公开(公告)号：US09246408B2

公开(公告)日：2016-01-26

申请号：US14122800

申请日：2012-05-22

申请人： Ken Maeda ,  Toshiya Satoh ,  Hiroyuki Yamai

发明人： Ken Maeda ,  Toshiya Satoh ,  Hiroyuki Yamai

IPC分类号： H02M7/537 ,  H02M7/5387 ,  H02M7/00 ,  H05K7/14

CPC分类号： H02M7/5387 ,  H02M7/003 ,  H05K7/1432

摘要： The power conversion apparatus includes an inverter circuit which converts a DC current into an AC current and have a U-phase, V-phase, and w-phase power semiconductor modules, and a capacitor module for smoothing the DC current. Each of the power semiconductor modules is configured separately and connected to a first bus bar. The first bus bar is configured with a first positive side bus bar, a first negative side bus bar, and a first insulation member arranged between the first positive side bus bar and the first negative side bus bar. The first bus bar includes a first to third terminals to which the U-phase, V-phase, and W-phase power semiconductor modules are connected, respectively, and a fourth terminal connected to a terminal of the second bus bar protruding from a surface of sealing material of a second bus bar.

摘要翻译： 电力转换装置包括将DC电流转换为AC电流并具有U相，V相和w相功率半导体模块的逆变器电路以及用于平滑DC电流的电容器模块。 每个功率半导体模块分别配置并连接到第一母线。 第一汇流条配置有第一正侧汇流条，第一负侧汇流条和布置在第一正侧汇流条和第一负侧汇流条之间的第一绝缘构件。 第一母线包括分别连接有U相，V相和W相功率半导体模块的第一至第三端子，以及连接到从表面突出的第二母线的端子的第四端子 的第二母线的密封材料。

公开(公告)号：US20140118934A1

公开(公告)日：2014-05-01

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

公开(公告)号：US20140085955A1

公开(公告)日：2014-03-27

申请号：US14122800

申请日：2012-05-22

申请人： Ken Maeda ,  Toshiya Satoh ,  Hiroyuki Yamai

发明人： Ken Maeda ,  Toshiya Satoh ,  Hiroyuki Yamai

IPC分类号： H02M7/5387

CPC分类号： H02M7/5387 ,  H02M7/003 ,  H05K7/1432

摘要： The power conversion apparatus includes an inverter circuit which converts a DC current into an AC current and have a U-phase, V-phase, and w-phase power semiconductor modules, and a capacitor module for smoothing the DC current. Each of the power semiconductor modules is configured separately and connected to a first bus bar. The first bus bar is configured with a first positive side bus bar, a first negative side bus bar, and a first insulation member arranged between the first positive side bus bar and the first negative side bus bar. The first bus bar includes a first to third terminals to which the U-phase, V-phase, and W-phase power semiconductor modules are connected, respectively, and a fourth terminal connected to a terminal of the second bus bar protruding from a surface of sealing material of a second bus bar.

摘要翻译： 电力转换装置包括将DC电流转换为AC电流并具有U相，V相和w相功率半导体模块的逆变器电路以及用于平滑DC电流的电容器模块。 每个功率半导体模块分别配置并连接到第一母线。 第一汇流条配置有第一正侧汇流条，第一负侧汇流条和布置在第一正侧汇流条和第一负侧汇流条之间的第一绝缘构件。 第一母线包括分别连接有U相，V相和W相功率半导体模块的第一至第三端子，以及连接到从表面突出的第二母线的端子的第四端子 的第二母线的密封材料。

公开(公告)号：US20120087095A1

公开(公告)日：2012-04-12

申请号：US13266675

申请日：2010-04-16

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Hideaki Ishikawa

IPC分类号： H05K7/20 ,  H05K5/04

CPC分类号： H01L23/467 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L2200/10 ,  B60L2200/26 ,  B60L2200/32 ,  B60L2200/36 ,  B60L2220/12 ,  B60L2220/14 ,  B60L2240/36 ,  B60L2240/525 ,  C25D11/08 ,  C25D11/10 ,  C25D11/12 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  Y02T10/6217 ,  Y02T10/6239 ,  Y02T10/7077 ,  H01L2924/00

摘要： A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.

