公开(公告)号：US09125328B2

公开(公告)日：2015-09-01

申请号：US13425692

申请日：2012-03-21

申请人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： F21V7/00 ,  H05K3/28 ,  H01L33/54 ,  H01L33/60

CPC分类号： H05K3/285 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49146 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

摘要翻译： 一种制造多芯片封装结构的方法包括：提供衬底本体; 将多个发光芯片放置在基板主体上，其中发光芯片电连接到基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定室温下自然干燥周围液体胶体的外层，以形成半干燥的周围光反射框架，其中半干燥的周围光反射框架具有设置在基板主体上的非干燥环绕胶体， 胶体完全覆盖不干胶体周边胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半透明周围的光反射框架接触并包围封装胶体。

公开(公告)号：US08899789B2

公开(公告)日：2014-12-02

申请号：US13587892

申请日：2012-08-16

申请人： Chia-Tin Chung ,  Shih-Neng Tai

发明人： Chia-Tin Chung ,  Shih-Neng Tai

IPC分类号： F21V23/06 ,  F21V19/00 ,  F21Y101/02 ,  H01L33/60 ,  H01L25/075 ,  F21Y105/00 ,  F21Y113/00

CPC分类号： F21V19/003 ,  F21V23/06 ,  F21Y2105/12 ,  F21Y2105/18 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.

摘要翻译： 灯模块包括盖结构，电路板结构和多芯片封装结构，并且电路板结构和多芯片封装结构依次组装在盖结构的底侧上。 盖结构包括盖体，设置在盖主体的底侧上的多个定位元件和设置在盖主体的底侧上的多个保持元件。 盖体具有通孔和形成在通孔的内表面上的周围的光反射表面。 电路板结构设置在盖体的底侧，并且包括布置在电路板结构的底侧上的多个导电针。 多芯片封装结构设置在盖主体的底侧上并与电路板结构电连接。

公开(公告)号：US08779660B2

公开(公告)日：2014-07-15

申请号：US13239679

申请日：2011-09-22

申请人： Chia-Tin Chung ,  Shih-Neng Tai

发明人： Chia-Tin Chung ,  Shih-Neng Tai

IPC分类号： H01J63/04

CPC分类号： A01G7/045 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/0857 ,  Y02P60/149 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module. The control unit includes a first PWM control module electrically connected to the first current-limiting chip, a second PWM control module electrically connected to the second current-limiting chip, and a third PWM control module electrically connected to the third current-limiting chip.

摘要翻译： 用于增强植物生长的照明装置包括基板单元，发光单元，限流单元和控制单元。 基板单元包括基板主体。 发光单元，限流单元和控制单元设置在基板主体上。 发光单元包括第一发光模块，第二发光模块和第三发光模块。 电流限制单元包括电连接到第一发光模块的第一限流芯片，电连接到第二发光模块的第二限流芯片和电连接到第三发光模块的第三限流芯片 发光模块。 控制单元包括电连接到第一限流芯片的第一PWM控制模块，与第二限流芯片电连接的第二PWM控制模块，以及与第三限流芯片电连接的第三PWM控制模块。

公开(公告)号：US08672517B2

公开(公告)日：2014-03-18

申请号：US13452752

申请日：2012-04-20

申请人： Chia-Tin Chung ,  Shen-Ta Yang

发明人： Chia-Tin Chung ,  Shen-Ta Yang

IPC分类号： F21V29/00 ,  H01L23/34

CPC分类号： F21V7/048 ,  F21K9/00 ,  F21V5/04 ,  F21V7/0008 ,  F21V13/02 ,  F21V15/01 ,  F21V17/12 ,  F21V19/0035 ,  F21V29/503 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.

摘要翻译： 发光模块包括散热结构，多芯片封装结构和保护盖结构。 多芯片封装结构设置在散热结构上，多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 保护盖结构设置在散热结构上以覆盖和保护多芯片封装结构，并且保护盖结构具有用于暴露封装单元的开口。

公开(公告)号：US08288777B2

公开(公告)日：2012-10-16

申请号：US12654319

申请日：2009-12-17

申请人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

发明人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H05K3/244 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.

摘要翻译： 用于增加散热和发光效率的LED封装结构包括基板单元，合金单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，第一导电焊盘，第二导电焊盘和芯片放置焊盘。 合金单元在芯片放置垫上形成Ni / Pd合金。 发光单元具有通过固化的焊球或胶水定位在合金单元的Ni / Pd合金上的LED芯片。 导电单元具有两根导线，并且LED芯片分别通过两条导线电连接到第一导电焊盘和第二导电焊盘。 封装单元具有形成在基板主体的顶表面上的透光封装凝胶体，以覆盖发光单元和导电单元。

公开(公告)号：US20110057217A1

公开(公告)日：2011-03-10

申请号：US12654319

申请日：2009-12-17

申请人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

发明人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H05K3/244 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.

