中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

74 records (took 0.023 seconds)

    Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
    34.
    发明申请
    Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 有权
    用于封装的微电子成像器的间隔器以及制造和使用间隔件用于成像器的晶片级封装的方法

    公开(公告)号：US20060234422A1

    公开(公告)日：2006-10-19

    申请号：US11451398

    申请日：2006-06-13

    Applicant: Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

    Inventor： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

    IPC: H01L21/00

    CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

    Abstract translation: 包装微电子成像仪和封装的微电子成像仪的方法。 这种方法的实施例可以包括提供具有以模片图案布置的多个成像模具的成像工件，并提供覆盖基板，期望的辐射可以通过该基板传播。 成像器裸片包括耦合到图像传感器的图像传感器和集成电路。 该方法还包括提供具有包括粘合剂并具有布置成与图像传感器对准的开口的腹板的间隔件。 例如，网可以是具有粘合剂涂层的膜，或者网本身可以是一层粘合剂。 该方法通过将成像器工件与盖基板组装成使得（a）间隔件位于成像器工件和盖基板之间，并且（b）开口与图像传感器对准，该方法继续。 在成像器工件和盖基板都已经粘附在卷材上之后，连接的卷材不固化。 因此，纸幅不会将污染物排出到其中容纳图像传感器的隔室中。

    Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
    35.
    发明申请
    Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces 审中-公开
    微电子工件和在微电子工件中形成互连的方法

    公开(公告)号：US20060177999A1

    公开(公告)日：2006-08-10

    申请号：US11056211

    申请日：2005-02-10

    Applicant: David Hembree ,  Charles Watkins ,  Kyle Kirby ,  Steven Oliver ,  Salman Akram ,  Sidney Rigg

    Inventor： David Hembree ,  Charles Watkins ,  Kyle Kirby ,  Steven Oliver ,  Salman Akram ,  Sidney Rigg

    IPC: H01L21/44

    CPC classification number: H01L21/76898

    Abstract: Methods for forming interconnects in blind holes and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having microelectronic dies with integrated circuits and terminals electrically coupled to the integrated circuits. In one embodiment, the method includes forming a blind hole in the workpiece. The blind hole extends from a first exterior side of the workpiece to an intermediate depth in the workpiece. The method continues by forming a vent in the workpiece. The vent is in fluid communication with the blind hole. The method further includes constructing an electrically conductive interconnect in at least a portion of the blind hole.

    Abstract translation: 在这里公开了在盲孔中形成互连件的方法和具有这种互连的微电子工件的方法。 本发明的一个方面涉及一种用于制造微电子工件的方法，所述微电子工件具有集成电路和与集成电路电连接的端子的微电子管芯。 在一个实施例中，该方法包括在工件中形成盲孔。 盲孔从工件的第一外侧延伸到工件的中间深度。 该方法通过在工件中形成通气来继续。 排气口与盲孔流体连通。 该方法还包括在盲孔的至少一部分中构造导电互连。

    Methods and apparatuses for transferring heat from stacked microfeature devices
    36.
    发明申请
    Methods and apparatuses for transferring heat from stacked microfeature devices 有权
    用于从堆叠的微特征装置传递热量的方法和装置

    公开(公告)号：US20060044773A1

    公开(公告)日：2006-03-02

    申请号：US11212986

    申请日：2005-08-25

    Applicant: Salman Akram ,  David Hembree

    Inventor： Salman Akram ,  David Hembree

    IPC: H01R12/16

    CPC classification number: H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

    Abstract: Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

    Abstract translation: 本文公开了用于从堆叠的微特征装置传递热量的方法和装置。 在一个实施例中，微特征装置组件包括具有端子的支撑构件和具有由支撑构件承载的第一外部触点的第一微电子模具。 第一外部触点可操作地耦合到支撑构件上的端子。 组件还包括具有集成电路的第二微电子管芯和电耦合到第一外部触点的第二外部触头。 第一模具在支撑构件和第二模具之间。 组件还可以包括在第一模具和第二模具之间的传热单元。 传热单元包括第一传热部分，第二传热部分和第一和第二传热部分之间的间隙，使得第一外部接触部和第二外部接触部与间隙对准。

    Pin-in elastomer electrical contactor and methods and processes for making and using the same
    37.
    发明申请
    Pin-in elastomer electrical contactor and methods and processes for making and using the same 失效
    插入弹性体电接触器及其制造和使用的方法和工艺

    公开(公告)号：US20060043986A1

    公开(公告)日：2006-03-02

    申请号：US10933745

    申请日：2004-09-02

    Applicant: David Hembree

    Inventor： David Hembree

    IPC: G01R31/02

    CPC classification number: G01R1/07371 ,  G01R1/07357

    Abstract: A contactor card assembly for use with a semiconductor substrate. An upper keeper plate and a lower keeper plate each include a number of conductive pins extending therethrough, situated in vias filled with an elastomeric material and extending beyond the keeper plates to contact a substrate for testing. An intermediate keeper plate is situated between the upper and lower keeper plates and includes conductive pivot bars in channels filled with elastomeric material. Each conductive pin contacts a pivot bar on one side thereof to electrically communicate with a corresponding pin on the opposite side. Under compression, variations in the height of contacts on the substrate under test are adjusted for by the movement of the pins and pivoting of the pivot bar in the elastomeric material. Methods and process for creating the keeper plates and semiconductor and testing assemblies are also included in the present invention.

    Abstract translation: 一种与半导体衬底一起使用的接触器卡组件。 上保持板和下保持板各自包括延伸穿过其中的多个导电销，其位于填充有弹性体材料并延伸超过保持板的通孔中以接触用于测试的基板。 中间保持板位于上部和下部保持板之间，并且在通道中包括导电枢转杆，该通道填充有弹性材料。 每个导电针与其一侧的枢轴接触，以与相对侧上的对应销电连通。 在压缩下，通过销的移动和枢转杆在弹性体材料中的枢转来调节被测衬底上的触点高度的变化。 用于产生保持板，半导体和测试组件的方法和方法也包括在本发明中。

    Method of plating
    38.
    发明申请
    Method of plating 审中-公开
    电镀方法

    公开(公告)号：US20050247567A1

    公开(公告)日：2005-11-10

    申请号：US11183419

    申请日：2005-07-15

    Applicant: Salman Akram ,  David Hembree

    Inventor： Salman Akram ,  David Hembree

    IPC: C25D5/08 ,  C25D7/12 ,  C25F7/00 ,  H01L21/00 ,  C25D5/00

    CPC classification number: H01L21/67086 ,  C25D5/08 ,  C25D17/001 ,  C25F7/00 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708

    Abstract: An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate use a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.

    Abstract translation: 用于处理衬底以沉积，清洁或蚀刻衬底上的材料的设备和方法使用附接有多个衬底并带电的第一水平卡盘。 与第一个水平卡盘密切相邻的是一个共同延伸的水平第二卡盘，它在每个基板的所有部分上接收和反射反应溶液。 在反应过程中，两个卡盘基本上浸没在罐内的反应溶液中。 至少一个卡盘从控制臂附接和控制。 在反应过程中，至少一个卡盘以垂直轴线以慢速旋转。 两个卡盘的旋转轴线可以重合，或者轴线可能彼此偏移，和/或一个或两个轴线可能偏离卡盘中心点。 其中一个卡盘也可以相对于另一个卡盘在垂直方向周期性地移动。

Patent Agency Ranking