公开(公告)号：USD911081S1

公开(公告)日：2021-02-23

申请号：US29743646

申请日：2020-07-23

申请人： Zhiming Zhou

设计人： Zhiming Zhou

公开(公告)号：US07927703B2

公开(公告)日：2011-04-19

申请号：US10411933

申请日：2003-04-11

申请人： Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

发明人： Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

IPC分类号： B32B27/08 ,  B32B7/12 ,  C08L33/06

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/365 ,  B32B2307/7246 ,  B32B2551/00 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J133/06 ,  C09J201/02 ,  C09J2433/00 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31507 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31938

摘要： Described are adhesive compositions containing a mixture of a pressure sensitive adhesive, a high Tg polymer, and a crosslinker to form a compatibilized blend that is optically clear. Methods of using the adhesive compositions, and multilayer assemblies such as optical elements prepared using the adhesives, are also provided.

摘要翻译： 描述了含有压敏粘合剂，高Tg聚合物和交联剂的混合物的粘合剂组合物，以形成光学透明的相容的共混物。 还提供了使用粘合剂组合物的方法和使用粘合剂制备的多层组件如光学元件。

公开(公告)号：US07219619B2

公开(公告)日：2007-05-22

申请号：US10517685

申请日：2003-06-13

申请人： Robert C. Fitzer ,  G. Marco Bommarito ,  Richard L. Crone ,  Jeffrey W. McCutcheon ,  Kevin W. Anderson ,  Russell D. Birkholz ,  Zhiming Zhou

发明人： Robert C. Fitzer ,  G. Marco Bommarito ,  Richard L. Crone ,  Jeffrey W. McCutcheon ,  Kevin W. Anderson ,  Russell D. Birkholz ,  Zhiming Zhou

IPC分类号： G01L5/00

CPC分类号： G01P15/036 ,  G01P15/06 ,  H04M1/18

摘要： A shock indicator is described comprising (A) a base having a first side and a second side; (B) an indicator associated with the first side of the base, the indicator comprising a plurality of indicator subparts, the subparts comprising solid material arranged (i) in a first configuration when the shock indicator is in a first state prior to a shock event, and (ii) in a second configuration when the shock indicator is in a second state following a shock event; and (C) means associated with the second side of the base for attachment of the shock indicator to a surface. A method of manufacture is also provided.

摘要翻译： 描述的冲击指示器包括：（A）具有第一侧和第二侧的底座; （B）与所述基座的第一侧相关联的指示器，所述指示器包括多个指示器子部件，所述子部件包括固体材料，所述固体材料布置成（i）当所述休克指示器在冲击事件之前处于第一状态时处于第一配置 ，以及（ii）当所述休克指示器处于休克事件之后的第二状态时处于第二配置; 和（C）与基座的第二侧相关联的装置，用于将冲击指示器附接到表面。 还提供了一种制造方法。

公开(公告)号：US20060246296A1

公开(公告)日：2006-11-02

申请号：US11457235

申请日：2006-07-13

申请人： Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

发明人： Jianhui Xia ,  Ying-Yuh Lu ,  Zhiming Zhou

IPC分类号： B32B27/36

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/365 ,  B32B2307/7246 ,  B32B2551/00 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J133/06 ,  C09J201/02 ,  C09J2433/00 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T428/2891 ,  Y10T428/31507 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31938

摘要： An optical article includes a rigid substrate, a reflective polarizer, and an adhesive composition disposed between the substrate and the polarizer. The adhesive composition includes a majority of a pressure sensitive adhesive component, a high Tg polymer, and a crosslinker. The pressure sensitive adhesive component includes at least one polymer having an acid or base functionality. The high Tg polymer has a weight average molecular weight greater than 100,000, a Tg greater than about 20° C., and an acid or base functionality. The functionality of the pressure sensitive adhesive component and the functionality of the high Tg polymer form an acid-base interaction when mixed. The adhesive composition is optically clear.