摘要翻译： 用于增加散热和发光效率的LED封装结构包括基板单元，合金单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，第一导电焊盘，第二导电焊盘和芯片放置焊盘。 合金单元在芯片放置垫上形成Ni / Pd合金。 发光单元具有通过固化的焊球或胶水定位在合金单元的Ni / Pd合金上的LED芯片。 导电单元具有两根导线，并且LED芯片分别通过两条导线电连接到第一导电焊盘和第二导电焊盘。 封装单元具有形成在基板主体的顶表面上的透光封装凝胶体，以覆盖发光单元和导电单元。

公开(公告)号：US20070031700A1

公开(公告)日：2007-02-08

申请号：US11462038

申请日：2006-08-02

申请人： Tzung-Fang Guo ,  Fuh-Shun Yang ,  Ten-Chin Wen ,  Yaw-Shyan Fu ,  Ruey-Min Chen ,  Chia-Tin Chung ,  Chin-In Wu

发明人： Tzung-Fang Guo ,  Fuh-Shun Yang ,  Ten-Chin Wen ,  Yaw-Shyan Fu ,  Ruey-Min Chen ,  Chia-Tin Chung ,  Chin-In Wu

IPC分类号： H01L51/54 ,  H05B33/12

CPC分类号： H01L51/5092 ,  H01L51/0037 ,  H01L51/0038 ,  H01L51/004

摘要： An organic light emitting diode (OLED) includes a substrate, a first electrode layer, an organic emitting layer, a second electrode layer, and an electron injection layer, in which the electron injection layer is selected from an electron injection layer made from organic molecules, an electron injection layer with nano-grade thickness, or an electron injection layer having dipole moment organic molecules with nano-grade thickness. By utilizing the conformation of the electron injection layer, an OLED having stable operation can be achieved.

摘要翻译： 有机发光二极管（OLED）包括基板，第一电极层，有机发光层，第二电极层和电子注入层，其中电子注入层选自由有机分子制成的电子注入层 ，具有纳米级厚度的电子注入层，或具有纳米级厚度的偶极矩有机分子的电子注入层。 通过利用电子注入层的构象，可以实现具有稳定操作的OLED。

公开(公告)号：US20050170075A1

公开(公告)日：2005-08-04

申请号：US11070971

申请日：2005-03-02

申请人： Chia-Tin Chung

发明人： Chia-Tin Chung

IPC分类号： H05B33/10 ,  C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  H01L51/40 ,  H01L51/50 ,  H01L51/56 ,  B05D5/06 ,  B05D5/12

CPC分类号： C23C14/243 ,  C23C14/042 ,  H01L51/001 ,  H01L51/56

摘要： In evaporating thin film used in organic electro-luminescent (EL) display, a mask having a plurality of openings is placed below a display substrate, and a plane evaporation source is placed below the mask. The plane evaporation source has a plurality of evaporating material cells which are respectively aligned to the openings of the mask. Next, evaporating the evaporating material cells, a plurality of thin films is deposited on predetermined regions of the display substrate.

摘要翻译： 在蒸发用于有机电致发光（EL）显示器的薄膜中，将具有多个开口的掩模放置在显示基板下方，并将平面蒸发源放置在掩模下方。 平面蒸发源具有分别与面罩的开口对准的多个蒸发材料单元。 接下来，蒸发蒸发材料单元，多个薄膜沉积在显示基板的预定区域上。

公开(公告)号：US06669856B2

公开(公告)日：2003-12-30

申请号：US09731314

申请日：2000-12-05

申请人： Chia-Tin Chung ,  Su-Jen Chang ,  Andrea Hwang ,  Chen-Ze Hu

发明人： Chia-Tin Chung ,  Su-Jen Chang ,  Andrea Hwang ,  Chen-Ze Hu

IPC分类号： H05B3310

CPC分类号： H01L51/0002 ,  H01L27/3283

摘要： An organic electroluminescent display apparatus and method for manufacturing same is disclosed; the method prevents the anode and the cathode from defects and short circuit, and with the suitable geometry of the electrical insulation ramparts, the mechanical properties of the cathode insulating ramparts are increased such that the adhesion between the cathode insulating ramparts and the substrate is enhanced.