公开(公告)号：US5998801A

公开(公告)日：1999-12-07

申请号：US281095

申请日：1999-03-30

Applicant: Yuji Imai

Inventor： Yuji Imai

IPC: G01B11/00 ,  B23K20/02 ,  G03F7/20 ,  H01L21/027 ,  H01R43/02 ,  G01N21/86

CPC classification number: B23K20/02 ,  B23K20/023 ,  H01R43/02 ,  B23K2201/38

Abstract: A projection area (exposure area) on a wafer W, in which a mask pattern is transferred, is divided into, for example, four quadrants. A slit or X-shaped pattern is projected by a light-transmitting optical system so that a plurality of images are formed at a regular interval in the projection area on the wafer W. Luminous flux reflected from the images on the wafer W is received by a light-receiver and converted into photoelectric signals. A master controller calculates the focal values of the first through fourth quadrants along the optical axis based on the photoelectric signals. An optimum focal position and a leveling amount are determined based on the focal values of the first through fourth quadrants. Even if there are level differences in the wafer surface, the optimum focal position and the leveling amount can be accurately determined.

Abstract translation: 将掩模图案转印到晶片W上的投影区域（曝光区域）被划分为例如四个象限。 狭缝或X形图案由透光光学系统投影，使得在晶片W的投影区域中以规则的间隔形成多个图像。从晶片W上的图像反射的光通量被 光接收器并转换为光电信号。 主控制器基于光电信号计算沿着光轴的第一至第四象限的焦点值。 基于第一至第四象限的焦点值来确定最佳焦点位置和调平量。 即使在晶片表面存在水平差，也可以精确地确定最佳焦点位置和调平量。

公开(公告)号：US5967399A

公开(公告)日：1999-10-19

申请号：US37006

申请日：1998-03-09

Applicant: Kazuhiko Takada

Inventor： Kazuhiko Takada

IPC: H01R43/01 ,  B23K20/00 ,  H01R43/02

CPC classification number: H01L24/78 ,  B23K20/004 ,  H01R43/02 ,  B23K2201/38 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  Y10T29/49908 ,  Y10T29/49925 ,  Y10T29/49934 ,  Y10T29/49998

Abstract: An electric wire pressure welding apparatus and pressure welding method capable of exactly specifying the end of an electric wire in a solderless connector and capable of pressure-welding wires from above and below the connector, wherein a wire chuck has a wire holding portion and a pair of wire guide portions projecting from the wire holding portion in a wire-longitudinal direction and having an inner distance larger than a wire diameter for enabling a wire end portion to be disposed between the pair of wire guide portions through which a wire pressure welding blade can go, and wherein the wire guide portions are positioned against a solderless terminal and location of a wire tip is specified by bending the wire end portion about the front end of the wire holding portion in a pressure welding direction by pushing the wire end portion by the wire pressure welding blade. The above wire guide portions on the wire chuck may be replaced with a fixed wire guide extending in the pressure welding direction, wherein the wire is pressure-welded by moving a wire chuck not having the above wire guide portions, in a state of holding the wire, synchronously with the pressure welding blade in the pressure welding direction.

Abstract translation: 一种能够精确地指定无焊接连接器中的电线的端部并能够从连接器的上下方对电线进行加压焊接的电焊丝压焊装置和压焊方法，其中，线夹具具有线保持部和一对 线引导部分从电线保持部分沿电线纵向方向突出并且具有大于电线直径的内部距离，以使电线端部能够设置在一对电线引导部分之间，电线压焊刀可以通过该导线部分 并且其中导线部分抵靠着无焊接端子定位，并且通过将电线端部通过将电线端部推压而在电线保持部分的前端围绕电线保持部分的压接方向弯曲来指定电线端头的位置 线压焊刀。 电线卡盘上的上述电线引导部分可以用在压力焊接方向上延伸的固定导线引导件来代替，其中，通过移动不具有上述线引导部分的电线卡盘来对电线进行压焊， 在压力焊接方向上与压焊刀片同步地进行导线。

