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    METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE
    21.
    发明申请
    METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE 有权
    制造微结构的方法和基板结构

    公开(公告)号：US20110236659A1

    公开(公告)日：2011-09-29

    申请号：US13069154

    申请日：2011-03-22

    Applicant: Takamichi FUJII ,  Akihiro Mukaiyama

    Inventor： Takamichi FUJII ,  Akihiro Mukaiyama

    IPC: B32B7/02 ,  B32B37/00

    CPC classification number: B32B7/02 ,  B32B2457/14 ,  B81B2201/13 ,  B81B2203/0338 ,  B81B2207/07 ,  B81C3/004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/10 ,  Y10T428/2495

    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

    Abstract translation: 一种制造微结构的方法包括以下步骤：制备单独的第一和第二基底，所述第一基底具有第一表面，第一表面具有第一高度的第一结构体和具有第二高度的第二高度的第二结构体 布置第一结构体的高度，第二基底具有第二表面; 然后放置第一和第二基板以使第一和第二表面跨过第一和第二结构体彼此面对; 然后在第一和第二表面之间沿其高度方向压缩第二结构体以使第二结构体具有由第一结构体限定的高度，将第一和第二基板彼此接合。

    Sockets for microassembly
    23.
    发明申请
    Sockets for microassembly 失效
    微组装插座

    公开(公告)号：US20050181636A1

    公开(公告)日：2005-08-18

    申请号：US11074448

    申请日：2005-03-08

    Applicant: Kenneth Tsui ,  Aaron Geisberger

    Inventor： Kenneth Tsui ,  Aaron Geisberger

    IPC: B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  H01R11/30 ,  H01R13/627 ,  H01R24/00 ,  H01R43/00

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  B81C99/002

    Abstract: An apparatus including at least three deflectable members each configured to deflect during assembly with a component, and also configured to remain in contact with the component after assembly with the component. At least one of the deflectable members and the component has a thickness not greater than about 1000 microns.

    Abstract translation: 一种装置，包括至少三个可偏转构件，每个可挠曲构件构造成在与构件组装期间偏转，并且还构造成在与构件组装之后保持与构件接触。 可偏转构件和部件中的至少一个具有不大于约1000微米的厚度。

    System and method for coupling microcomponents
    26.
    发明授权
    System and method for coupling microcomponents 失效
    用于耦合微元件的系统和方法

    公开(公告)号：US06672795B1

    公开(公告)日：2004-01-06

    申请号：US09570170

    申请日：2000-05-11

    Applicant: Matthew D. Ellis ,  George D. Skidmore

    Inventor： Matthew D. Ellis ,  George D. Skidmore

    IPC: H01R16627

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

    Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

    Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

    MICRO-NANO TOOLS WITH CHANGEABLE TIPS FOR MICRO-NANO MANIPULATION
    28.
    发明申请
    MICRO-NANO TOOLS WITH CHANGEABLE TIPS FOR MICRO-NANO MANIPULATION 审中-公开
    微纳米工具具有可变的提示，用于微纳米操作

    公开(公告)号：US20140284950A1

    公开(公告)日：2014-09-25

    申请号：US14123633

    申请日：2012-06-01

    Applicant: THE GOVERING COUNCIL OF THE UNIVERSITY OF TORONTO

    Inventor： Yu Sun ,  Ko Lun Chen

    IPC: B25J7/00 ,  B25J15/04

    CPC classification number: B25J7/00 ,  B25J15/04 ,  B25J15/0491 ,  B25J15/12 ,  B81B2201/12 ,  B81B2201/13 ,  B81C3/008 ,  H01J37/20 ,  H01J2237/206 ,  H01J2237/208

    Abstract: The present invention relates to modular system for micro-nano manipulation of samples. The modular system of the present invention comprises changeable tool tips which may be provided in an array, and a tool body. Each changeable tool tip comprises an end effector connected to a base having mating structures. The tool body includes an arm having slits having dimensions and being disposed on the arm so as to detachably couple with the mating structures of the tool tip. The slits may include an opening with rounded corners for receiving the mating structures, and tapered side walls for frictionally fitting the mating structures. The present invention relates also to a connection system for connecting a micro-dimensional tool body to a changeable micro-dimensional tool tip and to a manipulation tool for use with changeable tool tips of the present invention.