摘要翻译： 光学制品包括刚性基板，反射偏振器和设置在基板和偏振器之间的粘合剂组合物。 粘合剂组合物包括大部分压敏粘合剂组分，高Tg聚合物和交联剂。 压敏粘合剂组分包括至少一种具有酸或碱官能团的聚合物。 高Tg聚合物的重均分子量大于100,000，Tg大于约20℃，酸或碱官能度。 当混合时，压敏粘合剂组分的功能和高Tg聚合物的官能度形成酸碱相互作用。 粘合剂组合物是光学透明的。

公开(公告)号：US20050137375A1

公开(公告)日：2005-06-23

申请号：US10742420

申请日：2003-12-19

申请人： Richard Hansen ,  Zhiming Zhou

发明人： Richard Hansen ,  Zhiming Zhou

IPC分类号： C08G18/08 ,  C08G18/12 ,  C09J175/04 ,  C08G18/00

CPC分类号： C09J175/04 ,  C08G18/0823 ,  C08G18/12 ,  C08G18/2865

摘要： Polyurethane-based pressure sensitive adhesives comprising the reaction product of: an isocyanate-reactive component comprising at least two isocyanate-reactive materials, an isocyanate-functional component; a reactive emulsifying compound; a chain capping agent and an optional chain extending agent. The adhesives, which are preferably pressure sensitive adhesives, can be prepared from 100% solids, waterborne or solventborne systems.

摘要翻译： 聚氨酯类压敏粘合剂，其包含以下反应产物：包含至少两种异氰酸酯反应性材料的异氰酸酯反应性组分，异氰酸酯官能组分; 反应性乳化剂; 链封剂和任选的增链剂。 粘合剂，其优选地是压敏粘合剂，可以由100％固体，水性或溶剂型体系制备。

公开(公告)号：US06774493B2

公开(公告)日：2004-08-10

申请号：US10390603

申请日：2003-03-19

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过使用具有分离的分离焊料柱的密封剂底部填充材料预涂芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US06566234B1

公开(公告)日：2003-05-20

申请号：US09662642

申请日：2000-09-15

申请人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L2130

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US6132646A

公开(公告)日：2000-10-17

申请号：US372709

申请日：1999-08-11

申请人： Zhiming Zhou ,  Miguel A. Capote

发明人： Zhiming Zhou ,  Miguel A. Capote

IPC分类号： B23K35/02 ,  B23K35/36 ,  B32B7/12 ,  C09J4/00 ,  H01L21/60 ,  H01L23/498 ,  H05K1/09 ,  H05K3/32 ,  H01B1/02

CPC分类号： B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/095 ,  H05K3/321

摘要： A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon--carbon double bonds; (b) optionally, an effective amount of a crosslinkable diluent; (c) optionally, an effective amount of a source of free radical initiators; and (d) optionally, an effective amount of a resin to react with remnant carboxylic acid moieties. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive inks.

摘要翻译： 本发明提供一种包含还可作为粘合剂使用的助熔剂的热固性粘合剂组合物。 该组合物包括：（a）由式RCOOH表示的助熔剂，其中R包含具有两个或多个碳 - 碳双键的部分; （b）任选地，有效量的可交联稀释剂; （c）任选的有效量的自由基引发剂源; 和（d）任选地，有效量的与残余羧酸部分反应的树脂。 组合物可以直接施加到要电连接和机械连接的装置的表面上。 这些装置包括印刷电路基板，连接器，部件，电缆以及具有通过在一个或两个表面上通过焊料凸起图案焊接在一起的金属化图案的其它电气装置。 或者，可以使用包含与本发明的助熔剂混合的焊料粉末的焊膏。 在回流步骤期间，助熔剂促进焊料对金属化图案的润湿，同时，助熔剂本身交联以机械地结合并包封表面及其金属化。 组合物也可用于配制可烧结导电油墨。

