Abstract:
A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.
Abstract:
A system-on-chip (SoC) architecture includes a plurality of blocks, each including a power control module to selectively control the power dissipated by the bloc. For each block, a power register is provided to receive power control instructions to selectively control the respective power control module. The system also includes a power control unit for writing respective power control instructions into the power control registers of the blocks, whereby the power dissipated is controlled individually and independently for each block under the centralized control of the power control unit. For each block, a power status register is also provided to receive status information concerning power control within the respective block. The power control unit reads the status instructions from such power status registers.
Abstract:
The memory device has a memory block, formed by a plurality of standard sectors and a redundancy portion; a control circuit, which controls programming and erasing of the data of the memory cells; and a correctness verifying circuit for the data stored in the memory cells. The correctness verifying circuit is enabled by the control circuit and generates an incorrect-datum signal in the event of detection of at least one non-functioning cell. The control circuit moreover activates redundancy, enabling the redundancy portion and storing redundancy data in a redundancy-memory stage in the presence of an incorrect datum. Various solutions are presented that implement column, row and sector redundancy, both in case of erasing and programming.
Abstract:
An NROM memory device, wherein the memory cells are provided with charge storage regions of insulating material, such as silicon nitride. The memory device includes a row decoder comprising a plurality of drivers; during programming, a first driver supplies a first voltage having a first value to a selected wordline, while the other drivers are configured so as to supply a second voltage having a second non-zero value, lower than the first value, to the other wordlines. Thereby, the gate-drain voltage drop of the deselected cells is reduced, and thus spurious erasing of the deselected cells connected to the selected bitline is reduced. Consequently, the reliability of the memory device is improved considerably and the life thereof is lengthened, thanks to the reduction in the charge injected into the charge storage region.
Abstract:
A method of operating an SAR-type analog-to-digital converter to match the dynamic range of an input voltage signal to be converted with the full scale range of the converter, the converter including at least one array of binary weighted capacitors. The method includes the step of obtaining a digital gain code that represents the ratio between the full scale range and the dynamic range of the voltage signal to be converted, applying the voltage signal to be converted to the capacitor array so as to charge with the voltage signal to be converted only those array capacitors having the same binary weights as the bits of the gain code that have a selected binary value, and selectively coupling the capacitors of the array to one of a first and second predetermined reference voltage terminals according to an SAR technique, to obtain an output digital code corresponding to the input voltage signal.
Abstract:
The process for manufacturing a through insulated interconnection is performed by forming, in a body of semiconductor material, a trench extending from the front (of the body for a thickness portion thereof; filling the trench with dielectric material; thinning the body starting from the rear until the trench, so as to form an insulated region surrounded by dielectric material; and forming a conductive region extending inside said insulated region between the front and the rear of the body and having a higher conductivity than the first body. The conductive region includes a metal region extending in an opening formed inside the insulated region or of a heavily doped semiconductor region, made prior to filling of the trench.
Abstract:
An electrically-programmable memory cell programmed by means of injection of channel hot electrons into a charge-storage element capacitively coupled to a memory cell channel for modulating a conductivity thereof depending on a stored amount of charge. A first and a second spaced-apart electrode regions are formed in a semiconductor layer and define a channel region there between; at least one of the first and second electrode regions acts as a programming electrode of the memory cell. A control electrode is capacitively coupled to the charge-storage element. The charge-storage element is placed over the channel to substantially extend from the first to the second electrode regions, and is separated from the channel region by a dielectric layer. The dielectric layer has a reduced thickness in a portion thereof near the at least one programming electrode.
Abstract:
A process manufactures an interpoly dielectric layer for non-volatile memory cells of a semiconductor device with an interpoly dielectric layer. The process begins with forming the tunnel oxide, and hence the amorphous or polycrystalline silicon layer, using conventional techniques. After the amorphous or polycrystalline silicon layer is surface cleansed and passivated, the surface of the polycrystalline layer is nitrided directly by using radical nitrogen. This is followed by the formation of the interpoly dielectric, either as an ONO layer or a single silicon layer, by means of the CVD technique. Masking to define the floating gate may be performed immediately before or after the direct nitridation step is carried out. The equivalent electrical thickness of the interpoly dielectric, obtained by combining the nitride oxide layer and by the following dielectric, does not exceed 130 Angstroms in either the ONO layer or the single silicon layer embodiment.
Abstract:
An autotesting method of a cells matrix of a memory device is disclosed which comprises the steps of: reading the values contained in a plurality of the memory cells; comparing the read values with reference values; signalling mismatch of the read values with the reference values as an error situation; and storing the error situations. In the autotesting method, the reading, comparing, signalling, and storing steps are repeated for all the memory cells in an matrix column. The autotesting method according to the invention further comprises the steps of storing the positions of any columns having at least one one error situation; and repeating all of the preceding steps according to a step of scanning all the matrix columns.
Abstract:
The memory device of the invention outputs the read data in a time starting from the rising edge of the external clock that is shorter than that of other known devices, because the output buffer has an array of master-slave pairs of flip-flops synchronized by respective timing signals derived from the internal clock signal. The array receives data from the state machine through the second internal bus and provides the data to be output to the output stage of the buffer enabled by the state machine. A logic circuit generates timing signals for the master-slave flip-flops, respectively as logic NAND and logic AND of the internal clock signal and of an enabling signal of the output stage of the buffer generated by the state machine. Moreover, the memory device includes a circuit, synchronized by the internal clock signal, that introduces a delay of the enabling signal of the output stage of the buffer equivalent to a period of the internal clock signal.