公开(公告)号：US6157084A

公开(公告)日：2000-12-05

申请号：US913571

申请日：1997-09-17

申请人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48 ,  H01L23/40 ,  H01L23/52

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/31 ,  H05K3/4007 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/1572 ,  H05K3/423

摘要： A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8). The bump (9) formed on one end of the one conductive path (7) of the film carrier (2) contacts an electrode (12) of the semiconductor element (3) and is electrically connected, whereby the semiconductor element (3) is mounted on the film carrier (2). An insulating resin layer (4) is formed on one surface (6a) of the insulator layer (6) to cover the semiconductor element (3).

摘要翻译： PCT No.PCT / JP95 / 00493 Sec。 371日期1997年9月17日 102（e）日期1997年9月17日PCT 1995年3月17日提交的能够满足对半导体元件的精细布线的需求和高密度安装的半导体器件，以及对其薄型结构的需求， 器件在用于密封半导体元件和薄膜载体的绝缘树脂的粘合性方面优异，因此高度可靠。 在图 如图1所示，嵌入导电电路（5），使其不会在绝缘体层（6）的两个表面（6a，6b）处露出，并且导电路径（7,8）从两者形成成对 导电电路（5）的表面（5a，5b），导电路径在导电电路（5）的表面方向上相对于彼此滑动。 导电路径（7,8）分别连接到凸块（9,10），并且导电电路（5）和凸块（9,10）通过导电路径（7,8）传导。 形成在薄膜载体（2）的一个导电路径（7）的一端上的凹凸（9）与半导体元件（3）的电极（12）接触并被电连接，由此半导体元件 安装在胶片载体（2）上。 绝缘树脂层（4）形成在绝缘体层（6）的一个表面（6a）上以覆盖半导体元件（3）。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US08487189B2

公开(公告)日：2013-07-16

申请号：US12929902

申请日：2011-02-23

申请人： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

发明人： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

IPC分类号： H05K1/00

CPC分类号： H05K1/0269 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53035 ,  Y10T29/53039 ,  Y10T29/53043

摘要： A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

公开(公告)号：US08351743B2

公开(公告)日：2013-01-08

申请号：US12458223

申请日：2009-07-06

申请人： Toshiki Naito ,  Jun Ishii

发明人： Toshiki Naito ,  Jun Ishii

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/43 ,  G11B5/486 ,  G11B5/4866 ,  G11B2005/0021 ,  H05K1/0274 ,  H05K1/056 ,  Y10T29/49155

摘要： A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is provided on the metal supporting board separately from the insulating base layer, the conductive pattern, and the insulating cover layer.

摘要翻译： 具有电路的悬挂板包括金属支撑板; 形成在金属支撑板上的绝缘基底层; 形成在绝缘基底层上的导电图案; 绝缘覆盖层，形成在所述绝缘基底层上以覆盖所述导电图案; 和光波导。 光波导与绝缘基底层，导电图案和绝缘覆盖层分开设置在金属支撑板上。

公开(公告)号：US08208225B2

公开(公告)日：2012-06-26

申请号：US12588906

申请日：2009-11-02

申请人： Tetsuya Ohsawa ,  Toshiki Naito

发明人： Tetsuya Ohsawa ,  Toshiki Naito

IPC分类号： G11B5/48

CPC分类号： H05K1/189 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10545 ,  H05K2201/10598 ,  Y10T29/49027 ,  Y10T29/49124

摘要： A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.

摘要翻译： 具有电路的悬挂板包括导电图案，安装有磁头的板主体部分和能够相对于板主体部分折叠以便面向板的后表面的辅助部分 主体部分。 导电图案包括：第一导电图案，包括电连接到外部电路的第一端子和与磁头电连接的第二端子;以及第二导电图案，其包括电连接到外部电路的第三端子，以及第四端子 电连接到电子元件。 第一端子和第二端子都设置在板主体部分上。 第三端子设置在板主体部分或辅助部分上，第四端子设置在辅助部分上。

公开(公告)号：US20100188779A1

公开(公告)日：2010-07-29

申请号：US12656053

申请日：2010-01-14

申请人： Tetsuya Ohsawa ,  Toshiki Naito

发明人： Tetsuya Ohsawa ,  Toshiki Naito

IPC分类号： G11B5/48

CPC分类号： G11B5/4853 ,  G11B5/486

摘要： A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.

