公开(公告)号：US07517722B2

公开(公告)日：2009-04-14

申请号：US11491746

申请日：2006-07-24

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

摘要： An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

摘要翻译： 电子部件和坯件具有第一和第二塑料层的塑料包埋化合物。 半导体芯片以这样的方式嵌入第一塑料层中，使得它们的边缘被珠子包围。 第二塑料层补偿第一塑料层的上边界的不均匀性。

公开(公告)号：US07452747B2

公开(公告)日：2008-11-18

申请号：US11501913

申请日：2006-08-10

申请人： Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

发明人： Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

IPC分类号： H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.

摘要翻译： 半导体封装包括：衬底，其包括多个导电迹线和其上表面上的上接触区域，以及在其底表面上的第二多个下导电迹线和外部接触区域以及附接到外部接触区域的外部导电构件。 半导体封装还包括半导体管芯，其包括具有多个管芯接触焊盘的有源表面，其通过导电构件电连接到衬底的接触区域。 半导体管芯的有源表面上的导电构件之间的支撑层至少覆盖导电构件的基部。 一种方法涉及半导体封装的制造。

公开(公告)号：US20080265367A1

公开(公告)日：2008-10-30

申请号：US11996604

申请日：2005-08-24

申请人： Ai Min Tan ,  Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim

发明人： Ai Min Tan ,  Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim

IPC分类号： H01L29/00 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81122 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2224/05599

摘要： An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.

摘要翻译： 集成电路器件包括具有多个芯片接触焊盘的有源表面的半导体芯片，重新布线基板和用于将半导体芯片与重新布线基板磁性对准的导电电感线圈。

公开(公告)号：US07276783B2

公开(公告)日：2007-10-02

申请号：US10484443

申请日：2002-07-31

申请人： Bernd Goller ,  Robert Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L23/02

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/83104 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

摘要： An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

摘要翻译： 具有塑料封装的电子部件及其制造方法包括半导体芯片。 塑料包装的下侧有外部触点。 外部触点通过半导体芯片的接触柱和布置在塑料封装模塑料上的布线连接到半导体芯片的有源上侧的接触区域。 在这种情况下，接触柱代表接触区域的导电高度。

公开(公告)号：US20070120268A1

公开(公告)日：2007-05-31

申请号：US11331820

申请日：2006-01-13

申请人： Roland Irsigler ,  Harry Hedler ,  Bernd Goller ,  Gerald Ofner

发明人： Roland Irsigler ,  Harry Hedler ,  Bernd Goller ,  Gerald Ofner

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component includes a substrate having contacts and a chip having contacts and a passivation layer disposed on an active side of the chip. The active side of the chip is mounted on a first surface of the substrate by flip chip technology such that the contacts of the chip are electrically connected to the contacts of the substrate by means of connecting elements. Elastic elevations are disposed between the contacts of the chip and the contacts of the substrate and an underfiller is disposed in an intermediate space between the chip and the substrate and between the elastic elevations. The underfiller and the elastic elevations have substantially the same modulus of elasticity.

摘要翻译： 电子部件包括具有触点的基板和具有触点的芯片以及设置在芯片的有源侧上的钝化层。 通过倒装芯片技术将芯片的有源侧安装在基板的第一表面上，使得芯片的触点通过连接元件电连接到基板的触点。 弹性凸起设置在芯片的触点和基板的触点之间，并且底部填充物设置在芯片和基板之间以及弹性高度之间的中间空间中。 底部填充物和弹性凸起具有基本上相同的弹性模量。

公开(公告)号：US20060270163A1

公开(公告)日：2006-11-30

申请号：US11429433

申请日：2006-05-08

申请人： Gerald Ofner ,  Ai Tan ,  Mary Teo

发明人： Gerald Ofner ,  Ai Tan ,  Mary Teo

IPC分类号： H01L21/00 ,  H01L21/8234 ,  H01L23/48

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01014 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.

摘要翻译： 半导体芯片包括布置在半导体芯片的有源顶侧的接触表面上的倒装芯片触点。 接触表面被覆盖有源顶侧的钝化层围绕，同时留下暴露的接触表面。 钝化层包括围绕接触表面的加厚部分。 在半导体芯片封装期间，在接触表面周围形成有加厚部分的半导体芯片被保护，防止分层以形成半导体器件。

公开(公告)号：US06683374B2

公开(公告)日：2004-01-27

申请号：US10232172

申请日：2002-08-30

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

摘要翻译： 电子部件具有至少第一半导体芯片模块，第二半导体芯片模块和用于容纳半导体芯片模块的基板。 在这种情况下，两个半导体芯片模块的有源芯片表面均具有中心接触区域，这些中心接触区域彼此相对配置。 形成在中心接触区域上并彼此对应的各个焊接区域彼此相对并且彼此对准并且导电连接。

公开(公告)号：US20080122053A1

公开(公告)日：2008-05-29

申请号：US12025556

申请日：2008-02-04

申请人： Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim ,  Khoon Lam Chua

发明人： Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim ,  Khoon Lam Chua

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/00

摘要： A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.

摘要翻译： 形成诸如倒装芯片封装的集成电路封装的方法，其中在芯片或管芯之间的封装的中心区域中的底部填充材料和其上安装有芯片或管芯的基板之间提供空隙。 这减少了包装由于水分而导致的分层。

公开(公告)号：US07045881B2

公开(公告)日：2006-05-16

申请号：US09993266

申请日：2001-11-19

申请人： Robert-Christian Hagen ,  Gerald Ofner

发明人： Robert-Christian Hagen ,  Gerald Ofner

IPC分类号： H01L23/552

CPC分类号： H05K1/0218 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/3436 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.

公开(公告)号：US06940156B2

公开(公告)日：2005-09-06

申请号：US10673968

申请日：2003-09-29

申请人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

发明人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

IPC分类号： H01L23/485 ,  H01L23/02

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.

摘要翻译： 电子模块包含具有柔性芯片触点的半导体芯片。 柔性芯片触点设置在最上面的金属化层上并且具有尺寸稳定的接触板，其通过弹性体嵌入化合物中的导电部件连接到最上面的金属化层上的接触表面。