    Abstract translation: 本发明涉及用于微纳米操作样品的模块化系统。 本发明的模块化系统包括可以设置在阵列中的可变工具尖端和工具主体。 每个可变的工具尖端包括连接到具有配合结构的底座的端部执行器。 工具主体包括具有尺寸的狭缝的臂，并且布置在臂上，以便可拆卸地与工具尖端的配合结构联接。 狭缝可以包括具有用于接收配合结构的圆角的开口和用于摩擦地配合配合结构的锥形侧壁。 本发明还涉及一种用于将微尺寸工具主体连接到可更换的微尺寸工具尖端的连接系统以及与本发明的可变工具尖端一起使用的操作工具。

    Droplet Operations Device
    29.
    发明申请
    Droplet Operations Device 审中-公开
    液滴操作装置

    公开(公告)号：US20120261264A1

    公开(公告)日：2012-10-18

    申请号：US13003765

    申请日：2009-07-20

    Applicant: Vijay Srinivasan ,  Arjun Sudarsan ,  Vamsee Pamula ,  Michael Pollack ,  Ramakrishna Sista ,  Raymond Kozikowski ,  Nicole Bell

    Inventor： Vijay Srinivasan ,  Arjun Sudarsan ,  Vamsee Pamula ,  Michael Pollack ,  Ramakrishna Sista ,  Raymond Kozikowski ,  Nicole Bell

    IPC: C25B9/00 ,  B05D1/36 ,  B05D5/12

    CPC classification number: G01N27/44756 ,  B01F13/0071 ,  B01F13/0076 ,  B01L3/502707 ,  B01L3/502792 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2400/0427 ,  B01L2400/0688 ,  B01L2400/086 ,  B29C59/02 ,  B41J2/1601 ,  B81B7/0061 ,  B81B2201/058 ,  B81B2201/13 ,  F04B17/00 ,  F04B19/006

    Abstract: The invention provides droplet actuators with droplet operations surfaces for manipulating droplets, e.g., by conducting droplet operations. The droplet operations surfaces are typically exposed to a droplet operations gap. One or more regions of a droplet operation surface may include patterned topographic features. The invention also provides a droplet actuator in which one or both gap-facing droplet operations surfaces is formed using a removable film. The removable film may, in various embodiments, also include other components ordinarily associated with the droplet actuator substrate, such as the dielectric layer and the electrodes. Further, the invention provides droplet actuator devices and methods for coupling and/or sealing substrates of a droplet actuator, such as techniques for self-aligning assembly of droplet actuator substrates. The invention provides droplet actuators and methods of disassembling the droplet actuator in order to provide access for cleaning and/or recycling of droplet actuator surfaces.

    Abstract translation: 本发明提供了液滴致动器，其具有用于操纵液滴的液滴操作表面，例如通过进行液滴操作。 液滴操作表面通常暴露于液滴操作间隙。 液滴操作表面的一个或多个区域可以包括图案化的地形特征。 本发明还提供一种液滴致动器，其中使用可去除的膜形成一个或两个面向间隙的液滴操作表面。 在各种实施例中，可除去膜可以包括通常与液滴致动器基底（例如电介质层和电极）相关联的其它部件。 此外，本发明提供了液滴致动器装置和用于联接和/或密封液滴致动器的基板的方法，例如用于液滴致动器基板的自对准组装的技术。 本发明提供了液滴致动器和拆卸液滴致动器的方法，以便为液滴致动器表面的清洁和/或回收提供通路。

    Storing mechanical potential in a MEMS device using a mechanically multi-stable mechanism
    30.
    发明授权
    Storing mechanical potential in a MEMS device using a mechanically multi-stable mechanism 失效
    使用机械多稳定机制将机械电位存储在MEMS器件中

    公开(公告)号：US07012491B1

    公开(公告)日：2006-03-14

    申请号：US10238319

    申请日：2002-09-10

    Applicant: Aaron Geisberger ,  Matthew D. Ellis

    Inventor： Aaron Geisberger ,  Matthew D. Ellis

    IPC: H01H51/22

    CPC classification number: B25J15/12 ,  B25J7/00 ,  B81B3/0018 ,  B81B2201/13 ,  B81C99/002

    Abstract: A system and method for storing potential energy in a microcomponent is disclosed comprising a multi-stable element having two or more equilibrium states and a stopper to restrict the multi-stable element from entering at least one of the two or more equilibrium states. The pre-charged microcomponent may then preferably be transported to another location and use the stored potential energy to perform some action.

    Abstract translation: 公开了一种用于在微元件中存储势能的系统和方法，其包括具有两个或多个平衡状态的多稳态元件和用于限制所述多稳态元件进入所述两个或多个平衡状态中的至少一个的止动器。 然后可以优选将预充电的微元件运送到另一位置，并使用存储的势能来执行一些动作。

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