公开(公告)号：US20100327237A1

公开(公告)日：2010-12-30

申请号：US12866353

申请日：2009-02-02

Applicant: Kenji Takai ,  Mitsuharu Matsuzawa ,  Yuuko Nagahara ,  Kunihiko Akai

Inventor： Kenji Takai ,  Mitsuharu Matsuzawa ,  Yuuko Nagahara ,  Kunihiko Akai

IPC: H01B1/02

CPC classification number: H01R4/04 ,  B22F1/02 ,  B22F2998/00 ,  C23C18/1635 ,  C23C18/1651 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  B22F1/025

Abstract: A conductive particle 8a comprising a core particle 11, a palladium layer 12 coating the core particle 11 and having a thickness of 200 Å or larger, and an insulating particle 1 arranged on the surface of the palladium layer 12 and having a particle diameter larger than the thickness of the palladium layer 12.

Abstract translation: 导电粒子8a，其包含核心粒子11，涂覆核心粒子11并具有200以上的厚度的钯层12以及布置在钯层12的表面上并且具有大于 钯层12的厚度。

公开(公告)号：US20100221545A1

公开(公告)日：2010-09-02

申请号：US12738029

申请日：2008-10-21

Applicant: Shinji Abe

Inventor： Shinji Abe

IPC: B32B17/02 ,  B32B27/02 ,  B32B15/02

CPC classification number: H01B1/22 ,  C08K3/10 ,  C08K5/3445 ,  C09J9/02 ,  C09J163/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0224 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: It is an object of the present invention to provide a coated conductive powder particularly useful as the conductive filler of an anisotropic conductive adhesive used for electrically interconnecting circuit boards, circuit parts, and the like, and a conductive adhesive that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with an insulating substance, wherein the insulating substance is a powdery, thermally latent curing agent. Also, in the present invention, the particle surfaces of the coated conductive powder are further coated with insulating inorganic fine particles.

Abstract translation: 本发明的目的是提供一种特别用作用于将电路板，电路部件等电连接的各向异性导电粘合剂的导电填料特别有用的涂覆导电粉末，以及可提供与高电气连接的导电粘合剂 即使对于诸如IC芯片的小型化电子部件的电极和电路板的连接也是可靠的。 本发明的涂覆导电粉末是通过用绝缘物质涂覆导电颗粒的表面而获得的涂覆的导电粉末，其中绝缘物质是粉末状的热潜固化剂。 此外，在本发明中，涂覆的导电粉末的颗粒表面进一步涂覆绝缘无机细颗粒。

公开(公告)号：US20100065311A1

公开(公告)日：2010-03-18

申请号：US12307564

申请日：2007-04-10

Applicant: Masaru Tanaka ,  Jun Taketatsu

Inventor： Masaru Tanaka ,  Jun Taketatsu

IPC: H05K1/09 ,  H01B1/12 ,  H05K1/02 ,  B32B37/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  H01B3/004 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29469 ,  H01L2224/29493 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2201/0224 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

Abstract: The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%. Coverage   factor   ( % ) = ( Area   of   sections   on   nucleus   particle surface   covered   with   insulating   coating ) ( Total   surface   area   of   nucleus   particle ) × 100 ( 1 )

Abstract translation: 本发明的导电粒子各自包含导电核粒子和在核粒子表面上含有有机高分子化合物的绝缘涂层，并且由下式（1）定义的覆盖系数在20〜 40％。 覆盖率（％）=（曝光部分的曝光部分的曝光面积比例覆盖的曝光面积） 细胞核）×100（1）

公开(公告)号：US20100025089A1

公开(公告)日：2010-02-04

申请号：US10585461

申请日：2005-01-01

Applicant: Jun Taketatsu ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kazuo Yamaguchi ,  Masaki Fujii ,  Aya Fujii

Inventor： Jun Taketatsu ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kazuo Yamaguchi ,  Masaki Fujii ,  Aya Fujii

