07-02

Applicant: Silicon Storage Technology, Inc.

Inventor： HIEU VAN TRAN ,  STEVEN LEMKE ,  VIPIN TIWARI ,  NHAN DO ,  MARK REITEN

IPC: H01L27/11531 ,  G06N3/08 ,  G11C16/04 ,  H01L29/788

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

公开(公告)号：US20170103989A1

公开(公告)日：2017-04-13

申请号：US15225425

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： CHIEN SHENG SU ,  MANDANA TADAYONI ,  NHAN DO

IPC: H01L27/115 ,  H01L21/02 ,  H01L21/28 ,  H01L29/66 ,  H01L29/423 ,  H01L29/49 ,  H01L21/762 ,  H01L21/84 ,  H01L29/08

CPC classification number: H01L27/11521 ,  H01L21/02532 ,  H01L21/02634 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/11531 ,  H01L27/11534 ,  H01L27/11536 ,  H01L27/1203 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881

Abstract: A method of forming a semiconductor device with memory cells and logic devices on the same silicon-on-insulator substrate. The method includes providing a substrate that includes silicon, a first insulation layer directly over the silicon, and a silicon layer directly over the first insulation layer. Silicon is epitaxially grown on the silicon layer in a first (memory) area of the substrate and not in a second (logic device) area of the substrate such that the silicon layer is thicker in the first area of the substrate relative to the second area of the substrate. Memory cells are formed in the first area of the substrate, and logic devices are formed in the second area of the substrate.

公开(公告)号：US20170098654A1

公开(公告)日：2017-04-06

申请号：US15225393

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： FENG ZHOU ,  XIAN LIU ,  JENG-WEI YANG ,  CHIEN-SHENG SU ,  NHAN DO

IPC: H01L27/115 ,  H01L29/66 ,  H01L29/423 ,  H01L29/788 ,  H01L29/49

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L21/8238 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A method of forming a pair of memory cells that includes forming a polysilicon layer over and insulated from a semiconductor substrate, forming a pair of conductive control gates over and insulated from the polysilicon layer, forming first and second insulation layers extending along inner and outer side surfaces of the control gates, removing portions of the polysilicon layer adjacent the outer side surfaces of the control gates, forming an HKMG layer on the structure and removing portions thereof between the control gates, removing a portion of the polysilicon layer adjacent the inner side surfaces of the control gates, forming a source region in the substrate adjacent the inner side surfaces of the control gates, forming a conductive erase gate over and insulated from the source region, forming conductive word line gates laterally adjacent to the control gates, and forming drain regions in the substrate adjacent the word line gates.

公开(公告)号：US20230259738A1

公开(公告)日：2023-08-17

申请号：US18141090

申请日：2023-04-28

Applicant: Silicon Storage Technology, Inc. ,  The Regents of the University of California

Inventor： Hieu Van Tran ,  NHAN DO ,  FARNOOD MERRIKH BAYAT ,  XINJIE GUO ,  DMITRI STRUKOV ,  VIPIN TIWARI ,  MARK REITEN

IPC: G06N3/04 ,  G06N3/063 ,  G11C11/54 ,  G11C16/34 ,  G11C29/38 ,  G06N3/045 ,  G11C16/08 ,  G11C16/12 ,  G11C16/16 ,  G06F3/06

CPC classification number: G06N3/04 ,  G06F3/061 ,  G06F3/0655 ,  G06F3/0688 ,  G06N3/045 ,  G06N3/063 ,  G11C11/54 ,  G11C16/08 ,  G11C16/12 ,  G11C16/16 ,  G11C16/3436 ,  G11C29/38

Abstract: A memory device includes a non-volatile memory cells, source regions and drain regions arranged in rows and columns. Respective ones of the columns of drain regions include first drain regions and second drain regions that alternate with each other. Respective ones of first lines electrically connect together the source regions in one of the rows of the source regions and are electrically isolated from the source regions in other rows of the source regions. Respective ones of second lines electrically connect together the first drain regions of one of the columns of drain regions and are electrically isolated from the second drain regions of the one column of drain regions. Respective ones of third lines electrically connect together the second drain regions of one of the columns of drain regions and are electrically isolated from the first drain regions of the one column of drain regions.

公开(公告)号：US20230101585A1

公开(公告)日：2023-03-30

申请号：US17576754

申请日：2022-01-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Yuri Tkachev ,  JINHO KIM ,  CYNTHIA FUNG ,  GILLES FESTES ,  BERNARD BERTELLO ,  PARVIZ GHAZAVI ,  BRUNO VILLARD ,  JEAN FRANCOIS THIERY ,  CATHERINE DECOBERT ,  SERGUEI JOURBA ,  FAN LUO ,  LATT TEE ,  NHAN DO

IPC: G11C29/50

Abstract: A method of testing non-volatile memory cells formed on a die includes erasing the memory cells and performing a first read operation to determine a lowest read current RC1 for the memory cells and a first number N1 of the memory cells having the lowest read current RC1. A second read operation is performed to determine a second number N2 of the memory cells having a read current not exceeding a target read current RC2. The target read current RC2 is equal to the lowest read current RC1 plus a predetermined current value. The die is determined to be acceptable if the second number N2 is determined to exceed the first number N1 plus a predetermined number. The die is determined to be defective if the second number N2 is determined not to exceed the first number N1 plus the predetermined number.

公开(公告)号：US20220147794A1

公开(公告)日：2022-05-12

申请号：US17580862

申请日：2022-01-21

Applicant: Silicon Storage Technology, Inc. ,  The Regents of the University of California

Inventor： FARNOOD MERRIKH BAYAT ,  XINJIE GUO ,  DMITRI STRUKOV ,  NHAN DO ,  HIEU VAN TRAN ,  VIPIN TIWARI ,  MARK REITEN

IPC: G06N3/04 ,  G06N3/063 ,  G06F3/06

Abstract: An artificial neural network device that utilizes one or more non-volatile memory arrays as the synapses. The synapses are configured to receive inputs and to generate therefrom outputs. Neurons are configured to receive the outputs. The synapses include a plurality of memory cells, wherein each of the memory cells includes spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate disposed over and insulated from a first portion of the channel region and a non-floating gate disposed over and insulated from a second portion of the channel region. Each of the plurality of memory cells is configured to store a weight value corresponding to a number of electrons on the floating gate. The plurality of memory cells are configured to multiply the inputs by the stored weight values to generate the outputs.

公开(公告)号：US20210358551A1

公开(公告)日：2021-11-18

申请号：US17082956

申请日：2020-10-28

Applicant: Silicon Storage Technology, Inc.

Inventor： HIEU VAN TRAN ,  STANLEY HONG ,  STEPHEN TRINH ,  THUAN VU ,  STEVEN LEMKE ,  VIPIN TIWARI ,  NHAN DO

IPC: G11C16/10 ,  G11C16/04 ,  G11C16/14 ,  G11C16/34 ,  G11C11/56 ,  G06N3/063

Abstract: Numerous embodiments of analog neural memory arrays are disclosed. Two or more physical memory cells are grouped together to form a logical cell that stores one of N possible levels. Within each logical cell, the memory cells can be programmed using different mechanisms. For example, one or more of the memory cells in a logical cell can be programmed using a coarse programming mechanism, one or more of the memory cells can be programmed using a fine mechanism, and one or more of the memory cells can be programmed using a tuning mechanism. This achieves extreme programming accuracy and programming speed.