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公开(公告)号：US10254261B2
公开(公告)日：2019-04-09
申请号：US15213100
申请日：2016-07-18
发明人： Olivier Le Neel , Tien Choy Loh , Shian Yeu Kam , Ravi Shankar
摘要： A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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公开(公告)号：US09831357B2
公开(公告)日：2017-11-28
申请号：US13907280
申请日：2013-05-31
发明人： Yonggang Jin , David Lawson , Colin Campbell , Anandan Ramasamy
IPC分类号： H01L31/0216 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/101
CPC分类号： H01L31/02165 , H01L31/02005 , H01L31/0203 , H01L31/02162 , H01L31/02164 , H01L31/02327 , H01L31/1013 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.
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公开(公告)号：US09824924B2
公开(公告)日：2017-11-21
申请号：US13853856
申请日：2013-03-29
发明人： Kim-Yong Goh , Xueren Zhang , Yiyi Ma
IPC分类号： H01L23/02 , H01L21/78 , H01L23/00 , B81B7/00 , H01L23/053
CPC分类号： H01L21/78 , B81B7/0048 , H01L23/053 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2224/13101 , H01L2224/16225 , H01L2224/27013 , H01L2224/29101 , H01L2224/29198 , H01L2224/32058 , H01L2224/45099 , H01L2224/48091 , H01L2224/73265 , H01L2224/83007 , H01L2924/00014 , H01L2924/10157 , H01L2924/10158 , H01L2924/12042 , H01L2924/16151 , H01L2924/014 , H01L2924/00
摘要： Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.
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公开(公告)号：US09754756B2
公开(公告)日：2017-09-05
申请号：US15150895
申请日：2016-05-10
CPC分类号： H01J19/02 , H01J9/025 , H01J9/18 , H01J21/04 , H01J21/105 , H01J21/20 , H01J2209/012 , H01J2209/02
摘要： A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
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25.发明授权公开(公告)号：US09697896B2
公开(公告)日：2017-07-04
申请号：US14623300
申请日：2015-02-16
CPC分类号： G11C13/0069 , G11C8/04 , G11C13/0004 , G11C13/0023 , G11C13/0026 , G11C13/0061 , G11C13/0097 , G11C2213/79
摘要： A phase change non-volatile memory device has a memory array with a plurality of memory cells arranged in rows and columns, a column decoder and a row decoder designed to select columns, and, respectively, rows of the memory array during operations of programming of corresponding memory cells. A control logic, coupled to the column decoder and the row decoder, is designed to execute a sequential programming command, to control the column decoder and row decoder to select one column of the memory array and execute sequential programming operations on a desired block of memory cells belonging to contiguous selected rows of the selected column.
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公开(公告)号：US09583666B2
公开(公告)日：2017-02-28
申请号：US14668309
申请日：2015-03-25
发明人： Jing-En Luan
CPC分类号： H01L31/16 , G01S7/4813 , G01S17/026 , H01L25/167 , H01L31/02002 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92227 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.
摘要翻译： 接近传感器包括半导体管芯，发光组件，再分配层和封装层。 半导体管芯的表面包括传感器区域和接触焊盘。 透镜位于半导体管芯的传感器区域上方。 发光组件包括具有发光区域的发光器件，位于发光区域上方的透镜以及面向再分布层的接触焊盘。 再分布层的一侧包括接触垫。 电连接器使得半导体管芯的每个接触焊盘与再分配层的接触焊盘中的相应一个电连通。 封装层位于再分配层上，并且至少部分地封装半导体管芯，半导体管芯的传感器区域上的透镜以及发光组件。
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公开(公告)号：US09529433B2
公开(公告)日：2016-12-27
申请号：US14586547
申请日：2014-12-30
发明人： Ravi Shankar , Olivier Leneel
CPC分类号： G06F3/014 , G09G5/18 , G09G2370/16
摘要： A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.
摘要翻译： 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。
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28.发明授权Apparatus and method to attach a wireless communication device into a semiconductor package 有权将无线通信设备附接到半导体封装中的装置和方法公开(公告)号：US09337111B2
公开(公告)日：2016-05-10
申请号：US13853496
申请日：2013-03-29
发明人： Yohanes Bintang
CPC分类号： H01L22/14 , H01L22/20 , H01L23/3128 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/06596 , H01L2924/15311 , H01L2224/48227 , H01L2924/00012
摘要： A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.
摘要翻译： 半导体封装包括位于第一管芯和附接到支撑衬底的第二管芯之间的RFID芯片。 RFID芯片没有与骰子和支撑基板的电连接。 RFID芯片的大小对应于插入板。 关于骰子的操作特性的数据在后端处理期间被存储到RFID芯片并从其读取，以确定异常并提高产量。 所述数据可以存储在与包装中的RFID芯片相对应的数据库中。 提供了一种制造具有位于晶片之间的RFID芯片的半导体封装的方法。 该包可以通过存储到RFID芯片和数据库的数据由客户追踪。
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公开(公告)号：US09258467B2
公开(公告)日：2016-02-09
申请号：US14084410
申请日：2013-11-19
发明人： Wing Shenq Wong
IPC分类号： H04N3/14 , H04N5/335 , H04N5/225 , H01L27/146 , B29L31/00
CPC分类号： H04N5/2253 , B29L2031/764 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H04N5/2257 , H01L2924/00014
摘要： One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.
摘要翻译： 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。
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30.发明授权Surface mount package for a semiconductor integrated device, related assembly and manufacturing process 有权用于半导体集成器件的表面贴装封装，相关的组装和制造工艺公开(公告)号：US09257372B2
公开(公告)日：2016-02-09
申请号：US14032075
申请日：2013-09-19
发明人： Roseanne Duca , Kim-Yong Goh , Xueren Zhang , Kevin Formosa
CPC分类号： H01L23/49541 , G01P1/023 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L2224/45147 , H01L2224/48247 , H01L2924/00011 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H05K3/303 , H05K3/3421 , H05K2201/09781 , Y02P70/613 , H01L2924/00 , H01L2924/01005 , H01L2224/45099
摘要： A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.
摘要翻译： 半导体器件的表面贴装封装具有：封装，容纳至少一个包含半导体材料的管芯; 以及电接触引线，从封装凸出以电耦合到电路板的接触焊盘; 封装具有设计成面向电路板的顶表面的主面，该主面具有设计成用于机械耦合到电路板的耦合特征，以增加安装封装的谐振频率。 耦合特征设想至少一个第一耦合凹槽，其限定在从主面开始的封装内，被设计成由固定到电路板的对应耦合元件接合，从而限制安装的封装的移动。
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