公开(公告)号：US20240339299A1

公开(公告)日：2024-10-10

申请号：US18607486

申请日：2024-03-17

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Sun Wook JUNG ,  Youn Gun BONG

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J37/32229 ,  H01J37/32238 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/3255

Abstract: Proposed are a microwave antenna, and a power supplying device and a substrate processing apparatus including the same, which ensure efficient placement of components while effectively applying power to a plasma chamber. The microwave antenna includes a ring frame, and a plurality of slots provided on an inner wall of the ring frame.

公开(公告)号：US12094692B2

公开(公告)日：2024-09-17

申请号：US17455501

申请日：2021-11-18

Applicant: Semes Co., Ltd.

Inventor： Jinhyeok Kim ,  Dongmok Lee ,  Yeonghun Wi ,  Yonghyun Ham ,  Yeonggyo Jeong

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J2237/334

Abstract: An apparatus for processing a substrate may include a processing module including at least one process chamber for performing a desired process on a substrate and an index module transferring the substrate into the processing module from an outside. The at least one process chamber may include a housing providing a process space therein, a supporting unit disposed in the housing to support a substrate, the supporting unit including a focus ring having a plurality of rings, a gas supply unit providing a process gas into the process space, and a plasma generating unit generating a plasma from the process gas in the process space. The focus ring may include a stepped structure having a plurality of stepped portions downwardly provided toward the substrate.

公开(公告)号：US12090754B2

公开(公告)日：2024-09-17

申请号：US17870835

申请日：2022-07-22

Applicant: SEMES CO., LTD.

Inventor： Sang Uk Son ,  Yong Tak Hyun ,  Dae Sung Kim

IPC: B41J2/045

CPC classification number: B41J2/0451 ,  B41J2/04586

Abstract: Provided are a nozzle inspection method and a nozzle inspection apparatus capable of accurately detecting a defect in an inkjet head nozzle within a short time. The nozzle inspection method comprises discharging a plurality of droplets into a first region of interest of a substrate using a first nozzle to form an inspection pattern, and determining whether the first nozzle is defective based on the inspection pattern.

公开(公告)号：US12083551B2

公开(公告)日：2024-09-10

申请号：US17884709

申请日：2022-08-10

Applicant: SEMES CO., LTD.

Inventor： Sang Min Lee ,  Woo Jin Chung ,  Ki Bong Kim

IPC: B05C11/10 ,  B05C5/02 ,  H01L21/67

CPC classification number: B05C5/0225 ,  B05C11/1002 ,  B05C11/1031

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

公开(公告)号：US20240270511A1

公开(公告)日：2024-08-15

申请号：US18399392

申请日：2023-12-28

Applicant: SEMES CO., LTD.

Inventor： Da Han KIM ,  Seung Chan LEE ,  Ho Young LEE

IPC: B65G47/90

CPC classification number: B65G47/90

Abstract: A gripper gripping a plurality of types of probe cards is provided. The gripper includes a frame, a driving unit connected to the frame, and a plurality of gripper portions connected to the driving unit and including an inner gripper portion and an outer gripper portion. The gripper portions include a moving block moving in a radial direction as the driving unit is driven, and the inner gripper portion and the outer gripper portion connected to the moving block. The outer gripper portion is rotatably connected to the moving block, and is configured such that the outer gripper portion rotates downward with respect to the moving block as the moving block moves in a radial outward direction.

公开(公告)号：US12057335B2

公开(公告)日：2024-08-06

申请号：US17957428

申请日：2022-09-30

Applicant: SEMES CO., LTD.

Inventor： Sang Min Lee ,  Jin Se Park ,  Ki Hoon Choi

IPC: G01N1/10 ,  G01N1/20 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67253 ,  G01N1/10 ,  H01L21/67034

Abstract: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

公开(公告)号：US12051565B2

公开(公告)日：2024-07-30

申请号：US17527128

申请日：2021-11-15

Applicant: SEMES CO., LTD.

Inventor： Young Kuk Kim ,  Tae Hoon Jo ,  Goon Ho Park ,  Ja Myung Gu

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/3244

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes: an RF power supply; a process chamber which performs plasma processing by using power applied from the RF power supply; and an impedance matching unit which is disposed between the RF power supply and the process chamber and performs matching, in which the RF power supply includes a first sensor measuring impedance in a direction of the process chamber and the impedance matching unit, and the impedance matching unit performs impedance matching by reflecting impedance measured in the RF power supply through the first sensor.

公开(公告)号：US12040216B2

公开(公告)日：2024-07-16

申请号：US17386829

申请日：2021-07-28

Applicant: SEMES Co., Ltd.

Inventor： Yong Hoon Hong ,  Kang Suk Lee ,  Hyeon Jun Lee ,  So Young Jang

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01L21/67023 ,  H01L21/68792 ,  H01L21/67051 ,  H01L21/67253

Abstract: A substrate supporting member capable of controlling the flow of charges on a substrate by controlling ground resistance values of a guide pin and a support pin using a variable resistor, and a substrate treating apparatus including the same are provided. The substrate supporting member includes the body; a support pin installed on the body and for supporting the substrate; a guide pin installed on the body and for supporting the substrate; and a charge control device for controlling a charge around the substrate by controlling an electrical connection between the support pin and a first resistor and an electrical connection between the guide pin and a second resistor.

公开(公告)号：US20240222159A1

公开(公告)日：2024-07-04

申请号：US18337515

申请日：2023-06-20

Applicant: SEMES CO., LTD.

Inventor： Se Hyeong CHOI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67103 ,  H01L21/6708 ,  H01L21/68714

Abstract: A bowl for processing a substrate includes an opening disposed in an upper portion and allowing a substrate to be discharged and input therethrough; a cup configured to form a processing space for processing the substrate; and an edge heating portion provided in the cup and configured to heat an edge of the substrate.

公开(公告)号：US20240222150A1

公开(公告)日：2024-07-04

申请号：US18399894

申请日：2023-12-29

Applicant: SEMES CO., LTD.

Inventor： Eunseok KIM ,  Kibong KIM

IPC: H01L21/67 ,  G05D7/06

CPC classification number: H01L21/67017 ,  G05D7/0652

Abstract: A valve control device includes a plurality of valves respectively installed on a plurality of first pipes through which a supply fluid flows and configured to control opening and closing of the plurality of first pipes, a manifold including a second pipe connected to each of the plurality of valves and supplying a control gas to the plurality of valves, and a flow rate controller installed on the second pipe to adjust a flow rate of the control gas flowing through the second pipe, wherein the plurality of valves include at least one of a normal open (NO) type valve and a normal close (NC) valve.