摘要翻译： 根据本发明的电源模块包括：用于通过切换操作将DC电流转换成AC电流的半导体元件; 半导体元件电连接的电气布线板，半导体元件设置在其主表面之一上; 绝缘树脂层，设置在所述电气布线板的另一个主表面上; 第一绝缘层，与所述电布线板相对设置，由所述绝缘树脂层隔开，并且与所述绝缘树脂层接合; 第二绝缘层，与绝缘树脂层相对设置，由第一绝缘层隔开，并且确保半导体元件的电绝缘; 以及金属散热构件，其与所述第一绝缘层相对设置，由所述第二绝缘层隔开，并且经由所述电布线板，所述绝缘树脂层，所述第一绝缘层和所述第二绝缘层辐射由所述半导体元件产生的热量 第二绝缘层。

公开(公告)号：US20110249421A1

公开(公告)日：2011-10-13

申请号：US13126410

申请日：2009-10-26

申请人： Takeshi Matsuo ,  Kinya Nakatsu ,  Toshiya Satoh ,  Ken Maeda

发明人： Takeshi Matsuo ,  Kinya Nakatsu ,  Toshiya Satoh ,  Ken Maeda

IPC分类号： H05K7/00 ,  H02P6/00

CPC分类号： H01G17/00 ,  B60K1/02 ,  B60K6/445 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2200/26 ,  B60L2220/14 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49111 ,  H02M7/003 ,  H02P6/00 ,  H02P6/14 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/6239 ,  Y02T10/645 ,  Y02T10/7022 ,  Y02T10/7077

摘要： A power conversion device for a vehicle includes: a power module that includes a switching device and, upon operation of the switching device, converts DC power into AC power to be supplied to an electric machine for driving a vehicle; a capacitor module that includes a smoothing capacitor element, an input-side power source terminal for receiving DC power, and an output-side power source terminal for supplying DC power to the power module; and a noise removal capacitor for removing noise, wherein: the noise removal capacitor is built in the capacitor module, and the noise removal capacitor is electrically connected to the input-side power source terminal in a position where a distance between a connection position of the noise removal capacitor and the input-side power source terminal is less than a distance between a connection position of the noise removal capacitor and the output-side power source terminal of the capacitor module.

摘要翻译： 一种用于车辆的电力转换装置，包括：功率模块，其包括开关装置，并且在所述开关装置的动作时，将直流电力转换为交流电力，供给到用于驱动车辆的电动机器; 包括平滑电容器元件的电容器模块，用于接收直流电力的输入侧电源端子和用于向功率模块提供直流电力的输出侧电源端子; 以及用于消除噪声的噪声消除电容器，其中：噪声消除电容器内置在电容器模块中，并且噪声消除电容器在输入侧电源端子的连接位置之间的距离处电连接到输入侧电源端子 噪声消除电容器和输入侧电源端子小于噪声去除电容器的连接位置和电容器模块的输出侧电源端子之间的距离。

公开(公告)号：US07978471B2

公开(公告)日：2011-07-12

申请号：US12388910

申请日：2009-02-19

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

摘要翻译： 电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括 直流正极端子，直流负极端子和突出到外部的交流电流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

公开(公告)号：US20110085821A1

公开(公告)日：2011-04-14

申请号：US12923373

申请日：2010-09-17

申请人： Toshiya Satoh

发明人： Toshiya Satoh

IPC分类号： G03G15/00

CPC分类号： G03G21/08 ,  G03G21/1623 ,  G03G21/1661 ,  G03G21/1671 ,  G03G21/169 ,  G03G2221/1618

摘要： An image forming apparatus includes an image carrier, a developing device that forms a toner image on the surface of the image carrier, a transfer unit that transfers the toner image formed on the image carrier onto a transfer material such as paper, a neutralizing unit that neutralizes an electrostatic latent image on the surface of the image carrier by light radiation, a cleaning unit that cleans toner remaining on the surface of the image carrier after the toner image is transferred. The image carrier, the developing device, the transfer unit, the neutralizing unit, and the cleaning unit are provided to the main body of the image forming apparatus. The image forming apparatus further includes a withdrawal mechanism that withdraws at least the image carrier, the cleaning unit, and the neutralizing unit integrally from the main body of the image forming apparatus.

摘要翻译： 图像形成装置包括图像载体，在图像载体的表面上形成调色剂图像的显影装置，将形成在图像载体上的调色剂图像转印到诸如纸张的转印材料上的转印单元，中和单元， 通过光辐射来中和图像载体表面上的静电潜像，清洁单元，其在调色剂图像转印之后清洁残留在图像载体表面上的调色剂。 图像载体，显影装置，转印单元，中和单元和清洁单元设置在图像形成装置的主体上。 图像形成装置还包括从图像形成装置的主体一体地缩回至少图像载体，清洁单元和中和单元的抽出机构。

公开(公告)号：US06888230B1

公开(公告)日：2005-05-03

申请号：US09429297

申请日：1999-10-28

申请人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L23/12 ,  H01L21/301 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/50 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3171 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/00012

摘要： Semiconductor devices, semiconductor wafers, and semiconductor modules are provided, wherein: the semiconductor device has a small warp; damage at the chip edge and cracks occurring in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor includes a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on the same plane.

