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    Delay locked loop
    23.
    发明授权
    Delay locked loop 有权
    延迟锁定环路

    公开(公告)号：US08351284B2

    公开(公告)日：2013-01-08

    申请号：US12981052

    申请日：2010-12-29

    Applicant: Yong-Hoon Kim ,  Hyun-Woo Lee

    Inventor： Yong-Hoon Kim ,  Hyun-Woo Lee

    IPC: G11C7/00 ,  G11C8/00

    CPC classification number: H03L7/08 ,  G11C7/22 ,  G11C7/222 ,  H03L7/0812

    Abstract: A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal.

    Abstract translation: 延迟锁定环包括被配置为产生初步延迟信息的闭环电路，被配置为响应于控制信号将初步延迟信息更新为延迟信息的控制单元和被配置为将输入时钟信号延迟一个 由延迟信息确定的第一延迟值，并产生输出时钟信号。

    Semiconductor device
    24.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08319538B2

    公开(公告)日：2012-11-27

    申请号：US12754313

    申请日：2010-04-05

    Applicant: Yong-Hoon Kim ,  Hyun-Woo Lee

    Inventor： Yong-Hoon Kim ,  Hyun-Woo Lee

    IPC: H03H11/26

    CPC classification number: H03K5/159 ,  H03K5/15

    Abstract: A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal.

    Abstract translation: 一种半导体器件，包括公共延迟电路，配置为响应于延迟控制代码来延迟输入信号以输出第一延迟输入信号和第二延迟输入信号; 第一延迟电路，被配置为响应于所述延迟控制码延迟所述第一延迟输入信号并输出​​第一输出信号; 以及第二延迟电路，被配置为响应于延迟控制代码来延迟第二延迟输入信号并输出​​第二输出信号。

    File construction for mobile communication device including machine-language-code execution segment and file execution method using the same
    25.
    发明授权
    File construction for mobile communication device including machine-language-code execution segment and file execution method using the same 有权
    移动通信设备的文件构造，包括机器语言代码执行段和使用其的文件执行方法

    公开(公告)号：US07310520B2

    公开(公告)日：2007-12-18

    申请号：US10334531

    申请日：2002-12-30

    Applicant: Yong-Hoon Kim

    Inventor： Yong-Hoon Kim

    IPC: H04M3/00

    CPC classification number: G06F21/10 ,  G06F2221/2135 ,  G06F2221/2137

    Abstract: The present invention relates to a file construction for mobile communication device including an execution segment in form of machine language codes and a file execution method using the same, whereby a file in accordance with the present invention comprises a header, a file execution segment formed in machine language codes, and a resource segment to be selected by languages; wherein the header includes data for performing one or more of the functions of: 1) verifying reliability/validity of the file, 2) restricting use of the file (by period of the use, by times of the use), and 3) automatic updating of the file.

    Abstract translation: 本发明涉及一种移动通信设备的文件结构，该文件结构包括机器语言代码形式的执行段和使用该执行段的文件执行方法，由此根据本发明的文件包括标题，文件执行段 机器语言代码和由语言选择的资源段; 其特征在于，所述头部包括用于执行以下功能的一个或多个功能的数据：1）验证所述文件的可靠性/有效性; 2）限制所述文件的使用（按使用时间，使用时间），以及3）自动 更新文件。

    Package on package structure
    26.
    发明授权
    Package on package structure 有权
    封装结构封装

    公开(公告)号：US08253228B2

    公开(公告)日：2012-08-28

    申请号：US13045103

    申请日：2011-03-10

    Applicant: Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

    Inventor： Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

    IPC: H01L23/02

    CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate.