摘要翻译： 具有电路的悬挂板包括板主体部分，相对于板主体部分折回的辅助部分，靠近板主体部分设置的滑块以及安装在其上的磁头和发光元件， 靠近辅助部分。 导电图案包括包括第一端子和连接到磁头的第二端子的第一导电图案，以及包括连接到发光元件的第三端子和第四端子的第二导电图案。 第一，第二和第三端子设置在板主体部分上。 第四端子设置在辅助部分上。 板主体部分的背面形成有主体侧配合部分。 辅助部分的后表面形成有辅助部分侧配合部分。

公开(公告)号：US20100118445A1

公开(公告)日：2010-05-13

申请号：US12591102

申请日：2009-11-09

申请人： Tetsuya Ohsawa ,  Toshiki Naito

发明人： Tetsuya Ohsawa ,  Toshiki Naito

IPC分类号： G11B21/16

CPC分类号： H05K1/189 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4866 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10727

摘要： A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.

摘要翻译： 具有电路的悬挂板包括导电图案，板主体部分，相对于板主体部分折回的辅助部分，设置在悬挂板侧面的滑块，该滑块更靠近板主体 并安装在磁头上的发光元件和配置在靠近辅助部分的电路的悬挂板侧的发光元件。 导电图案包括第一导电图案，包括连接到外部电路和磁头的第一和第二端子，以及包括连接到外部电路和发光元件的第三和第四端子的第二导电图案。 第一端子和第二端子都设置在板主体部分上。 第三和第四端子分别设置在板主体部分和辅助部分上。

公开(公告)号：US20090285524A1

公开(公告)日：2009-11-19

申请号：US12453506

申请日：2009-05-13

申请人： Jun Ishii ,  Toshiki Naito

发明人： Jun Ishii ,  Toshiki Naito

IPC分类号： G02B6/12

CPC分类号： G11B5/484 ,  G02B6/4214 ,  G02B6/4296 ,  G11B2005/0021 ,  H05K1/0274 ,  H05K1/056

摘要： A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.

摘要翻译： 具有电路的悬挂板包括金属支撑板，该金属支撑板包括板沟槽部分，形成在金属支撑板的表面上的绝缘基底层，形成在绝缘基底层的表面上的导电图案和设置成重叠的光波导 当在金属支撑板的厚度方向上投影时，板沟槽部分。 光波导的至少一部分比金属支撑板的后表面更靠近导电图案。

公开(公告)号：US20090261060A1

公开(公告)日：2009-10-22

申请号：US12385576

申请日：2009-04-13

申请人： Aya Mizushima ,  Toshiki Naito

发明人： Aya Mizushima ,  Toshiki Naito

IPC分类号： C23F1/00

CPC分类号： H05K3/243 ,  H05K1/056 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/09718

摘要： A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.

摘要翻译： 具有电路的悬挂板的制造方法包括以下步骤：在金属支撑板上形成由第一开口形成的绝缘层，在绝缘层上形成金属薄膜和在第一开口露出的金属支撑板上 在所述金属薄膜的表面上形成具有端子部分的导电层，所述端子部分在所述端子部分上使用所述金属支撑板作为引线通过电解电镀形成金属镀层，在所述金属镀层的一部分中形成第二开口 金属支撑板与第一开口相对，并且部分地蚀刻金属支撑板以形成具有电路和支撑框架的悬挂板。 在形成绝缘层的步骤中，第一开口形成在形成支撑框架的绝缘层中。

公开(公告)号：US07439451B2

公开(公告)日：2008-10-21

申请号：US10728911

申请日：2003-12-08

申请人： Toshiki Naito ,  Toshihiko Omote ,  Hiroshi Yamazaki

发明人： Toshiki Naito ,  Toshihiko Omote ,  Hiroshi Yamazaki

IPC分类号： H05K1/16

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/007 ,  H05K3/0097 ,  H05K2201/10681 ,  H05K2203/0156 ,  H05K2203/1545 ,  H01L2924/00

摘要： Only individual piece-like flexible wiring boards produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support film to thereby obtain a TAB tape carrier. According to this method, the yield on continuous production can be improved while the step of replacing defective flexible wiring boards found by inspection with non-defective flexible wiring boards can be omitted after mounting of the flexible wiring boards. A difference in level between the respective flexible wiring boards can be prevented from being caused by the replacement, so that high connection reliability can be ensured.

摘要翻译： 预先在检查步骤中单独制造并判断为不合格产品的单独的片状柔性布线板以规则的间隔安装在承载支撑膜上，从而获得TAB带状载体。 根据该方法，可以在安装柔性布线板之后，可以省略在通过无缺陷柔性布线板检查而发现的有缺陷的挠性布线板的步骤的同时省略连续生产的产量。 可以防止各个柔性布线板之间的电平差异被更换引起，从而可以确保高的连接可靠性。