摘要翻译： 提供半导体器件，半导体晶片和半导体模块，其中：半导体器件具有小的翘曲; 几乎不产生芯片边缘的损伤和在滴下试验中发生的裂纹; 半导体装置的安装可靠性和大规模生产性优异。 该半导体包括半导体芯片64; 设置在半导体芯片的形成有电路和电极的平面上的多孔应力缓和层3; 设置在应力缓和层上并与电极连接的电路层2; 和设置在电路层上的外部端子10; 其中在半导体芯片的与应力缓和层相反的平面上形成有机保护膜7，并且应力缓和层，半导体芯片6和保护膜7的各个侧面在外部暴露在外部 飞机

公开(公告)号：US06621154B1

公开(公告)日：2003-09-16

申请号：US09671364

申请日：2000-09-28

申请人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Takao Miwa ,  Akira Nagai ,  Akihiro Yaguchi ,  Ichiro Anjo ,  Asao Nishimura

发明人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Takao Miwa ,  Akira Nagai ,  Akihiro Yaguchi ,  Ichiro Anjo ,  Asao Nishimura

IPC分类号： H01L2329

CPC分类号： H01L23/293 ,  C08L9/02 ,  C08L13/00 ,  C08L63/00 ,  H01L23/485 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2924/0002 ,  H01L2924/09701 ,  C08L2666/08 ,  H01L2224/05552

摘要： A miniature semiconductor apparatus is outstanding in reflow resistance, temperature cycle property, and PCT resistance corresponding to high density packing, high densification, and speeding up of processing. The semiconductor apparatus has at least one stress cushioning layer on a semiconductor element with an electrode pad formed, having a conductor on the stress cushioning layer, having a conductor for conducting the electrode pad and conductor via a through hole passing through the stress cushioning layer between the electrode pad and the conductor, having an external electrode on the conductor, and having a stress cushioning layer in an area other than the area where the external electrode exists and a conductor protection layer on the conductor, wherein the stress cushioning layer includes crosslinking acrylonitrile-butadiene rubber having an epoxy resin which is solid at 25° C. and a carboxyl group.

摘要翻译： 一种微型半导体装置在耐回流性，温度循环特性以及PCT电阻方面具有突出优点，其对应于高密度填料，高密度化和加工加速。 所述半导体装置具有在半导体元件上具有至少一个应力缓冲层，所述至少一个应力缓冲层具有形成有电极焊盘的电极焊盘，所述电极焊盘在所述应力缓冲层上具有导体，所述导体用于通过穿过所述应力缓冲层的通孔 所述电极焊盘和所述导体在导体上具有外部电极，并且在外部电极存在的区域以外的区域和在导体上具有导体保护层的应力缓冲层，其中应力缓冲层包括交联丙烯腈 丁二烯橡胶，其具有在25℃下为固体的环氧树脂和羧基。

公开(公告)号：US06348741B1

公开(公告)日：2002-02-19

申请号：US09675011

申请日：2000-09-29

申请人： Masahiko Ogino ,  Takao Miwa ,  Toshiya Satoh ,  Akira Nagai ,  Tadanori Segawa ,  Akihiro Yaguchi ,  Ichiro Anjo ,  Asao Nishimura ,  Takumi Ueno

发明人： Masahiko Ogino ,  Takao Miwa ,  Toshiya Satoh ,  Akira Nagai ,  Tadanori Segawa ,  Akihiro Yaguchi ,  Ichiro Anjo ,  Asao Nishimura ,  Takumi Ueno

IPC分类号： H01L2348

CPC分类号： H01L23/3171 ,  H01L23/293 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A manufacturing method makes it possible to produce a semiconductor apparatus which is outstanding in mounting reliability at a high manufacturing yield rate. A semiconductor apparatus, in which, on the surface of a semiconductor chip with a circuit and an electrode formed thereon, a stress cushioning layer is provided, except for a part where the electrode is, has a wiring layer connected to the electrode on the stress cushioning layer, an external protection film on the wiring layer and stress cushioning layer, a window where a part of the wiring layer is exposed at a predetermined location of the external protection film, and an external electrode which is electrically connected to the wiring layer via the window. The stress cushioning layer, wiring layer, conductor, external protection film, and external electrode are formed on the inside of the end of the semiconductor chip.

摘要翻译： 制造方法使得可以以高的制造成品率制造突出的安装可靠性的半导体装置。 一种半导体装置，其中在其上形成有电路和电极的半导体芯片的表面上设置有应力缓冲层，除了电极的部分具有连接到电极上的布线层的应力 缓冲层，布线层上的外部保护膜和应力缓冲层，布线层的一部分在外部保护膜的预定位置露出的窗口，以及外部电极，其与布线层电连接，经由 窗户。 应力缓冲层，布线层，导体，外部保护膜和外部电极形成在半导体芯片的端部的内侧。