Abstract:
A memory system includes at least one memory module, each of which has a pattern data generating circuit for generating a pattern data, which has a plurality of memories to which a command signal is commonly applied and corresponding data is applied respectively; and a memory controller for respectively applying the command signal and the corresponding data to the plurality of memories, applying a pattern data generating command to the memory module during a timing control operation, calculating time differences among data of reaching each of the plurality of memories using the pattern data outputted from each of the memories and receiving and outputting data using the calculated data reaching time difference. Therefore, a stable data transmission is achieved between the memory controller and the memories.
Abstract:
A semiconductor memory device comprising control pads and input/output I/O pads capable of reducing the data path for reading and writing data in a cell array, and a method for driving the semiconductor memory device are included. The semiconductor memory device comprises a plurality of memory banks arranged at a cell region of a memory chip, and a plurality of control pads and a plurality of I/O pads, separately arranged from each other at the memory chip, for reading/writing data from/in the memory banks, wherein the plurality of control pads and I/O pads are dispersed at the peripheral region between adjacent memory banks and at the outer portions of the memory banks.
Abstract:
A semiconductor memory device that minimizes chip area is provided. The semiconductor memory device includes local input/output (I/O) lines, global I/O lines, and a memory core that is coupled between a bit line and a complementary bit line. The memory core includes a memory cell array, a bit line equalizer circuit, a PMOS sense amplifier (S/A), a PMOS S/A driving circuit for driving the PMOS S/A, a transmission gate circuit, an NMOS S/A, and an NMOS S/A driving circuit for driving the NMOS S/A. First and second transistors for connecting the local I/O lines to the global I/O lines are installed between adjacent bit lines. The PMOS S/A driving circuit, which is a first driving transistor, and the NMOS S/A driving circuit, which is a second driving transistor, are also installed between adjacent bit lines. Because the semiconductor memory device arranges a PMOS S/A driving circuit, an NMOS S/A driving circuit, and a gating circuit for connecting local I/O lines to global I/O lines, between adjacent bit lines, the chip area is reduced.
Abstract translation:提供了最小化芯片面积的半导体存储器件。 半导体存储器件包括本地输入/输出(I / O)线,全局I / O线和耦合在位线和互补位线之间的存储器核。 存储器芯包括存储单元阵列,位线均衡器电路,PMOS读出放大器(S / A),用于驱动PMOS S / A的PMOS S / A驱动电路,传输门电路,NMOS S / A 以及用于驱动NMOS S / A的NMOS S / A驱动电路。 用于将本地I / O线连接到全局I / O线的第一和第二晶体管安装在相邻位线之间。 作为第一驱动晶体管的PMOS S / A驱动电路和作为第二驱动晶体管的NMOS S / A驱动电路也安装在相邻位线之间。 由于半导体存储器件在相邻位线之间配置PMOS S / A驱动电路,NMOS S / A驱动电路和用于将本地I / O线连接到全局I / O线的选通电路,芯片面积减小 。
Abstract:
A semiconductor memory device is provided in which a burst length and/or a column address strobe (CAS) latency may be fixed. The semiconductor memory device, which may be an SDRAM (synchronous dynamic random access memory) device, includes a memory cell array, a burst address generation circuit to generate a burst address and a burst length detection signal, a mode setting register for setting a CAS latency and/or a burst length using an address, a pipeline circuit to delay and output data read from the memory cell array. The semiconductor memory device also includes a latency enable control signal generation circuit to generate a latency enable control signal in response to a read command or signal and the burst length detection signal, and a data output circuit to output data being output from the pipeline circuit in response to the latency enable control signal. Therefore, a circuit configuration is simplified and a test time is reduced, by fixing latency and/or burst length.
Abstract:
An input buffer includes an amplifier circuit, such as a differential amplifier circuit, inverting amplifier circuit or pull-up/pull-down amplifier circuit. A momentary boost circuit is coupled to an input buffer input terminal, an input terminal of the amplifier circuit, and an output terminal of the amplifier circuit, and is operative to generate a boosted input signal at the input terminal of the amplifier circuit from an input signal at an input buffer input terminal for an interval that is terminated responsive to an output signal at the output terminal of the amplifier circuit. The momentary boost circuit may include a detector circuit coupled to the output terminal of the amplifier circuit and operative to generate a control signal responsive to a transition of the output signal, and a boost circuit, coupled between the input buffer input terminal and the input terminal of the amplifier circuit and operatively associated with the detector circuit, that receives the input signal at the input buffer input terminal and generates the boosted input signal at the input terminal of the amplifier circuit from the received input signal responsive to the control signal. For example, the boost circuit may include a capacitor coupled between the input buffer input terminal and the input terminal of the amplifier circuit, and a switch that couples and decouples the input terminal of the amplifier circuit to a reference voltage source responsive to the control signal. The detector circuit may be operative to generate a pulse responsive to a transition of the output signal, and the switch may be operative to couple the input terminal of the amplifier circuit to the reference voltage source responsive to the pulse.
Abstract:
Integrated circuit memory devices include first and second memory banks, first and second local data lines electrically coupled to the first and second memory banks, respectively, and a multiplexer having first and second inputs electrically coupled to first and second data bus lines, respectively. A data selection circuit is also provided which routes data from the first and second local data lines to the first and second data bus lines, respectively, when a selection control signal is in a first logic state and routes data from the second and first local data lines to the first and second data bus lines, respectively, when a selection control signal is in a. second logic state opposite the first logic state. A control signal generator is also provided. This control signal generator generates the selection control signal in the first and second logic states when a first address in a string of burst addresses is even and odd, respectively.
Abstract:
A bidirectional input/output buffer operates in a current mode to increase the data transfer rate between devices connected by a bidirectional transmission line. The buffer includes an output current source for generating an output current responsive to a data output signal. The output current is combined with an output current indicative of a data input signal received from another device over a transmission line, thereby forming a mixed current signal. The data input signal is restored from the mixed signal by a restoring circuit that compares the mixed signal to a reference current that depends on the value of the data output signal. The restoring circuit includes a current mirror and a reference current source that generates a reference current in response to the data output signal. To provide additional performance, an embodiment of a bidirectional input/output buffer utilizes a switchless structure having two comparators that compare the mixed signal to two different reference signals, thereby generating two comparison signals. A selector circuit selects one of the two comparison signals as the restored data input signal responsive to the data output signal.
Abstract:
An internal clock generating circuit for data output buffers of a synchronous DRAM device, which produces an internal clock with reference to either the positive edge or the negative edge of the system clock CLK by comparing the reference time t.sub.CLref(OH) for insuring a low level time tCL of the system clock CLK and output hold time t.sub.OH, and which can sufficiently insure the data output setup time t.sub.OS and data output hold time t.sub.OH regardless of the frequency of the system clock by making the generation points of the internal clock to be varied depending on the frequency of the system clock.
Abstract:
Semiconductor devices configured to test connectivity of micro bumps including one or more micro bumps and a boundary scan test block for testing connectivity of the micro bumps by scanning data input to the micro bumps and outputting the scanned data. The semiconductor device may include a first chip including solder balls and at least one or more switches electrically coupled with the respective solder balls, and a second chip stacked on top of the first chip and electrically coupled with the switches in direct access mode, including micro bumps that input/output signals transmitted from/to the solder balls.
Abstract:
A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.