公开(公告)号：US5869804A

公开(公告)日：1999-02-09

申请号：US670861

申请日：1996-06-28

Applicant: David E. Mueller ,  Stephen M. Jones ,  Arthur A. Campbell ,  Jerlye L. Walter

Inventor： David E. Mueller ,  Stephen M. Jones ,  Arthur A. Campbell ,  Jerlye L. Walter

IPC: A61N1/05 ,  B23K26/20 ,  H01R43/02 ,  B23K26/00

CPC classification number: H01R43/0221 ,  A61N1/056 ,  B23K26/242 ,  B23K2201/38 ,  H01R2201/12

Abstract: A method is presented of welding an electrically conductive termination component having first and second opposed surfaces to an electrically conductive elongate member extending to a terminal end. The method comprises the steps of forming a substantially circular aperture through the termination component and defined by a rim having a diameter substantially equivalent to the transverse dimension of the elongate member. The terminal end of the elongate member is positioned proximate the termination component overlying the rim of the aperture such that the longitudinal axis of the elongate member is generally coplanar with the center of the aperture. Then, a laser beam is directed transversely of the termination component through the aperture therein toward and onto the elongate member to simultaneously melt the elongate member and the termination component in the region of the aperture and create a mixture of the molten material of both the elongate member and the termination component within the aperture. Upon the cessation of operation of the laser beam, the mixture of the molten material solidifies within the aperture and between the termination component and the elongate member to thereby achieve a welded connection between the elongate member and the termination component. In a preferred embodiment, a ball member is formed at an end of the elongate member and the rim of the aperture in the termination component has a diameter smaller than that of the ball member and the ball member is positioned in engagement with the rim of the aperture.

Abstract translation: 提出了一种将具有第一和第二相对表面的导电终端部件焊接到延伸到终端的导电细长部件的方法。 该方法包括以下步骤：通过终端部件形成基本圆形的孔，并由具有基本上等于细长构件的横向尺寸的直径的边缘限定。 细长构件的终端位于邻近孔的边缘的端接部件附近，使得细长构件的纵向轴线大致与孔的中心共面。 然后，激光束通过其中的孔穿过终端部件横向地引导到细长构件上并同时熔化在孔的区域中的细长构件和端接构件，并且产生两个细长构件的熔融材料的混合物 构件和孔内的终端组件。 在停止激光束的操作时，熔融材料的混合物在孔内和端接部件与细长部件之间固化，从而实现细长部件和端接部件之间的焊接连接。 在优选实施例中，球形件形成在细长构件的端部处，并且终端部件中的孔的边缘的直径小于球形构件的直径，并且球构件定位成与球形构件的边缘接合 光圈。

公开(公告)号：US5828031A

公开(公告)日：1998-10-27

申请号：US670551

申请日：1996-06-27

Applicant: Surya Pattanaik

Inventor： Surya Pattanaik

IPC: B23K26/00 ,  B23K1/005 ,  B23K35/26 ,  G11B5/127 ,  H05K3/34

CPC classification number: H05K3/3442 ,  B23K1/0056 ,  B23K2201/38 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K2201/09427 ,  H05K2201/10083 ,  H05K2203/041 ,  H05K2203/0465 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method for forming electrical solder connections between a thin film magnetic head transducer and the conductors in an integrated suspension after the head has been mechanically attached to a suspension. A solder ball is placed between the head and conductor termination pads. A focused laser beam is used to produce solder reflow. The resulting solder connection has a very fine grain structure and includes a pair of extremely thin layers of intermetallic compounds in the regions where the solder connection abuts the head and conductor termination pads. The solder connection has excellent mechanical properties and reliability. The method avoids the creation of solder bumps during the wafer stage, and therefore the component processing cost is low, and the process is both fast and manufacturable.

