公开(公告)号：US08624156B2

公开(公告)日：2014-01-07

申请号：US11331674

申请日：2006-01-13

申请人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

发明人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

IPC分类号： B23K26/00

CPC分类号： H05K3/0026 ,  B23K26/38 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/30 ,  B23K2103/34 ,  B23K2103/38 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  H05K2201/0112 ,  H05K2203/1383

摘要： Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

摘要翻译： 提供一种通过使用激光加工用保护片，通过激光束的光吸收烧蚀对工件进行加工时，能够有效地抑制由分解物产生的工件的表面的污染，以及高精度的加工来制造激光加工部件的方法。 本发明的目的还在于提供一种用于激光加工部件的制造方法的激光加工用保护片。

公开(公告)号：US6157084A

公开(公告)日：2000-12-05

申请号：US913571

申请日：1997-09-17

申请人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48 ,  H01L23/40 ,  H01L23/52

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/31 ,  H05K3/4007 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/1572 ,  H05K3/423

摘要： A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8). The bump (9) formed on one end of the one conductive path (7) of the film carrier (2) contacts an electrode (12) of the semiconductor element (3) and is electrically connected, whereby the semiconductor element (3) is mounted on the film carrier (2). An insulating resin layer (4) is formed on one surface (6a) of the insulator layer (6) to cover the semiconductor element (3).

摘要翻译： PCT No.PCT / JP95 / 00493 Sec。 371日期1997年9月17日 102（e）日期1997年9月17日PCT 1995年3月17日提交的能够满足对半导体元件的精细布线的需求和高密度安装的半导体器件，以及对其薄型结构的需求， 器件在用于密封半导体元件和薄膜载体的绝缘树脂的粘合性方面优异，因此高度可靠。 在图 如图1所示，嵌入导电电路（5），使其不会在绝缘体层（6）的两个表面（6a，6b）处露出，并且导电路径（7,8）从两者形成成对 导电电路（5）的表面（5a，5b），导电路径在导电电路（5）的表面方向上相对于彼此滑动。 导电路径（7,8）分别连接到凸块（9,10），并且导电电路（5）和凸块（9,10）通过导电路径（7,8）传导。 形成在薄膜载体（2）的一个导电路径（7）的一端上的凹凸（9）与半导体元件（3）的电极（12）接触并被电连接，由此半导体元件 安装在胶片载体（2）上。 绝缘树脂层（4）形成在绝缘体层（6）的一个表面（6a）上以覆盖半导体元件（3）。

公开(公告)号：US5848465A

公开(公告)日：1998-12-15

申请号：US740385

申请日：1996-10-29

申请人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

IPC分类号： G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H05K3/06

CPC分类号： G01R3/00 ,  G01R1/07314 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49865 ,  Y10T29/49867

摘要： A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.

摘要翻译： 一种用于制造探针的方法包括以下步骤：（1）形成其中形成在绝缘柔性基板的一侧上的接触部分和形成在柔性基板的任一侧或内侧上的导体电连续的结构，以及 （2）将柔性基板和能够在其外周面支撑柔性基板的平面方向的张力的刚性框架基板接合，通过在加热后通过层叠压接，或者在层叠压制之后进行加热， 由柔性基板包围的柔性基板的平面张力。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US4916009A

公开(公告)日：1990-04-10

申请号：US224612

申请日：1988-07-27

申请人： Atsushi Hino ,  Yuzuru Noda

发明人： Atsushi Hino ,  Yuzuru Noda

IPC分类号： B32B15/088 ,  B32B15/08 ,  C08G73/10 ,  H01L23/495 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC分类号： C08G73/1042 ,  B32B15/08 ,  H01L23/49586 ,  H05K1/0346 ,  H01L2924/0002 ,  H05K1/0393 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A flexible printing base comprising a metal foil having formed thereon a polyimide layer is disclosed, wherein said metal foil has a centerline average roughness of not more than 0.7 .mu.m, and said polyimide mainly comprises a repeating unit represented by formula (I): ##STR1## and a repeating unit represented by formula (II): ##STR2## wherein l:m=x:y, wherein x represents a number not less than 45 and less than 70; y represents a number more than 30 and not more than 55; and x+y=100, said polyimide layer is formed by applying a solution of a polyamic acid mainly comprising a repeating unit represented by formula (III): ##STR3## and a repeating unit represented by formula (IV): ##STR4## wherein l and m are as defined above, in N,N'-dimethylformamide and/or N,N'-dimethylacetamide on a metal foil, followed by imidation. The flexible printing base is quite free from curling either in the state of a composite laminate but also in the state where the metal foil has been removed by etching.

