公开(公告)号：US20150245501A1

公开(公告)日：2015-08-27

申请号：US14188855

申请日：2014-02-25

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd

Inventor： Nikolaus W. Schunk

IPC: H05K3/36 ,  H01R43/24 ,  H01R43/16

CPC classification number: H05K3/366 ,  H01L2224/48091 ,  H01R12/52 ,  H01R12/707 ,  H01R12/714 ,  H01R12/737 ,  H01R13/405 ,  H01R13/639 ,  H01R43/16 ,  H01R43/24 ,  H05K1/0218 ,  H05K1/117 ,  H05K1/144 ,  H05K1/186 ,  H05K3/3426 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10757 ,  Y10T29/49126 ,  Y10T29/4922 ,  H01L2924/00014

Abstract: A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.

Abstract translation: 一种制造引线框架的方法包括从金属板移除一组平行的带状电导体，将导体的端部嵌入限定引线框体的模塑料中，并将导体彼此分离，使得 导体保持封装在模制化合物中，而其它部分保留在模制化合物的外部并限定所得引线框的引线。

公开(公告)号：US09106005B2

公开(公告)日：2015-08-11

申请号：US13356791

申请日：2012-01-24

Applicant: Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

Inventor： Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

IPC: H01L23/48 ,  H01R12/57 ,  H01R4/02 ,  H05K3/34 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US20150194374A1

公开(公告)日：2015-07-09

申请号：US14590021

申请日：2015-01-06

Applicant: Iinfineon Technologies AG

Inventor： Sergey ANANIEV

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

Abstract translation: 一种封装（120），其中所述封装（120）具有至少一个电子芯片（124），封装所述电子芯片（124）的封装体（138），以及多个端子引脚（122）， 连接所述电子芯片（124），其中所述端子引脚（122）中的每一个具有封装部分（126），所述封装部分至少部分地由所述封装体（138）封装并具有暴露部分（128） 其从所述封装主体（138）突出，并且其中所述暴露部分（128）的至少一部分从所述封装体（138）横向延伸到反转点（130）并且横向从所述反转点（130）向后延伸 ），以使得暴露部分（128）的自由端（132）与封装主体（138）的相应侧壁（134）横向对准或者与相应的封闭主体（138）的相应侧壁（134）间隔开 封闭体（138）的侧壁（134）横向向外。

公开(公告)号：US20150096794A1

公开(公告)日：2015-04-09

申请号：US14182163

申请日：2014-02-17

Applicant: INVENTEC CORPORATION ,  Inventec (Pudong) Technology Corporation

Inventor： Hsin-Fang CHIEN ,  Shui-Ching CHU

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10757

Abstract: An electronic device and an electronic component thereof include a main body and several pins. One side of the main body has several recesses. Each of the recesses has a first inner width along a first direction. The first direction is substantially parallel to a long side of the main body. The pins are respectively inserted into the recesses. Each of the pins has a first outer width along the first direction. The first outer width is smaller than the first inner width.

Abstract translation: 电子装置及其电子部件包括主体和多个销。 主体的一侧有几个凹槽。 每个凹部沿着第一方向具有第一内部宽度。 第一方向基本上平行于主体的长边。 销分别插入凹槽中。 每个销具有沿第一方向的第一外部宽度。 第一外部宽度小于第一内部宽度。

公开(公告)号：US20150077940A1

公开(公告)日：2015-03-19

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20140252583A1

公开(公告)日：2014-09-11

申请号：US13786129

申请日：2013-03-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Andrea Carletti

IPC: H01L23/34 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/42 ,  H01L24/92 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K1/0203 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip package. The semiconductor chip package is located between the printed circuit board and the heat sink. A heat-generating surface of the semiconductor chip package is oriented such that the heat-generating surface faces the heat sink.

Abstract translation: 提供了一种用于组装功率半导体的方法和装置。 一种器件包括印刷电路板，散热器和半导体芯片封装。 半导体芯片封装位于印刷电路板和散热片之间。 半导体芯片封装的发热表面被定向成使得发热表面面向散热器。

公开(公告)号：US08780571B2

公开(公告)日：2014-07-15

申请号：US13193422

申请日：2011-07-28

Applicant: Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

Inventor： Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

IPC: H05K7/00 ,  H05K1/18

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00

Abstract: An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg.