Abstract translation: 一种用于在头部已经机械地连接到悬架上之后，在一体式悬架中形成薄膜磁头换能器与导体之间的电焊料连接的方法。 焊球放置在头部和导体终端焊盘之间。 聚焦激光束用于生产回流焊。 所得到的焊料连接具有非常细的晶粒结构，并且在焊料连接件邻接头部和导体终端焊盘的区域中包括一对非常薄的金属间化合物层。 焊接连接具有优异的机械性能和可靠性。 该方法避免了在晶片阶段期间产生焊料凸块，因此部件加工成本低，且工艺既快速又可制造。

公开(公告)号：US5660318A

公开(公告)日：1997-08-26

申请号：US509232

申请日：1995-07-31

Applicant: Il Gyu Jung ,  Tae Gyeong Chung ,  Tae Koo Lee

Inventor： Il Gyu Jung ,  Tae Gyeong Chung ,  Tae Koo Lee

IPC: H01L21/60 ,  B23K20/02 ,  H01L21/603 ,  H01L21/58

CPC classification number: H01L24/80 ,  B23K20/023 ,  B23K2201/38 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14

Abstract: An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.

Abstract translation: 一种内引线接合装置，其具有附接到内引线的散热板和用于支撑带自动接合封装的引线框的支撑。 在内引线接合工艺执行期间，散热板位于形成在半导体芯片或内引线和内引线上的凸点的接合界面附近，并且包括用于将自身固定到支撑件和椭圆螺栓 使得其与内部引线的接触位置能够被控制的孔。

公开(公告)号：US5580271A

公开(公告)日：1996-12-03

申请号：US303253

申请日：1994-09-08

Applicant: Raymond R. Buchheister, Jr. ,  Robert Scata ,  Robert J. Hnatuck

Inventor： Raymond R. Buchheister, Jr. ,  Robert Scata ,  Robert J. Hnatuck

IPC: B23K1/00 ,  H01R4/02 ,  H01R13/66 ,  H01R43/02 ,  H05K1/02 ,  H05K3/34 ,  H01R9/07

CPC classification number: H01R13/6658 ,  B23K1/0016 ,  H01R4/025 ,  H01R43/0242 ,  H05K1/0212 ,  B23K2201/38 ,  H01R43/0207 ,  H05K1/0242 ,  H05K2201/083 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10924 ,  H05K2203/1115 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49149 ,  Y10T29/49179

Abstract: An SCSI cable assembly (30) with a termination circuit included within one of the connector housings (44) is disclosed. The termination circuit is on a circuit board (52) that is retained within a cavity (68) between two solder nest halves (50). The solder nest halves (50) have a plurality of openings (70) that are in alignment with contact pads (54) on a surface of the circuit board (52). Solder segments (100) are arranged within the openings (70), and conductors (48) of a cable (32) are individually inserted into the openings in thermal engagement with the solder segments to form a solder nest assembly (40). An electrical connector (42) having a plurality of contact leads (58) spaced similarly to the spacing of the openings (70) is assembled to the solder nest assembly so that each lead (58) is in thermal engagement with a respective conductor (48) in a respective opening (70). Each lead (58) is attached to a common carrier strip (104) which is a self regulating temperature heater. The heater is activated by application of an RF current to reflow the solder segment (100) thereby electrically connecting the leads (58) to their respective conductors (48) and contact pads (54).

Abstract translation: 公开了一种具有包括在连接器壳体（44）之一内的终端电路的SCSI电缆组件（30）。 终端电路在电路板（52）上，该电路板（52）保持在两个焊料半盒（50）之间的空腔（68）内。 焊料半部（50）具有与电路板（52）的表面上的接触焊盘（54）对准的多个开口（70）。 焊接段（100）布置在开口（70）内，并且电缆（32）的导体（48）被单独地插入到与焊料段热接合的开口中以形成焊料嵌套组件（40）。 具有与开口（70）的间隔相似的多个接触引线（58）的电连接器（42）被组装到焊料嵌套组件，使得每个引线（58）与相应的导体（48）热接合 ）在相应的开口（70）中。 每个引线（58）连接到作为自调节温度加热器的公共载体条（104）。 通过施加RF电流来激活加热器以回流焊料段（100），从而将引线（58）电连接到它们各自的导体（48）和接触焊盘（54）。