    Abstract translation: 包装结构上的包装包括下包装和上包装。 下封装包括设置在第一基板的上表面的芯片区域中的第一半导体芯片。 上部封装包括设置在第二基板的上表面上的第二半导体芯片和设置在第二基板的下表面的外部区域中的去耦电容器。 第二基板的下表面与第二基板的上表面相对并且面向第一基板的上表面。 第二基板的平面面积大于第一基板的平面面积。 第二基板的下表面的外部区域延伸超出第一基板的周边。

    CIRCUIT BOARD INCLUDING EMBEDDED DECOUPLING CAPACITOR AND SEMICONDUCTOR PACKAGE THEREOF
    28.
    发明申请
    CIRCUIT BOARD INCLUDING EMBEDDED DECOUPLING CAPACITOR AND SEMICONDUCTOR PACKAGE THEREOF 审中-公开
    电路板包括嵌入式解压电容器及其半导体封装

    公开(公告)号：US20120080222A1

    公开(公告)日：2012-04-05

    申请号：US13247526

    申请日：2011-09-28

    Applicant: Yong-Hoon Kim ,  Hee-Seok Lee ,  Ji-Hyun Lee

    Inventor： Yong-Hoon Kim ,  Hee-Seok Lee ,  Ji-Hyun Lee

    IPC: H05K1/16

    CPC classification number: H05K1/0231 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/4644

    Abstract: A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.

    Abstract translation: 提供了包括嵌入式去耦电容器及其半导体封装的电路板。 电路板可以包括芯层，其包括嵌入的去耦电容器，在芯层的一侧的第一累积层和在芯层的另一侧的第二堆叠层，其中嵌入的去耦电容器包括 第一电极和第二电极，所述第一堆积层包括与所述第一电极接触的第一通孔，并且所述第二堆积层包括与所述第一电极接触的第二通路。

    SEMICONDUCTOR DEVICE
    29.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20110187432A1

    公开(公告)日：2011-08-04

    申请号：US12754313

    申请日：2010-04-05

    Applicant: Yong-Hoon Kim ,  Hyun-Woo Lee

    Inventor： Yong-Hoon Kim ,  Hyun-Woo Lee

    IPC: H03K5/15

    CPC classification number: H03K5/159 ,  H03K5/15

    Abstract: A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal.

    Abstract translation: 一种半导体器件，包括公共延迟电路，配置为响应于延迟控制代码来延迟输入信号以输出第一延迟输入信号和第二延迟输入信号; 第一延迟电路，被配置为响应于所述延迟控制码延迟所述第一延迟输入信号并输出​​第一输出信号; 以及第二延迟电路，被配置为响应于延迟控制代码来延迟第二延迟输入信号并输出​​第二输出信号。

    PHOTOMASK CLEANING APPARATUS AND CLEANING METHODS USING THE SAME
    30.
    发明申请
    PHOTOMASK CLEANING APPARATUS AND CLEANING METHODS USING THE SAME 审中-公开
    光电子清洁装置和清洁方法

    公开(公告)号：US20080115806A1

    公开(公告)日：2008-05-22

    申请号：US11766699

    申请日：2007-06-21

    Applicant: Sang-Yong Yu ,  Yong-Hoon Kim ,  Se-Gun Moon ,  Jae-Hyuck Choi

    Inventor： Sang-Yong Yu ,  Yong-Hoon Kim ,  Se-Gun Moon ,  Jae-Hyuck Choi

    IPC: B08B7/04

    CPC classification number: B08B3/04 ,  G03F1/82 ,  H01L21/67051

    Abstract: A photomask cleaning apparatus including a stage supporting a photomask, a cleaning fluid supplying unit configured to supply a cleaning fluid to remove contaminants from the photomask, a cleaning fluid absorbing unit configured to absorb the cleaning fluid supplied from the cleaning fluid supplying unit; and a contaminant removing structure configured to provide a path through which the cleaning fluid flows between the cleaning fluid supplying unit and the cleaning fluid absorbing unit through a surface of the photomask on the stage, and to have an opening aperture through which the cleaning fluid is exposed onto the surface of the photomask so as to remove at least some of the contaminants is provided. Methods of cleaning a photomask are also provided.

    Abstract translation: 一种光掩模清洁装置，包括支撑光掩模的台，清洁液供给单元，被配置为提供清洁流体以从所述光掩模中除去污染物;清洗液吸收单元，其构造成吸收从所述清洗液供给单元供给的清洗液; 以及污染物去除结构，其构造成提供清洁流体在清洁流体供应单元和清洁液吸收单元之间通过台架上的光掩模的表面流过的路径，并且具有打开孔，清洁流体通过该开口孔 暴露在光掩模的表面上，以便除去至少一些污染物。 还提供了清洁光掩模的方法。

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