公开(公告)号：US6157084A

公开(公告)日：2000-12-05

申请号：US913571

申请日：1997-09-17

申请人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48 ,  H01L23/40 ,  H01L23/52

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/31 ,  H05K3/4007 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/1572 ,  H05K3/423

摘要： A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8). The bump (9) formed on one end of the one conductive path (7) of the film carrier (2) contacts an electrode (12) of the semiconductor element (3) and is electrically connected, whereby the semiconductor element (3) is mounted on the film carrier (2). An insulating resin layer (4) is formed on one surface (6a) of the insulator layer (6) to cover the semiconductor element (3).

摘要翻译： PCT No.PCT / JP95 / 00493 Sec。 371日期1997年9月17日 102（e）日期1997年9月17日PCT 1995年3月17日提交的能够满足对半导体元件的精细布线的需求和高密度安装的半导体器件，以及对其薄型结构的需求， 器件在用于密封半导体元件和薄膜载体的绝缘树脂的粘合性方面优异，因此高度可靠。 在图 如图1所示，嵌入导电电路（5），使其不会在绝缘体层（6）的两个表面（6a，6b）处露出，并且导电路径（7,8）从两者形成成对 导电电路（5）的表面（5a，5b），导电路径在导电电路（5）的表面方向上相对于彼此滑动。 导电路径（7,8）分别连接到凸块（9,10），并且导电电路（5）和凸块（9,10）通过导电路径（7,8）传导。 形成在薄膜载体（2）的一个导电路径（7）的一端上的凹凸（9）与半导体元件（3）的电极（12）接触并被电连接，由此半导体元件 安装在胶片载体（2）上。 绝缘树脂层（4）形成在绝缘体层（6）的一个表面（6a）上以覆盖半导体元件（3）。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5821626A

公开(公告)日：1998-10-13

申请号：US669904

申请日：1996-06-25

申请人： Kazuo Ouchi ,  Shoji Morita ,  Atsushi Hino ,  Masakazu Sugimoto

发明人： Kazuo Ouchi ,  Shoji Morita ,  Atsushi Hino ,  Masakazu Sugimoto

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05016 ,  H01L2224/05556 ,  H01L2224/05559 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/13023 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311

摘要： A film carrier comprising, on a laminate of an insulating layer and a conductive circuit, a conductive part to be connected to an external substrate and an energy introduction part to supply an energy to connect a semiconductor element, a semiconductor device, and a method for mounting a semiconductor element. The present invention has enabled provision of fine-pitched or highly dense wiring of a semiconductor element, and assures easy and dependable electric construction of the present invention wherein an energy for connection is supplied from the energy introduction part to make a connection of a film carrier to semiconductor element is advantageous in that attenuation of the energy for connection due to an insulating layer occurs less, since the energy for connection can be directly introduced into conductive circuit, thus enabling efficient utilization of the energy, which in turn permits easy and efficient mounting of a semiconductor element.

摘要翻译： 一种胶片载体，包括在绝缘层和导电电路的叠层上，与外部基板连接的导电部分和能够连接半导体元件的能量引入部分，半导体器件和方法 安装半导体元件。 本发明能够提供半导体元件的精细或高密度布线，并且确保本发明的容易且可靠的电结构，其中从能量引入部分提供用于连接的能量以形成薄膜载体的连接 对于半导体元件的优点在于，由于绝缘层导致的用于连接的能量的衰减较少，因为用于连接的能量可以直接引入导电电路中，从而能够有效地利用能量，这进而允许容易且有效的安装 的半导体元件。

公开(公告)号：US5848465A

公开(公告)日：1998-12-15

申请号：US740385

申请日：1996-10-29

申请人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

IPC分类号： G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H05K3/06

CPC分类号： G01R3/00 ,  G01R1/07314 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49865 ,  Y10T29/49867

摘要： A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.

摘要翻译： 一种用于制造探针的方法包括以下步骤：（1）形成其中形成在绝缘柔性基板的一侧上的接触部分和形成在柔性基板的任一侧或内侧上的导体电连续的结构，以及 （2）将柔性基板和能够在其外周面支撑柔性基板的平面方向的张力的刚性框架基板接合，通过在加热后通过层叠压接，或者在层叠压制之后进行加热， 由柔性基板包围的柔性基板的平面张力。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US5188702A

公开(公告)日：1993-02-23

申请号：US872504

申请日：1992-04-23

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

申请人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

发明人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

摘要： A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US07922843B2

公开(公告)日：2011-04-12

申请号：US12422907

申请日：2009-04-13

申请人： Kazuo Kitada ,  Yoshihiro Kameda ,  Kanji Nishida ,  Tomokazu Yura ,  Takaichi Amano ,  Hiromichi Ohashi ,  Atsushi Hino ,  Naoyuki Matsuo