公开(公告)号：US5519192A

公开(公告)日：1996-05-21

申请号：US372987

申请日：1995-01-17

Applicant: Jonathan Childs ,  Charles R. Schotthoefer

Inventor： Jonathan Childs ,  Charles R. Schotthoefer

IPC: B23K1/002 ,  H01R4/18 ,  H01R43/02 ,  H05B6/10

CPC classification number: B23K1/002 ,  H01R4/187 ,  H01R43/0263 ,  B23K2201/38 ,  H01R43/0207 ,  Y10T29/4921 ,  Y10T29/49213 ,  Y10T29/53209

Abstract: Electrical connector components, for example, a pin terminal constructed from a solid wire pin and a formed metal body, are attached to a web carrier and fed through an inductive heating station, thereby bonding the components together. The components are pre-treated with a conductive bonding material which can be cured, flowed, or set by applying heat. The web carrier may be wound on a first spool, fed through the inductive heating station, and wound onto a second spool, for ready feed to and from successive production steps. The temperature of the heating operation may be controlled by varying the speed of the web feed and the strength of the inductive field, so as to ensure repeatable, uniform heating, at a high economical speed. In addition, the tip of the pin can be cooled during the heating operation, to prevent heat damage or contamination of the pin.

Abstract translation: 电连接器部件，例如，由实心线销和成形金属体构成的销接头连接到卷筒纸载体上，并通过感应加热台进给，从而将部件粘合在一起。 这些部件用可以通过加热固化，流动或固化的导电粘合材料进行预处理。 卷筒纸载体可以缠绕在通过感应加热台进给的第一卷轴上，并卷绕到第二卷轴上，以便从连续的生产步骤准备进料。 加热操作的温度可以通过改变幅材进给的速度和感应场的强度来控制，以便以高经济的速度确保可重复均匀的加热。 另外，在加热操作期间可以冷却销的尖端，以防止热损坏或销的污染。

公开(公告)号：US4873938A

公开(公告)日：1989-10-17

申请号：US878776

申请日：1986-06-26

Applicant: Alexander J. Ciniglio

Inventor： Alexander J. Ciniglio

IPC: H01R43/02 ,  B23K1/08 ,  B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/38

Abstract: In a method and apparatus for soldering or tinning wires or component leads, solder is pumped through a nozzle to form a downwardly flowing stream. The wire or lead is passed laterally into the stream and then withdrawn axially to leave a coating of solder on the wire. The wire or lead is angled to the horizontal, pointing upwardly in the direction of withdrawal from the stream.

Abstract translation: 在用于焊接或镀锡线或部件引线的方法和装置中，焊料通过喷嘴泵送以形成向下流动的流。 电线或导线横向穿过流，然后轴向退出，在电线上留下焊料涂层。 电线或导线与水平线成一定角度，向上指向从流中取出的方向。

公开(公告)号：US4756467A

公开(公告)日：1988-07-12

申请号：US848028

申请日：1986-04-03

Applicant: Myron D. Schatzberg

Inventor： Myron D. Schatzberg

IPC: B23K1/20 ,  B23K35/00 ,  H01R4/02 ,  H01R43/02

CPC classification number: B23K35/001 ,  B23K1/20 ,  B23K35/007 ,  C25D5/10 ,  C25D7/0607 ,  H01R43/02 ,  B23K2201/38 ,  C25D5/50 ,  H01R4/02 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12882

Abstract: A wire having enhanced solderability characteristics is formed by applying a very thin uniform coat of silver to a clean copper wire substrate. A coat of tin is plated on top of the silver. Heat treatment causes the silver and tin to form an interface alloy. The device can be other than a wire and the substrate can be other than copper.

Abstract translation: 具有增强的可焊性特性的线通过将非常薄的均匀的银涂层施加到干净的铜线基底而形成。 一层锡镀在银的顶部。 热处理会导致银和锡形成界面合金。 该装置可以不是导线，并且基板可以不是铜。

公开(公告)号：US3444347A

公开(公告)日：1969-05-13

申请号：US3444347D

申请日：1966-01-10

Applicant: UNITEK CORP

Inventor： MULCAHY JOHN V

IPC: B23K1/00 ,  B23K11/16 ,  B23K1/02

CPC classification number: B23K1/00 ,  B23K11/163 ,  B23K2201/38