IPC: H05K1/09 ,  H01R43/00

CPC classification number: H01R4/04 ,  H01R12/52 ,  H01R43/007 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0224 ,  Y10T29/49117

Abstract: A circuit member connection structure 10 according to the invention is provided with circuit members 20,30 having a plurality of circuit electrodes 22,32 formed on the main surfaces 21a,31a of circuit boards 21,31. A circuit connecting member 60 which connects together the circuit members 20,30 with the circuit electrodes 22,32 opposing each other is comprising a cured circuit connecting material of the invention. The circuit connecting material of the invention comprises an adhesive composition and covered particles 50 comprising conductive particles 51 with portions of their surfaces 51a covered by insulating fine particles 52, wherein the mass of the insulating fine particles 52 constitutes 2/1000 to 26/1000 of the mass of the conductive particles 51.

Abstract translation: 根据本发明的电路构件连接结构10设置有电路构件20,30，其具有形成在电路板21,31的主表面21a，31a上的多个电路电极22,32。 将电路构件20,30与电路电极22,32相互连接在一起的电路连接构件60包括本发明的固化电路连接材料。 本发明的电路连接材料包括粘合剂组合物和覆盖的颗粒50，其包括导电颗粒51，其表面51a的部分被绝缘细颗粒52覆盖，其中绝缘细颗粒52的质量构成2/1000至26/1000的 导电粒子51的质量。

公开(公告)号：US07608205B2

公开(公告)日：2009-10-27

申请号：US11529263

申请日：2006-09-29

Applicant: Yuichiro Sano ,  Toru Miyasaka

Inventor： Yuichiro Sano ,  Toru Miyasaka

IPC: H01B1/00

CPC classification number: H05K3/1266 ,  H05K2201/0224 ,  H05K2203/0143 ,  H05K2203/0285 ,  H05K2203/0517 ,  Y10T428/26

Abstract: Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a granularity distribution, at a large diameter and a small diameter; and microscopic particle mixtures satisfying the following relationships are decentralized in the solution; R>r and n>3.84×(R/r)3×N, where R is a large particle diameter, r is a small particle diameter, N is the number of large particles, and n is the number of small particle.

Abstract translation: 具有不同直径的微观粒子的微观粒子分散溶液是分散的，其中：微观粒子分散溶液在粒径分布中具有两个峰，大直径和小直径; 满足以下关系的微观粒子混合物在溶液中分散; R> r和n> 3.84x（R / r）3xN，其中R是大粒径，r是小粒径，N是大颗粒的数量，n是小颗粒的数量。

公开(公告)号：US20090185393A1

公开(公告)日：2009-07-23

申请号：US12193470

申请日：2008-08-18

Applicant: Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

Inventor： Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

IPC: F21V7/22 ,  F21V21/00 ,  H05K3/30

CPC classification number: H05K3/323 ,  G02B6/0073 ,  G02B6/0083 ,  H05K3/28 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2201/10333 ,  Y02P70/611 ,  Y10S362/80 ,  Y10T29/4913

Abstract: A light source module includes a mounting substrate including at least two exposed metal lines, a light-emitting diode (LED) including two electrodes disposed corresponding to the at least two exposed metal lines, and an anisotropic conductive film (ACF) provided on the mounting substrate, the ACF electrically connecting the at least two exposed metal lines to the two electrodes, wherein the ACF comprises an insulation body, and a plurality of conductive particles dispersed in the insulation body and insulated from each other, and an insulation of the conductive particles disposed between the two exposed metal lines and the two electrodes of the LED is prevented in at least a first direction.

