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公开(公告)号：US20120103589A1
公开(公告)日：2012-05-03
申请号：US13037803
申请日：2011-03-01
申请人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
发明人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
IPC分类号： F28F7/00
CPC分类号： H05K7/209 , H05K7/20409
摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.
摘要翻译： 这里公开了一种用于电力转换模块的散热装置。 该装置包括壳体，高散热散热器和电路板。 壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。 壳体在其中具有安装空间。 高散热散热器安装在外壳的安装空间中。 电路板耦合到壳体的下表面。 因此，可以减小散热装置的重量和尺寸。 此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。 此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。
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公开(公告)号：US08630090B2
公开(公告)日：2014-01-14
申请号：US13037803
申请日：2011-03-01
申请人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
发明人： Young Ho Sohn , Kyu Bum Han , Young Jin Cho , Seog Moon Choi
CPC分类号： H05K7/209 , H05K7/20409
摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.
摘要翻译： 这里公开了一种用于电力转换模块的散热装置。 该装置包括壳体，高散热散热器和电路板。 壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。 壳体在其中具有安装空间。 高散热散热器安装在外壳的安装空间中。 电路板耦合到壳体的下表面。 因此，可以减小散热装置的重量和尺寸。 此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。 此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。
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公开(公告)号：US20110304990A1
公开(公告)日：2011-12-15
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。
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公开(公告)号：US08315056B2
公开(公告)日：2012-11-20
申请号：US12884058
申请日：2010-09-16
申请人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
发明人： Chang Hyun Lim , Jung Eun Kang , Seog Moon Choi , Kwang Soo Kim , Sung Keun Park
CPC分类号： H05K1/0203 , H05K1/053 , H05K1/141 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , Y10T29/49083 , Y10T29/49124 , Y10T29/49155 , Y10T156/10 , Y10T156/1056 , Y10T156/1064
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.
摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。
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公开(公告)号：US20120000697A1
公开(公告)日：2012-01-05
申请号：US12954416
申请日：2010-11-24
申请人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
发明人： Jung Eun Kang , Seog Moon Choi , Sung Keun Park , Chang Hyun Lim , Kwang Soo Kim
CPC分类号： H05K1/053 , H01L23/13 , H01L23/142 , H01L23/498 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K3/107 , H05K3/108 , H05K2201/10166 , H05K2203/0315 , H05K2203/0369 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.
摘要翻译： 本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。 印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求 可以克服厚膜电镀抗蚀剂的原料。 此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。
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公开(公告)号：US20110284382A1
公开(公告)日：2011-11-24
申请号：US12868071
申请日：2010-08-25
申请人： Sung Keun Park , Sang Hyun Shin , Kwang Soo Kim , Seog Moon Choi
发明人： Sung Keun Park , Sang Hyun Shin , Kwang Soo Kim , Seog Moon Choi
CPC分类号： H05K1/0256 , C23C26/00 , C25D5/02 , C25D5/48 , C25D7/123 , C25D11/02 , C25D11/18 , C25D11/20 , C25D11/24 , H01L21/4846 , H01L23/142 , H01L23/49894 , H01L25/0655 , H01L2224/48091 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H05K1/053 , H05K3/06 , H05K3/108 , H05K2203/0315 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers.
摘要翻译： 这里公开了一种印刷电路板，包括：金属基板; 通过阳极氧化金属基材形成的阳极氧化层; 形成在阳极氧化层上的电路层; 以及通过在电路层的电路布线之间施加光催化材料然后固化所施加的光催化材料而形成的第一溶胶 - 凝胶层。 印刷电路板的优点在于，由于在电路层的电路布线之间形成溶胶 - 凝胶层，所以可以实现为高压封装印刷电路板。
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27.发明申请公开(公告)号：US20110095315A1
公开(公告)日：2011-04-28
申请号：US12632598
申请日：2009-12-07
申请人： Ji Hyun PARK , Seog Moon Choi , Tae Hoon Kim , Sang Hyun Shin , Tae Hyun Kim
发明人： Ji Hyun PARK , Seog Moon Choi , Tae Hoon Kim , Sang Hyun Shin , Tae Hyun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 11 and has a cavity space therein; electrode pads which are formed on the conductive substrate and which are spaced apart from the circuit layer by predetermined intervals such that trenches are formed between the circuit layer and the electrode pads; an optical element which is mounted in the cavity space of the circuit layer and which is electrically connected with the electrode pads; and a fluorescent resin layer which is formed on the circuit layer and the optical element to allow the optical element to uniformly emit light. The package substrate is advantageous in that uniform white light can be realized.
摘要翻译： 本文公开了一种用于光学元件的封装基板，包括：导电基板，其上形成有绝缘层; 电路层，其形成在导电基板11上并具有空腔; 电极焊盘，其形成在导电衬底上并且与电路层隔开预定间隔，使得在电路层和电极焊盘之间形成沟槽; 光学元件，其安装在所述电路层的空腔中并与所述电极焊盘电连接; 以及形成在电路层和光学元件上以允许光学元件均匀发光的荧光树脂层。 封装基板的优点在于可以实现均匀的白光。
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公开(公告)号：US08610146B2
公开(公告)日：2013-12-17
申请号：US12238663
申请日：2008-09-26
申请人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
CPC分类号： H01L33/62 , H01L33/486 , H01L33/647 , H01L2224/16225 , H01L2224/45139 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/48091 , H01L2924/00 , H01L2224/0401
摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.
摘要翻译： 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。
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公开(公告)号：US08586128B2
公开(公告)日：2013-11-19
申请号：US12467513
申请日：2009-05-18
申请人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
IPC分类号： B05D5/12
CPC分类号： H01L33/483 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.
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公开(公告)号：US20130020687A1
公开(公告)日：2013-01-24
申请号：US13301616
申请日：2011-11-21
申请人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
发明人： Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/50 , H01L21/565 , H01L23/24 , H01L23/3107 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49586 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。
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