公开(公告)号：US5985456A

公开(公告)日：1999-11-16

申请号：US926159

申请日：1997-09-09

申请人： Zhiming Zhou ,  Miguel A. Capote

发明人： Zhiming Zhou ,  Miguel A. Capote

IPC分类号： B23K35/02 ,  B23K35/36 ,  B32B7/12 ,  C09J4/00 ,  H01L21/60 ,  H01L23/498 ,  H05K1/09 ,  H05K3/32 ,  B23K35/34 ,  B32B15/08 ,  B32B27/04 ,  B32B27/38

CPC分类号： H01L24/29 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/095 ,  H05K3/321 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31725 ,  Y10T428/31855 ,  Y10T428/31938

摘要： A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) optionally, an effective amount of a crosslinkable diluent; (c) optionally, an effective amount of a source of free radical initiators; and (d) optionally, an effective amount of a resin to react with remnant carboxylic acid moieties. By employing an acrylate, methacrylate, or phenol in the structure of the adhesive flux, the cure temperature and moisture absorption characteristics can be significantly improved. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive inks.

摘要翻译： 本发明提供一种包含还可作为粘合剂使用的助熔剂的热固性粘合剂组合物。 组合物包括：（a）由式RCOOH表示的助熔剂，其中R包含具有两个或更多个碳 - 碳双键的部分，其中在一个实施方案中，至少一个在丙烯酸酯或甲基丙烯酸酯基团内，并且其还可以进一步 含有至少一个芳族部分; （b）任选地，有效量的可交联稀释剂; （c）任选的有效量的自由基引发剂源; 和（d）任选地，有效量的与残余羧酸部分反应的树脂。 通过在粘合剂焊剂的结构中使用丙烯酸酯，甲基丙烯酸酯或苯酚，可以显着地提高固化温度和吸湿特性。 组合物可以直接施加到要电连接和机械连接的装置的表面上。 这些装置包括印刷电路基板，连接器，部件，电缆以及具有通过在一个或两个表面上通过焊料凸起图案焊接在一起的金属化图案的其它电气装置。 或者，可以使用包含与本发明的助熔剂混合的焊料粉末的焊膏。 在回流步骤期间，助熔剂促进焊料对金属化图案的润湿，同时，助熔剂本身交联以机械地结合并包封表面及其金属化。 组合物也可用于配制可烧结导电油墨。

公开(公告)号：US07704602B2

公开(公告)日：2010-04-27

申请号：US11672694

申请日：2007-02-08

申请人： Danli Wang ,  Stephen E. Krampe ,  Zhiming Zhou ,  Matthew T. Scholz ,  Michael P. Daniels

发明人： Danli Wang ,  Stephen E. Krampe ,  Zhiming Zhou ,  Matthew T. Scholz ,  Michael P. Daniels

IPC分类号： B32B7/12 ,  C09J4/00

CPC分类号： C09J133/16 ,  A61B5/04087 ,  A61L15/58 ,  A61L15/585 ,  A61L31/041 ,  A61L31/16 ,  A61L2300/106 ,  C08K3/16 ,  C08L21/00 ,  C08L23/00 ,  C08L29/00 ,  C08L33/00 ,  C08L53/00 ,  C08L53/02 ,  C08L2666/02 ,  C08L2666/04 ,  C09D153/02 ,  C09J11/04 ,  C09J121/00 ,  C09J123/02 ,  C09J133/08 ,  C09J135/06 ,  C09J153/02 ,  Y10S526/935 ,  Y10T428/2813

摘要： An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.

摘要翻译： 提供含碘/碘化物的热熔涂层粘合剂。 该粘合剂通过将碘和碘盐单独或组合地与增溶液混合来制备。 将碘和碘盐与热熔混合器中的预粘合剂组合物混合，在该混合物中存在碘/碘络合剂。 将混合物在约130℃至约200℃的温度下混合，并充分地形成含碘/碘化物的热熔涂层粘合剂。 或者，可以原位产生碘化物。 如此制备的粘合剂可以在稍后的时间被包装以涂覆在基材上，或者可以立即涂覆以形成粘合剂复合材料。 提供粘合剂复合材料，特别是外科切割窗帘。