Abstract translation: 插入器引线提供集成电路和电路板之间的连接。 插入器引线包括用于与电路板接口的第一支脚。 插入器引线还包括大致平行于第一支腿设置的第二支脚，用于与从集成电路延伸的IC电引线对接。 连接部分可操作地连接第一腿部和第二腿部。 插入器引线还包括从第二支腿不平行地延伸的唇缘，用于限制IC电引线在第二支腿上的移动。

公开(公告)号：US20140085841A1

公开(公告)日：2014-03-27

申请号：US13951603

申请日：2013-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuteru FUKUMOTO

IPC: H05K1/02 ,  H01L21/64

CPC classification number: H05K1/0201 ,  H01L21/64 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/3447 ,  H05K2201/10522 ,  H05K2201/10757 ,  H01L2924/00

Abstract: A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.

Abstract translation: 电路装置包括具有引线端子和热检测元件的热检测元件，包括引线端子的发热电子部件和包括布线图案，孔和焊盘的基板，热检测部件和发热电子 部件通过其引线端子与基板电连接，其中热检测部件的引线端子弯曲成U形或大致U形的构造，使得弯曲引线端子部分地与发热电子 并且发热电子部件被夹在导热端子的部分和热检测部件的热检测元件之间。

公开(公告)号：US20130192887A1

公开(公告)日：2013-08-01

申请号：US13713739

申请日：2012-12-13

Applicant: Hitachi Cable, Ltd.

Inventor： Akihiro YAGUCHI ,  Takumi KOBAYASHI ,  Yuju ENDO ,  Hiroaki KOMATSU ,  Kenichi MURAKAMI ,  Rikio SAITO

IPC: H01B7/08

CPC classification number: H01B7/0823 ,  H01B7/0846 ,  H01R12/62 ,  H01R12/7029 ,  H05K1/0215 ,  H05K1/148 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/363 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/2009 ,  Y02P70/613

Abstract: A flat wiring material includes a plurality of conductors arranged in parallel, an insulating covering member covering collectively the plurality of conductors while allowing both end portions of the plurality of conductors to be exposed, an engaging member disposed at a position on the covering member and close to at least one of the exposed both end portions of the plurality of conductors and including an insertion portion that is formed at an end portion extending in the width direction for being inserted into and engaged with a through-hole formed on a mounting substrate, and a fixing member fixing the engaging member to the covering member. The insertion portion of the engaging member includes an opening allowing an elastic deformation thereof upon the insertion into the through-hole and a protruding portion for preventing disengagement in a direction opposite to the insertion direction after being inserted into the through-hole.

Abstract translation: 扁平布线材料包括平行配置的多个导体，绝缘覆盖部件，其共同地覆盖多个导体，同时允许多个导体的两个端部露出，接合部件设置在覆盖部件上的位置并且闭合 涉及多个导体的暴露的两个端部中的至少一个，并且包括形成在沿宽度方向延伸的端部的插入部分，以插入并与形成在安装基板上的通孔接合， 固定构件将接合构件固定到覆盖构件。 接合构件的插入部分包括允许在插入通孔中时弹性变形的开口和用于在插入通孔中之后防止在与插入方向相反的方向上脱离的突出部分。

公开(公告)号：US20130067736A1

公开(公告)日：2013-03-21

申请号：US13278200

申请日：2011-10-21

Applicant: KUO-CHAN PENG ,  CHING-FENG HSIEH

Inventor： KUO-CHAN PENG ,  CHING-FENG HSIEH

IPC: H05K13/04

CPC classification number: H05K1/182 ,  H05K3/30 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  Y10T29/53183

Abstract: A pin adjuster for electronic components adjusts and fixes pins of an electronic component while the electronic component is being installed on a circuit board such that the pins correspond in position to and connect to a plurality of contacts on the circuit board, respectively. The pin adjuster includes an insulating body and a plurality of channels. The channels each penetrate the insulating body and have an entry end and an exit end. The entry ends correspond in position to the pins of the electronic component, respectively, and the exit ends correspond in position to the contacts, respectively, such that the pins are adjusted and fixed in place by penetrating the channels, respectively. The pin adjuster enables the pins to be aligned with and connected to the contacts rapidly and precisely, thereby shortening the time taken to mount the electronic component on the circuit board and streamlining manual operation.

Abstract translation: 电子部件的针脚调整器调整并固定电子部件的销子，同时将电子部件安装在电路板上，使得销子分别对应于电路板上的多个触点并连接到电路板上的多个触点。 销调节器包括绝缘体和多个通道。 通道各穿过绝缘体并具有入口端和出口端。 入口端分别对应于电子部件的销，并且出口端分别对应于触头的位置，使得销分别通过穿透通道被调节和固定就位。 引脚调节器使引脚能够快速，精确地对准和连接到触点，从而缩短将电子部件安装在电路板上所需的时间并简化手动操作。