发明人： Kazuo Kitada ,  Yoshihiro Kameda ,  Kanji Nishida ,  Tomokazu Yura ,  Takaichi Amano ,  Hiromichi Ohashi ,  Atsushi Hino ,  Naoyuki Matsuo

IPC分类号： B32B41/00

CPC分类号： G02F1/133305 ,  B23K26/0846 ,  B23K26/40 ,  B23K2101/16 ,  B23K2103/172 ,  B29D11/0073 ,  B32B37/182 ,  B32B38/0004 ,  B32B38/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2305/55 ,  B32B2307/40 ,  B32B2307/42 ,  B32B2310/0843 ,  B32B2457/202 ,  G01N21/8422 ,  G02B5/3016 ,  G02F1/1303 ,  G02F1/133528 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/12

摘要： A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.

公开(公告)号：US07913734B2

公开(公告)日：2011-03-29

申请号：US12843430

申请日：2010-07-26

申请人： Kazuo Kitada ,  Yoshihiro Kameda ,  Kanji Nishida ,  Tomokazu Yura ,  Takaichi Amano ,  Hiromichi Ohashi ,  Atsushi Hino ,  Naoyuki Matsuo

发明人： Kazuo Kitada ,  Yoshihiro Kameda ,  Kanji Nishida ,  Tomokazu Yura ,  Takaichi Amano ,  Hiromichi Ohashi ,  Atsushi Hino ,  Naoyuki Matsuo

IPC分类号： B32B41/00

CPC分类号： G02F1/133305 ,  B23K26/0846 ,  B23K26/40 ,  B23K2101/16 ,  B23K2103/172 ,  B29D11/0073 ,  B32B37/182 ,  B32B38/0004 ,  B32B38/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2305/55 ,  B32B2307/40 ,  B32B2307/42 ,  B32B2310/0843 ,  B32B2457/202 ,  G01N21/8422 ,  G02B5/3016 ,  G02F1/1303 ,  G02F1/133528 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/12

摘要： A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.

摘要翻译： 带状偏振膜具有与其一个表面一致地粘附的保护膜条，并且可剥离衬垫顺应地粘附到其另一表面并从膜输送站1输送。在外观检查之后，将保护膜条和 使用激光单元11对偏光膜条F进行半切割，以形成每个由保护膜和偏振膜F组成的叠片阵列，其中可释放的衬垫保持不变。 然后，将偏光膜F供给到剥离机构4.剥离机构4将偏光膜F的最前面的一个将切割薄膜F的层叠机构5向刀片边缘部件剥离。 最前面的偏振片F与最前方的偏振片F的馈送同步地层叠到通过面板传送装置18输送到层叠机构的液晶面板W.

公开(公告)号：US20090191410A1

公开(公告)日：2009-07-30

申请号：US12382805

申请日：2009-03-24

申请人： Naoyuki Matsuo ,  Atsushi Hino ,  Masayuki Kaneto

发明人： Naoyuki Matsuo ,  Atsushi Hino ,  Masayuki Kaneto

IPC分类号： B32B9/04

CPC分类号： B29C66/1122 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/8207 ,  B29C65/8253 ,  B29C66/342 ,  B29C66/43 ,  B29C66/65 ,  B29C66/71 ,  B29C66/723 ,  B29C66/72328 ,  B29C66/7292 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/8322 ,  B29C66/9161 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C2035/0822 ,  B29K2105/0854 ,  B29K2277/10 ,  B29K2711/12 ,  B29K2909/08 ,  B29K2995/0027 ,  B29L2009/00 ,  B32B7/12 ,  B32B27/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/34 ,  B32B27/36 ,  Y10T428/31504 ,  Y10T428/31728 ,  Y10T442/659 ,  B29K2077/10

摘要： In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m−1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).

摘要翻译： 在包括由形成第一树脂层和第二树脂层的树脂材料制成的至少一个构件的树脂接合体中，所述第一树脂层和第二树脂层中的至少一个具有从其被照射的激光束的后侧 对于激光束的波长具有50至5000m-1的吸收常数，并且熔丝接合部分形成为具有X> Y的关系，其中从第一树脂层到第二树脂层的光的透光率 通过熔融部分的树脂层被指定为X（％），并且经由熔融部分以外的部分从第一树脂层连续地通过第二树脂层的光的透光率被指定为Y（％）。