摘要:
A semiconductor device includes a switching element having: a drift layer; a base region; an element-side first impurity region in the base region; an element-side gate electrode sandwiched between the first impurity region and the drift layer; a second impurity region contacting the drift layer; an element-side first electrode coupled with the element-side first impurity region and the base region; and an element-side second electrode coupled with the second impurity region, and a FWD having: a first conductive layer; a second conductive layer; a diode-side first electrode coupled to the second conductive layer; a diode-side second electrode coupled to the first conductive layer; a diode-side first impurity region in the second conductive layer; and a diode-side gate electrode in the second conductive layer sandwiched between first impurity region and the first conductive layer and having a first gate electrode as an excess carrier injection suppression gate.
摘要:
A vertical conduction electronic power device includes respective gate, source and drain areas, realized in an epitaxial layer arranged on a semiconductor substrate. The respective gate, source and drain metallizations may be realized by a first metallization level. The gate, source and drain terminals or pads may be realized by a second metallization level. The device is configured as a set of modular areas extending parallel to each other, each having a rectangular elongate source area perimetrically surrounded by a narrow gate area, and separated from each other by regions with the drain area extending parallel and connected at the opposite ends thereof to a second closed region with the drain area forming a device outer peripheral edge. A sinker structure extends perpendicularly to the substrate and may be formed by a grid of sinkers located below both the first parallel regions and the second closed region to favor a conductive channel for a current coming from the source area and directed towards the drain area across the substrate.
摘要:
A power device includes a substrate assembly including an upper surface and a lower surface. The substrate assembly includes a first layer and a second layer. The first layer overlies the second layer and has different conductivity than the second layer. A first electrode is provided proximate the upper surface. A second electrode is provided proximate the upper surface and is spaced apart from the first electrode. The second layer is configured to provide a current path between the first and second electrodes.
摘要:
Silicon carbide power devices include a semiconductor substrate of first conductivity type (e.g., N-type) having a face thereon and a blocking voltage supporting region of first conductivity type therein extending to the face. The voltage supporting region is designed to have a much lower majority carrier conductivity than an underlying and highly conductive "bypass" portion of the semiconductor substrate. This bypass portion of the substrate supports large lateral currents with low on-state voltage drop. First and second semiconductor devices are also provided having respective first and second active regions of first conductivity type therein. These first and second active regions extend on opposing sides of the voltage supporting region and are electrically coupled to the bypass portion of the semiconductor substrate which underlies and extends opposite the voltage supporting region relative to the face of the substrate. These first and second semiconductor devices are configured to provide bidirectional I-V characteristics by facilitating conduction in the first and third quadrants. A plurality of spaced regions of lower conductivity than the voltage supporting region are also formed in the voltage supporting region and extend to the face. These plurality of spaced regions extend opposite the bypass portion of the substrate and enhance the blocking voltage capability of the voltage supporting region.
摘要:
An insulated-gate semiconductor device comprises a P type emitter layer, an N.sup.- high-resistive base layer formed on the P type emitter layer, and a P type base layer contacting the N.sup.- high-resistive base layer. A plurality of trenches are formed having a depth to reach into the N.sup.- high-resistive base layer from the P type base layer. A gate electrode covered with a gate insulation film is buried in each trench. An N type source layer to be connected to a cathode electrode is formed in the surface of the P type base layer in a channel region between some trenches, thereby forming an N channel MOS transistor for turn-on operation. A P channel MOS transistor connected to the P base layer is formed in a channel region between other trenches so as to discharge the holes outside the device upon turn-off operation.
摘要:
A semiconductor device which reduces the turn-off time and the accompanying switching loss in a switching semiconductor device in which conductivity modulation is used to provide a low ON-state voltage. The conductivity modulation is provided by injection of minority carriers. A minority carrier injection-control structure is provided in part of a semiconductor device to change the polarity of a voltage applied to a gate electrode to start or stop the injection of minority carriers. During the ON-state, minority carriers are injected to obtain a low ON-state voltage, while during the OFF-state, the injection of minority carriers are stopped and a channel for majority carriers is formed to eliminate the accumulation of excess carriers and to accelerate discharge, thereby reducing the turn-off time and thus the switching loss.
摘要:
A semiconductor device which allows an ON-state voltage to be lower than that of a conventional device and a method of manufacturing such a device. In this semiconductor device, a gate electrode is formed to have a planar area of its region covering a first base layer larger than that of its region covering a second base layer, thereby increasing a cathode short-circuit ratio of a cathode-shorted diode equivalent to this semiconductor device. As a result, a lower voltage than conventional ON-state can be obtained.
摘要:
A self turn-off power semiconductor device includes a P type emitter layer, a high resistive N type base layer, a P type base layer and a MOS channel structure for injecting electrons into the N type base layer. A series of trench-like grooves are formed in the top surface of a substrate constituting the N type base layer at a constant interval. Insulated gate electrodes are buried in these grooves. The injection efficiency of electrons into the base layer is enhanced by locally controlling the flow of holes in the N type base layer. Controlling the flow of holes is achieved by specifically arranging the width of a hole-bypass path among the grooves, the trench width and the placement distance of the grooves, thereby causing the accumulation of carriers to increase in the base layer to decrease the on-resistance of the device.
摘要:
A semiconductor integrated circuit unit, suitable for the control of a motor, has an integrated structure within the same semiconductor substrate, comprising an inverter circuit, drive circuits for driving the switching elements of the inverter circuit, an internal power source circuit for supplying power to the drive circuits which drive the upper arm side of the inverter circuit, and a logical circuit for transmitting a signal to the drive circuits which drive the upper arm side of the inverter circuit.
摘要:
A discrete array (30) of p-type regions (31) surrounding channel regions of n-channel MOSFET cells is provided in a drain region of the MOSFET cells. The p-type regions have depth corresponding to the depth of p-type areas (5) defining the channels. A depletion layer (F1) which is generated and extends from the channel regions through application of a voltage is stretched by the p-type regions, so that the electric field in the depletion layer is weakened. As a result, anti-breakdown ability of the MOSFET cells is improved. The discrete arrangement of the p-type regions is required in order to obtain current path between the channels and n-type drain regions (4).