Abstract translation: 一种光源模块，包括：至少包括两个暴露的金属线的安装基板;包括对应于所述至少两个暴露的金属线设置的两个电极的发光二极管（LED）;以及设置在所述安装件上的各向异性导电膜 基板，ACF将至少两个暴露的金属线电连接到两个电极，其中ACF包括绝缘体和分散在绝缘体中并彼此绝缘的多个导电颗粒，并且导电颗粒的绝缘 设置在两个暴露的金属线之间，并且至少在第一方向上防止LED的两个电极。

公开(公告)号：US20080241391A1

公开(公告)日：2008-10-02

申请号：US12021050

申请日：2008-01-28

Applicant: JANG SUB KIM ,  Soon-Kwon Lim ,  Joo-Ho Moon ,  Sun-Ho Jeong ,  Dong-Jo Kim ,  Kyoo-Hee Woo

Inventor： JANG SUB KIM ,  Soon-Kwon Lim ,  Joo-Ho Moon ,  Sun-Ho Jeong ,  Dong-Jo Kim ,  Kyoo-Hee Woo

IPC: B05D5/12 ,  C09D11/10 ,  H01B1/00

CPC classification number: H05K1/097 ,  B82Y10/00 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/52 ,  H01B1/22 ,  H05K2201/0224 ,  H05K2203/1157 ,  H05K2203/121

Abstract: A method of manufacturing a metal nanoparticle includes coupling a metal ion to an organic ligand having a weight-average molecular weight of about 10,000 to about 1,500,000. The method further includes reducing the metal ion coupled to the organic ligand to form a metal nanoparticle having a skin layer.

Abstract translation: 制造金属纳米颗粒的方法包括将金属离子与重均分子量约为10,000至约1,500,000的有机配体偶合。 该方法还包括还原耦合到有机配体的金属离子以形成具有表皮层的金属纳米颗粒。

公开(公告)号：US20080179618A1

公开(公告)日：2008-07-31

申请号：US11627489

申请日：2007-01-26

Applicant: CHING-TAI CHENG

Inventor： CHING-TAI CHENG

IPC: H01L33/00 ,  H05K7/20

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10113 ,  H01L2924/00014

Abstract: Light-emitting diode (LED) packages with improved heat transfer paths for LED dies encased therein when compared to conventional LED packages are provided. For some embodiments, the LED package includes a ceramic substrate having a top cavity with one or more LED dies disposed within and having a bottom cavity for receiving a metallic insert to dissipate heat away from the LED dies. For other embodiments, an LED package is provided that includes a ceramic substrate having a heat spreader coupled to thermal vias filled with a highly thermally conductive composite.

Abstract translation: 提供了与常规LED封装相比，其中封装有LED管芯的改善的传热路径的发光二极管（LED）封装。 对于一些实施例，LED封装包括具有顶部空腔的陶瓷衬底，所述顶部空腔具有设置在其内的一个或多个LED管芯，并且具有底部空腔，用于接收金属插入件以将热量从LED管芯散开。 对于其他实施例，提供了一种LED封装，其包括陶瓷衬底，该陶瓷衬底具有耦合到填充有高导热性复合材料的热通孔的散热器。

公开(公告)号：US20080137316A1

公开(公告)日：2008-06-12

申请号：US11857871

申请日：2007-09-19

Applicant: Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H01R9/00 ,  H05K3/10

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Abstract translation: 公开了使用和印刷这种导电图案的导电图案和方法。 在某些实例中，导电图案可以通过在衬底上的支撑件之间设置导电材料来制造。 可以移除支撑件以提供具有期望长度和/或几何形状的导电图案。

公开(公告)号：US20080032047A1

公开(公告)日：2008-02-07

申请号：US11462089

申请日：2006-08-03

Applicant: Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

Inventor： Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

IPC: B05D3/02

CPC classification number: C09D11/03 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B82Y30/00 ,  C01P2002/84 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/08 ,  C08K9/04 ,  C09D7/62 ,  C09D7/67 ,  C09D11/00 ,  C09D11/38 ,  C23C24/08 ,  C23C26/00 ,  H01B1/02 ,  H01L51/0022 ,  H05K1/097 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Abstract translation: 提供颗粒和颗粒膜。 在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置的颗粒的工业规模合成。