摘要翻译： 公开了一种柔性印刷基底，其包括在其上形成有聚酰亚胺层的金属箔，其中所述金属箔的中心线平均粗糙度不大于0.7μm，所述聚酰亚胺主要包含由式（I）表示的重复单元： （I）和式（II）表示的重复单元：其中l：m = x：y，其中x表示不小于45且小于70的数; y表示多于30且不超过55的数字; 并且x + y = 100，所述聚酰亚胺层通过施加主要包含由式（III）表示的重复单元的聚酰胺酸的溶液形成：（III）和由式（IV）表示的重复单元： （IV）其中l和m如上定义，在金属箔上的N，N'-二甲基甲酰胺和/或N，N'-二甲基乙酰胺中，随后进行酰亚胺化。 柔性印刷基材在复合层压板的状态下也是完全没有卷曲，而且在通过蚀刻去除金属箔的状态下也是如此。

公开(公告)号：US20100273313A1

公开(公告)日：2010-10-28

申请号：US12820375

申请日：2010-06-22

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B32B38/04 ,  B32B27/32 ,  H01L21/26

CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

摘要： A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

摘要翻译： 一种激光加工部件的制造方法，其中，使用具有规定的物理特性的材料，在基材上至少设置有作为激光加工用的粘合片的压敏粘合剂层。 该方法包括通过压敏粘合剂层将激光加工用粘合片粘合到工件的激光射出侧，通过用照射2倍以下的激光束照射工件进行加工 在作业中形成通孔的强度高于用于引起作业烧蚀的阈值的照射强度，以及在加工后的工作中剥离用于激光加工的压敏粘合片。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。

公开(公告)号：US07586060B2

公开(公告)日：2009-09-08

申请号：US10584825

申请日：2004-11-02

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B23K26/38

CPC分类号： H05K3/0026 ,  B23K26/18 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  C09J7/22 ,  C09J2425/006 ,  C09J2483/006 ,  H05K2203/1383 ,  Y10T428/28

摘要： A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).

摘要翻译： 一种激光加工保护片（2），其能够通过激光束（7）的紫外线吸收消除来处理待处理物品（1）时，有效地防止被分解物质处理的被处理物的表面的污染。 一种使用激光加工保护片（2）的激光加工品（10）的制造方法。 当通过激光束（7）的紫外线吸收消融处理物品（1）时，激光加工保护片（2）设置在待处理物品（1）的激光束入射面侧。

公开(公告)号：US20080061028A1

公开(公告)日：2008-03-13

申请号：US11892112

申请日：2007-08-20

申请人： Ichiro Amino ,  Atsushi Hino ,  Hironaka Fujii ,  Noriaki Harada

发明人： Ichiro Amino ,  Atsushi Hino ,  Hironaka Fujii ,  Noriaki Harada

IPC分类号： B29D11/00

CPC分类号： B29D11/00278 ,  G02B3/0031 ,  G02B3/0056

摘要： The present invention provides a method for producing an optical member including the steps of subjecting a surface of a resin film to laser beam irradiation via a projection mask,.while sequentially moving either the resin film or the projection mask, or the both, and etching the resin film plural times to work into the shape of a lens, wherein the projection mask comprises plural light-transmitting parts or light-shielding parts having gradually different sizes; and a method for producing a molding die for the optical member. The method for producing an optical member and the method for producing a molding die for an optical member can be suitably used in, for example, a microlens sheet, a light-condensing sheet, a light-diffusing sheet, or the like.

摘要翻译： 本发明提供了一种制造光学部件的方法，包括以下步骤：通过投影掩模对树脂膜的表面进行激光束照射，同时依次移动树脂膜或投影掩模或两者，并蚀刻 树脂膜多次工作成透镜形状，其中投影掩模包括具有逐渐不同尺寸的多个透光部分或遮光部分; 以及用于制造用于光学部件的成型模具的方法。 光学部件的制造方法以及光学部件的成形用模具的制造方法可以适用于例如微透镜片，聚光片，光漫射片等。

公开(公告)号：US20070181543A1

公开(公告)日：2007-08-09

申请号：US10584825

申请日：2004-11-02

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B23K26/36 ,  B23K26/00 ,  B32B7/12

CPC分类号： H05K3/0026 ,  B23K26/18 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  C09J7/22 ,  C09J2425/006 ,  C09J2483/006 ,  H05K2203/1383 ,  Y10T428/28

摘要： A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser. processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).

摘要翻译： 一种激光加工保护片（2），其能够通过激光束（7）的紫外线吸收消除来处理待处理物品（1）时，有效地防止被分解物质处理的被处理物的表面的污染。 一种使用激光的激光加工制品（10）的制造方法。 加工保护板（2）。 当通过激光束（7）的紫外线吸收消融处理物品（1）时，激光加工保护片（2）设置在待处理物品（1）的激光束入射面侧。

公开(公告)号：US20060246279A1

公开(公告)日：2006-11-02

申请号：US10554540

申请日：2004-04-19

申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

IPC分类号： B32B7/12

CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

摘要： A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

摘要翻译： 激光加工部件的制造方法的特征在于，使用具有特定物理性质的材料，至少在基材上设置作为激光加工用粘合片（2）的压敏粘合剂层，该方法 包括通过粘合剂层将用于激光加工的压敏粘合片（2）粘附到工件（1）的激光束出射侧的步骤，通过照射工件来处理工件的步骤 在用于在工件（1）中形成通孔的照射强度的2倍以内的激光束（6），高于用于引起工件（1）的烧蚀的阈值的照射强度，以及剥离步骤 用于加工后的工件（1）的激光加工用压敏粘合片（2）。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。